1、LED用散熱基板產品 (Taicooler),陆海捷 2010/06/03,1、应用领域细分,2、热阻/热传导测量及基本观念,3、 应用实例测试对比,4、 台虹材料介绍,散熱金屬基板可應用領域,目前最熱門應用領域,其他的應用,1、应用领域细分,LED散熱基板主要應用,Taiflex Taicooler,照明,LED-TV 背光模組,Thickness (L),Thermal conductivity (k)热导 Thermal resistance (R, RA)热阻,T1,T2,Power (P),Thermal resistance Thermal conductivity (ASTM D
2、 5470, Bergquist, Laird),Area (A),T1-T2,R (oC/W) =,P,L,k (W/m-K) =,R x A,3、熱阻/熱傳導測量及基本觀念,L,RA (oC-in2/W) =,k,Gold wire LED Chip Epoxy Dome Lens Pad,Anode,Cathode,High Power LED,自樹脂往大氣,自導線往基板,Substrate (IMS),Junction side,Al substrate side,Thermal image 測試,測量項目： 兩面溫度差 傳熱速率,客戶需求及材料規格測試,Osram 1W LED: (
3、100lm at 350mA,225lm at 1A) Color temp.:6500K 基板台虹(Taicooler):Cu/PI/ad/Al LSAE051020,Supply:3.5V, 0.8A,Supply:3.0V, 0.3A,規格項目,B家 LTI-04503,L家 1KA04,Taiflex,銅厚(Oz.),1,1,1,鋁板厚度(mm),1.6,1.0,1.0,絕緣層厚度(mm),75,102,26,熱傳導率(W/m*K),2.2,3.0,2.0,熱阻抗(in2-oC/W),0.053,0.05,0.056,B家,Taiflex,L家,Thermal image (Junct
4、ion side),Thermal image (Al substrate side),B家,360sec. 108.95oC,210sec. 111.20oC,Taiflex,Thermal image (Al substrate side),210sec. 102oC,210sec. 111.20oC,Taiflex,L家,4、台虹散熱產品功能定位,High power application,Low power application,低熱阻,K3 w/mk 150, B.V.2KV,3W,1W3W,0.5W1W,中熱阻,K:13w/mk 100, B.V.2KV,普通熱阻,k:1w/mk 70, B.V.1.5KV,台虹材料系列介绍,Taicooler,照明,Light-bar,报告结束！谢谢！,
