1、Exemption items排外項目Description of Exemption排外條款內容說明Expiration date失效日期1a.1(Hg)Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):For generallighting purposes 9 mm (e.g. T2): 5 mg用於一般照明之雙端直線型省電燈管中，所使用的汞含量不得超過 (每 個燈管 ):一般壽命之三波長螢光燈，其管徑 9 mm (e.g. T2): 4 mg.用於一般照明之雙端直線型省電燈管中
2、，所使用的汞含量不得超過 (每 個燈管 ):一般壽命之三波長螢光燈，其管徑 17 mm 且 28 mm (例如 T8): 5 mg2011/12/312a.3.2(Hg)Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding(per lamp):Tri-band phosphor with normal lifetime and a tube diameter 17 mm and 28 mm(e.g. T8): 3.5 mg.用於一般照明之雙端直線型省電燈管中，所
3、使用的汞含量不得超過 (每個燈管):一般壽命之三波長螢光燈，其管徑 17 mm 且 28 mm (例如 T8): 3.5 mg2a.4.1(Hg)Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding(per lamp):Tri-band phosphor with normal lifetime and a tube diameter 28 mm (e.g. T12): 5mg.用於一般照明之雙端直線型省電燈管中，所使用的汞含量不得超過 (每個燈管):一般壽命之
4、三波長螢光燈，其管徑 28 mm (例如 T12): 5 mg2011/12/312a.4.2(Hg)Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding(per lamp):Tri-band phosphor with normal lifetime and a tube diameter 28 mm (e.g. T12): 3.5mg.用於一般照明之雙端直線型省電燈管中，所使用的汞含量不得超過 (每個燈管):一般壽命之三波長螢光燈，其管徑 28 mm (例如
5、 T12): 3.5 mg2a.5.1(Hg)Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding(per lamp):Tri-band phosphor with long lifetime ( 25 000 h): 8 mg.用於一般照明之雙端直線型省電燈管中，所使用的汞含量不得超過 (每個燈管):長壽命( 25 000h) 之三波長螢光燈: 8 mg2011/12/312a.5.2(Hg)Mercury in double-capped linear fl
6、uorescent lamps for general lighting purposes not exceeding(per lamp):Tri-band phosphor with long lifetime ( 25 000 h): 5 mg.用於一般照明之雙端直線型省電燈管中，所使用的汞含量不得超過 (每個燈管):長壽命( 25 000h) 之三波長螢光燈: 5 mg2b.1(Hg)Mercury in other fluorescent lamps not exceeding (per lamp):Linear halophosphate lamps withtube 28 mm (
7、e.g. T10 and T12): 10 mg.用於其他螢光燈管中，所使用的汞含量不得超過 (每 個燈管 ):直線型磷酸鹽燈管，其管徑 28 mm(例如 T10 and T12): 10 mg2012/04/132b.2(Hg)Mercury in other fluorescent lamps not exceeding (per lamp):Non-linear halophosphate lamps(all diameters): 15 mg.用於其他螢光燈管中，所使用的汞含量不得超過 (每個燈管):非直線型磷酸鹽燈管 (所有管徑alldiameters): 15 mg2016/04/
8、132b.3(Hg)Mercury in other fluorescent lamps not exceeding (per lamp):Non-linear tri-band phosphorlamps with tube diameter 17 mm (e.g. T9).用於其他螢光燈管中，所使用的汞含量不得超過 (每 個燈管 ):非直線型三波長螢光燈，其管徑 17mm (例如 T9)2b.4(Hg)Mercury in other fluorescent lamps not exceeding (per lamp):Lamps for other general lightingand
9、 special purposes (e.g. induction lamps).用於其他螢光燈管中，所使用的汞含量不得超過 (每個燈管):其他一般照明或者特殊用途燈 (例如:感應燈)3a(Hg)Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL andEEFL) for special purposes not exceeding (per lamp):Short length ( 500 mm).特殊用途之冷陰極螢光燈 (CCFL) 及外部電極螢光燈 (EEFL)，
10、所使用的汞含量不得超過 (每個燈管):較短長度 ( 500 mm)3b(Hg)Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL andEEFL) for special purposes not exceeding (per lamp):Medium length ( 500 mm and 500 mm and 1 500 mm)3c(Hg)Mercury in cold cathode fluorescent lamps and external electrode
11、 fluorescent lamps (CCFL andEEFL) for special purposes not exceeding (per lamp):Long length ( 1 500 mm).特殊用途之冷陰極螢光燈 (CCFL) 及外部電極螢光燈 (EEFL)，所使用的汞含量不得超過 (每個燈管):較長長度 ( 1 500 mm)4a(Hg) Mercury in other low pressure discharge lamps (per lamp).其他低壓放電燈 (每個燈管)4b.1(Hg)Mercury in High Pressure Sodium (vapour)
12、 lamps for general lighting purposes not exceeding(per burner) in lamps with improved colour rendering index Ra 60:P 60，所使用的汞含量不得超過 (每個燈):P 155 W4b.2(Hg)Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding(per burner) in lamps with improved colour rendering inde
13、x Ra 60:155 W 60，所使用的汞含量不得超過 (每個燈):155 W 60:P 405 W.一般照明用途之高壓鈉 (蒸氣) 燈，其演色性指數 Ra 60，所使用的汞含量不得超過 (每個燈):P 405 W4c.1(Hg)Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes notexceeding (per burner):P 405 W.一般照明用途之高壓鈉 (蒸氣) 燈，所使用的汞含量不得超過 (每個燈):P 405 W4d(Hg) Mercury in High P
14、ressure Mercury (vapour) lamps (HPMV).高壓汞 (蒸氣) 燈 (HPMV) 中所含的汞2015/4/134e(Hg) Mercury in metal halide lamps (MH).複金屬燈 (MH) 中所含的汞4f(Hg) Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex.其他未在此附錄中所提及之特殊用途放電燈，其所含之汞5a(Pb) Lead in glass of cathode ray tubes.陰極射線
15、管中的玻璃可含鉛。5b(Pb) Lead in glass of fluorescent tubes not exceeding 0,2 % by weight.螢光管中所含的鉛不得超過其重量之 0.2%6a(Pb)Lead as an alloying element in steel for machining purposes and in galvanized steel containingup to 0,35 % lead by weight.鉛用於加工用途之鋼材及鍍鋅鋼的合金元素之一，其含量最高可達 0.35%。6b(Pb) Lead as an alloying element
16、 in aluminium containing up to 0,4 % lead by weight.鉛在鋁中做為合成份含最高為 0.4%鉛。6c(Pb) Lead as a copper alloy containing up to 4 % lead by weight.銅合金中所含的鉛，最高可達 4%。7a(Pb)Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weightor more lead).高溫熔點焊錫的鉛(如，含超過 85%重百分比的合中的鉛 )。
17、7b(Pb)Lead in solders for servers, storage and storage array systems, network infrastructureequipment for switching, signalling, transmission as well as network management fortelecommunications.在伺服器、貯存器、貯存陣系統中、用於換信號傳輸和傳送的網設備以及通訊網管設備中的鉛。7c.1(Pb)Electrical and electronic components containing lead in
18、a glass or ceramic other than dielectricceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.鉛用於電器及電子元件中之玻璃或陶瓷 (介電陶瓷電容除外) 。例如: 壓電元件或者玻璃/陶瓷複合材料7c.2(Pb) Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher.額定電壓為 125 V A
19、C or 250 V DC 或者更高之介電陶瓷電容中所含的鉛7c.3(Pb)Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 VDC(after that date may be used in spare parts for EEE placed on the market before 1 January2013). 額定電壓低於 125 V AC or 250 V DC 的介電陶瓷電容中所含的鉛(之後僅能適用於 2013年 1 月 1 日前就已置於市場上的電子
20、電機產品之備用零件 )2013/1/17c.4(Pb)Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits ordiscrete semiconductors.積體電路或離散式半導體中，以鋯鈦酸鉛(PZT)為介電材料之電容，其所含的鉛8a(Cd)Cadmium and its compounds in one shot pellet type thermal cut-offs.(after that date may beused in spare part
21、s for EEE placed on the market before 1 January 2012).鎘及鎘化合物可用於溫度保險絲中。(之後僅能適用於 2012 年 1 月 1 日前就已置於市場上的電子電機產品之備用零件)2012/1/18b(Cd) Cadmium and its compounds in electrical contacts.鎘及其化合物可用於電子接點。9(Cr6+)Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system inabsorption refrige
22、rators up to 0,75 % by weight in the cooling solution.六價鉻用於吸收式冷藏櫃碳鋼冷卻系統中的防腐蝕劑，其重量佔冷卻液 0.75%。9a(PBDE) DecaBDE in polymeric applications.聚合使用的 DecaBDE(十溴二苯醚)2008/07/019b(Pb)Lead in bearing shells and bushes for refrigerant-containing compressors for heating,ventilation, air conditioning and refrigerat
23、ion (HVACR) applications.冷暖空調設備 (HVACR) 中的軸承殼及軸襯可含鉛。11a(Pb)Lead used in C-press compliant pin connector systems.(May be used in spare parts for EEEplaced on the market before 24 September 2010).C-press 順應針 ( compliant pin) 接器系統中的應用可含鉛。(僅能適用於 2010 年 9 月 24 日前就已置於市場上的電子電機產品之備用零件)11b(Pb)Lead used in ot
24、her than C-press compliant pin connector systems.(after that date may be usedin spare parts for EEE placed on the market before 1 January 2013).除了 C-press 之外的順應針 ( compliant pin) 接器系統中所使用的鉛。 (之後僅能適用於 2013 年1 月 1 日前就已置於市場上的電子電機產品之備用零件 )2013/1/112(Pb)Lead as a coating material for the thermal conducti
25、on module C-ring.(May be used in spareparts for EEE placed on the market before 24 September 2010).導熱模組 C-ring 中的塗布材質可含鉛。( 僅能適用於 2010 年 9 月 24 日前就已置於市場上的電子電機產品之備用零件)2010/9/2413a(Pb) Lead in white glasses used for optical applications.光學應用之玻璃中可含鉛。13b(Cd) Cadmium in filter glasses and glasses used for
26、 reflectance standards.濾光玻璃及用來當做反射率標準片的玻璃中可含鎘。13b(Pb) Lead in filter glasses and glasses used for reflectance standards.濾光玻璃及用來當做反射率標準片的玻璃中可含鉛。14(Pb)Lead in solders consisting of more than two elements for the connection between the pins andthe package of microprocessors with a lead content of more
27、than 80 % and less than 85 % byweight.(after that date may be used in spare parts for EEE placed on the market before 1January 2011). 用於接接腳及封裝後的微處理器的銲錫，若此銲錫為兩種以上之元素組成，則其含鉛量可介於 80%85% 之間。 (之後僅能適用於 2011 年 1 月 1 日前就已置於市場上的電子電機產品之備用零件)2011/1/115(Pb)Lead in solders to complete a viable electrical connect
28、ion between semiconductor die andcarrier within integrated circuit Flip Chip packages.用於積體電路覆晶封裝流程中，為接半導體晶片及載體間，以完成電力結的銲錫可含鉛。16(Pb) Lead in linear incandescent lamps with silicate coated tubes.管狀白熾燈矽酸鹽塗層燈管中的鉛。2013/09/0117(Pb)Lead halide as radiant agent in High Intensity Discharge (HID) lamps used f
29、or professionalreprography applications.用於專業複印設備用之高強度放電燈(HID)中作為發光劑的鹵化鉛。18a(Pb)Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lampswhen used as speciality lamps for diazoprinting reprography, lithography, insect traps,photochemical and curing processes containi
30、ng phosphors such as SMS (Sr,Ba) 2 MgSi 2 O7 :Pb).特殊用途之放電燈，例如用於含二氮化合物之電子翻印、平板印刷、補蟲燈、光化學或樹脂硬化過程，其中含有磷，例如 SMS(Sr,Ba)2MgSi2O7:Pb)，則放電燈中的螢光粉，其鉛作為觸發源，鉛含量可佔 1%或更少。2011/01/0118b(Pb)Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lampswhen used as sun tanning lamps cont
31、aining phosphors such as BSP (BaSi 2 O 5 :Pb).彷日曬之放電燈，其中含有磷，例如 BSP (BaSi2O5:Pb)，則放電燈中的螢光粉，其鉛作為觸發源，鉛含量可佔 1%或更少。19(Pb)Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and withPbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).小型節能燈中含有 PbBiSn-Hg 及 PbInSn-Hg
32、 成分之主要汞合金中的鉛以及含 PbSn-Hg 之輔助汞合金中的鉛。2011/06/0120(Pb)Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used forLiquid Crystal Displays (LCD).液晶顯示器中連接前後平版螢光燈基質的玻璃中的氧化鉛。2011/06/0121.1(Pb)Lead in printing inks for the application of enamels on glasses, such as borosi
33、licate and soda lime glasses.用於硼硅酸鹽玻璃瓷漆的印墨所含的鉛。21.2(Cd)Cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses.用於硼硅酸鹽玻璃瓷漆的印墨所含的鎘。22(Pb)Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre opticcommunication systems un
34、til 31 December 2009.用於光纖通訊系統，以稀土鐵石榴石晶體製成的法拉第旋轉器中作為雜質的鉛，此豁免有效期至2009 年 12 月 31 日止。2009/12/3123(Pb)Lead in finishes of fine pitch components other than connectors with a pitch of 0,65 mm and less.(May be used in spare parts for EEE placed on the market before 24 September 2010).鉛用於細間距零件零件之表面處理，但不包括間距等
35、於或小於 0.65mm 之接器。(僅能適用於2010 年 9 月 24 日前就已置於市場上的電子電機產品之備用零件)2010/9/2424(Pb)Lead in solders for the soldering to machined through hole discoidal and planar array ceramicmultilayer capacitors.通孔盤狀及平面陣列陶瓷多層電容器焊料所含的鉛。25(Pb)LLead oxide in surface conduction electron emitter displays (SED) used in structura
36、l elements,notably in the seal frit and frit ring.表面傳導式電子發射顯示器 (SED) 的構件所用的氧化鉛，尤其是密封玻璃 (seal frit) 及 玻璃環(frit ring) 中。26(Pb)Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.藍黑燈管(BLB)玻璃外罩所含的氧化鉛。2011/06/0127(Pb)Lead alloys as solder for transducers used in high-powered (designated to o
37、perate for severalhours at acoustic power在大功率揚聲器中作為轉換器焊料的鉛合金。2010/09/2428(Cr6+)Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings andfasteners used for corrosion protection and Electromagnetic Interference Shielding in equipmentfalling under category three of Directive
38、 2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July 2007.用於防止腐蝕及預防 WEEE 指令第三類設備(資訊及電信設備)電磁干擾的未著色金屬片及鈕扣的防蝕塗層所含的價鉻(此豁免有效期至 2007 年 7 月 1 日止)。2007/07/0129(Pb)Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive69/493/EEC (*).在第 69
39、/493/EEC 號指令附件 1 第 1、2、3 及 4 分類定義下之水晶玻璃鉛。30(Cd)Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly onthe voice coil in transducers used in high-powered loudspeakers with sound pressure levels of100 dB (A) and more.音壓大於 100 分貝的大功率揚聲器中，與音圈轉換器連接電導體之電氣/機械焊料中的鎘
40、合金。31(Pb)Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquidcrystal displays, design or industrial lighting).無汞平版螢光燈(例如：用於液晶螢幕、設計或工業照明)的焊料中所含的鉛。32(Pb) Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.氬及氪雷射管中，使用
41、於視窗結構的密封玻璃中的氧化鉛。33(Pb)Lead in solders for the soldering of thin copper wires of 100 m diameter and less in powertransformers.變壓器中直徑為 100 微米及以下細銅線所用焊料中的鉛。34(Pb) Lead in cermet-based trimmer potentiometer elements.金屬陶瓷微調電位計中的鉛。35(Cd)Cadmium in photoresistors for optocouplers applied in professional au
42、dio equipment until 31 December 2009.專業音響設備的光耦合器中使用的光敏電阻的鎘，此豁免有效期至 2009 年 12 月 31 日止。2009/12/3136(Hg)Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30mg per display until 1 July 2010.)直流電漿顯示器中陰極濺射抑製劑中的汞，其含量不得超過 30 毫克 /顯示器，此豁免有效期至 2010年 7 月 1 日止。2010/07/0137
43、(Pb) Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.以硼酸鋅玻璃體為基礎的高壓二極體的電鍍層的鉛。38(Cd) Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.使用氧化鈹與鋁鍵結製成的厚膜塗料中的鎘和氧化鎘。39(Cd)Cadmium in colour-converting II-VI LEDs ( 10 g Cd per mm2
44、 of light-emitting area) for use insolid state illumination or display systems until 1 July 2014.應用於固態照明或顯示系統中色彩轉換 II-VI 族發光二極管(每平方毫米發光面的鎘含量必須少於10g)中所用的鎘，此項豁免的有效期僅維持至 2014 年 7 月 1 日2014/07/0140(Cd) Cadmium in photoresistors for analogue optocouplers applied in professional audio equipment.專業音響設備中，類比光偶合器之光組內，其所含的鎘2013/12/31
