1、此资料由网络收集而来，如有侵权请告知上传者立即删除。资料共分享，我们负责传递知识。高级硬件工程师英文简历表格?考的材料，毕竟以后的工作都是围绕产品展开。Name：XXXHukou：ShanghaiResidency：ShanghaiWork Experience：Current Salary：Tel：E-mail：www.XXX.comCareer ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired
2、Position：Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork Experience2020/06;Present*CompanyIndustry: Electronics/Semiconductor/ICIntel Flas
3、h Engineering Department Individual Contributor Responsibilities：I have been working in Intel Flash Assembly & Test EngineeringDepartment as an Individual Contributor since June of 2020.Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our e
4、fforts are paid off:The yield of year 2020has been dramatically increased than that of year 2020.The yield of all products, consecutively meets the goal.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2020. Being the Leader of Board Repair Team in
5、ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2020.Report Directly to: Department Man
6、agerNumber of Subordinate: 14Reference: Bao PowelAchievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.Our efforts are paid off:The yield of year 2020has been dramatically increased than that of year 2020.The yield of all products, cons
7、ecutively meets the goal.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2020. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the
8、 roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2020.2020/01;2020/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTD-China Department Electronics Development Engine
9、er Responsibilities：I had been working in STTD-China since Jan 2020to May 2020as a senior module engineer.At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.Report Di
10、rectly to: Hopman MarkNumber of Subordinate: 14Reference: Bao PowelReason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2020.Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed i
11、n developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.2020/05;2020/01Nanyang University of Science & TechnologyIndustry: Electronics/Semiconductor/ICElectronics & Electrical Engineering Department Research Fellow Responsibiliti
12、es：I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.I majored at Gate Oxide Reliability Research in the duration.Report Directly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick LowReason for Leaving: I com
13、pleted the project which I undertook by myself, and want to do more challenging job.Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project Experience2020/01;PresentAssembly NPI (New Product Introduction)Project Description:
14、To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.Responsibility: I am working as NPI Team leader and coord
15、inate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.2020/01;2020/12Marginal Electrical Boards RescueProject Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of boa
16、rd, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.2020/10;20
17、20/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.Responsibility: Being the Project leader, I take the main responsibility, such as, desi
18、gn, plan, organize and implement.2020/05;2020/12Test Yield of Flash memory ImprovementProject Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each p
19、roduct, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training 2020
20、/05;2020/01Nanyang University of Science & Technology Microelectronics DoctorateI worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.2020/03;2020/03Seoul National University of Korea Microelectronics OthersI
21、had been working in National Physical Lab of Seoul National University in Korea since March of 2020to March of 2020as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been success
22、fully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.2020/03;2020/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate2020/09;2020/03Nanjing University of Science & Technology M
23、aterial Science and Engineering MasterBeing a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.2020/09;2020/07Nanjing University of Science & Technology Material Science and Engineering Bachelor2020/07;2020/07Assistant Eng
24、ineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification DepartmentProfessional SkillsLanguage Skills：English: EXCELLENTKorean:AVERAGEComputer Skills：Technology skilled 96MonthSAPunderstanding 8MonthCertificate：2020/11MCSE2020/06CET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.
