1、TO BE KEPT SECRETS FROM OUTSIDERS 7 Aug. 2012 Note on the characteristic data given - Data on the characteristics of the products described in this document based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with yo
2、ur usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used. TO BE KEPT SECRETS FROM OUTSIDERS 2 Table of contents 1. COG applications development 1) Fine pitch and particle technology 2) Short time and Low temp. bon
3、ding 2. FOG applications Development 1) Low temp. and short time bonding 2) For approaching IC on FPC bonding 7 Aug. 2012 TO BE KEPT SECRETS FROM OUTSIDERS 7 Aug. 2012 3 Table of contents 1. COG applications development 1) Fine pitch and particle technology 2) Short time and Low temp. bonding 2. FOG
4、 applications Development 1) Low temp. and short time bonding 2) For approaching IC on FPC bonding TO BE KEPT SECRETS FROM OUTSIDERS 7 Aug. 2012 4 Road Map of COG Development for Fine Pitch Item Material Trend of TFT Under developing CP59-seriesCP92-series3Layer FPC standard 2Layer/3Layer FPC standa
5、rd Corrosion Proof High Adhesion Lower Temp. and Short time Bonding CP71-seriesCP75-seriesCP56-seriesCP91-seriesCorrosion Proof 2Layer FPC standard CP97-seriesAcryl resin + CH CH 2 n Curing agents CH 2 CH Radical Heat Acryl resin + CH CH 2 n Curing agents CH 2 CH Radical HeatMin. CP139-series (LA2010-series) Low temp.& High Speed Bonding 150 4sec CP94-seriesCP57-seriesCP12-seriesAcryl Curing System 22 7 Aug. 2012
