1、微电子封装技术Chapter 1 Introduction 第 1 章 简介 1.The development characteristics and trends of microelectronics packaging. 微电子封装的发展特点和趋势。 2. The func tions of microelectronics packaging. 微电子封装的功能。 3. The levels of microelectronics packaging technology. 微电子封装技术水平。 1.4. The methods for chip bonding. 芯片连接的方法 C
2、hapter 2 Chip interconnection technology 第 2 章 芯片互连技术 It is one of the key chapters 它是一个关键的章节 1.The Three kinds of chip interconnection, and their characteristics and applications. 三种芯片互联方法？他们的特点和应用。 2.The types of wire bonding (WB) technology, their characteristics and working principles. WB 技术的种类，
3、特点和工作原理。 3.The working principle and main process of the wire ball bonding. 焊球连接的原理和主要步骤。 4.The major materials for wire bonding. 用于引线键合的主要材料。 5.Tape automated bonding (TAB) technology: 载带自动焊（ TAB）的技术： 1 ）The characteristic and application of TAB technology. （TAB）的技术的特点和应用。 2 ）The key materials and
4、technologies of TAB technology. （TAB）的技术主要材料和技术。 3 ）The internal lead and outer lead welding technology of TAB technology. 内外引线焊接技术6.Flip Chip Bonding (FCB) Technology .倒装焊(FCB) 技术 1 ）The characteristic and application of flip chip bonding technology 倒装焊接技术的特点和应用 2 ） UBM and multilayer metallization
5、 under chip bump ； UBM s structure and material, and the roles of each layer. UBM 和多层金属化在芯片凹凸;UBM 的结构和材料,每一层的角色。3 ） The main fabrication metho d of chip bumps. 芯片凸点制作方法 4 ） FCB technology and its reliability. FCB 技术和它的可靠性。 5 ） C4 soldering technology and its advantages. C4 焊接技术和它的优点。 6 ） The role of
6、 underfill in FCB. 在 FCB 底部填充作用。 7 ）The interconnection principles for Isotropic and anisotropic conductive adhesive respectively. 分别为各向同性和各向异性导电胶互连原则。Chapter 3: Packaging technology of Through-Hole components 第 3 章：通孔元件封装技术 1.The classification of Through-Hole components. 通孔元件的分类。 2.Focused on ： DI
7、P packaging technology, including its process flow. 主要集中在：DIP 封装技术，包括其工艺流程。 3.The characteristic s of PGA. PGA 的特性Chapter 4 Packaging technology of surface mounted device (SMD) 第 4 章 包装技术，表面安装器件（SMD） 1.The advantages and disadvantages of SMD. 贴片的优点和缺点。 2.The types of SMD. SMD 的类型。 3. The main SMD pa
8、ckaging technologies, focused on ： SOP 、 PLCC 、 LCCC 、 QFP. 主要 SMD 封装技术，主要集中在：SOP，QFP，PLCC，LCCC。 4 .The packaging process flow of QFP. QFP 的工艺流程。 5.The risk of moisture absorption in plastic packages, the mechanism of the cracking caused by moisture absorption, and solutions to prevent for such fail
9、ure. 吸收水分的塑料封装中，由吸湿性引起的开裂的机制和解决方案，以防止此类故障的风险。 Chapter 5 Packaging technology of BGA and CSP 第 5 章 BGA 和 CSP 封装技术 1.The characteristics of BGA and CSP. BGA 和 CSP 的特性。 2.The packaging technology for PBGA ,and its process flow.PBGA 封装技术，其工艺流程。 3.The characteristics of packaging technology for CSP. CSP
10、封装技术的特点。 4.The reliability problems of BGA and CSP. BGA 和 CSP 的可靠性问题。Chapter 6 Multi-Chip Module （ MCM ） 第 6 章 多芯片模块（MCM） 1.The classification and characteristics of MCM MCM 的分类及特点 2.The assembly technology of MCM. MCM 组装技术。 Chapter 7 :Electronic packaging materials and substrate technology 第 7 章 电子
11、包装材料和衬底技术 1.The classification of the materials for electronic packaging, the main requirements for packaging materials. 电子包装，主要用于包装材料的要求的材料的分类 2.The types of metals in electronic packaging, and their main applications.电子封装中的金属，它们的主要应用程序的类型。 3.The main requirements for polymer materials in electroni
12、c packaging. 电子封装中的聚合物材料的主要要求。 4.Classification of main substrate materials, and the major requirements for substrate materials. 分类：主基板材料，基体材料的主要要求。 Chapter 8 Microelectronics packaging reliability 第 8 章 微电子封装可靠性 1.The basic concepts of electronic packaging reliability.电子封装的可靠性的基本概念。 2. The basic co
13、ncepts for failure mode and failure mechanism in electronic packaging. 电子封装失效模式和失效机理的基本概念。 3.Main failure (defect) modes (types) of electronic packaging. 主要不合格（缺陷）模式（类型）的电子包装。 4.The purpose and procedure of failure analysis (FA) ； Common FA techniques (such as cross section, dye and pry, SEM, CSAM .
14、). 失效分析（ FA ）的目的和程序;普通的 FA 技术（如横截面，染料和撬，扫描电镜（SEM） ，CSAM . ）5 The purpose and key factors (such as stress level, stress type ) to design accelerated reliability test.设计的目的和关键因素（如应力水平，应力型）加速可靠性 TESChapter 9 Advanced packaging technologies 第 9 章 先进的封装技术 1.The concept of wafer level packaging (WLP) tech
15、nology. 晶圆级封装（WLP）技术的概念。 2.The key processes of WL-CSP. WL-CSP 的关键过程。 3.The concept and types of the 3D packaging technologies. 3D 封装技术的概念和类型。 Specified Subject 1 LED packaging technology 指定的主题 1 LED 封装技术 1.Describe briefly the four ways to achieve LED white light, and how they are packaged ？ 简单地描述了
16、四种方式来实现 LED 白光，以及它们是如何打包 ？ 2.Describe briefly the difference and similar aspects (similarity) between LED packaging and microelectronics packaging. 简要说明 LED 封装及微电子封装之间的差异和类似的方面（相似）3.And also describe briefly the development trend for LED package technology and the whole LED industry respectively.也简单
17、地描述了 LED 封装技术和整个 LED 产业的发展趋势Specified Subject 2 MEMS packaging technology 指定的主题 2 MEMS 封装技术 1.The differences between micro-electro-mechanical system (MEMS) packaging technology and the conventional microelectronics packaging technologies.微机电系统（MEMS）的包装技术和传统的微电子封装技术之间的差异 2.The function requirements of MEMS packaging. MEMS 封装的功能要求。 Extra requirement: 额外要求： The common used terms (Abbreviation) for electronic packaging. 常用术语（缩写）电子封装。
