1、R. Brough TurnerNMS COctober 1, 2003Slide 2A dvanced T CA TM October 1, 2003Acknowledgementsz This tutorial draws heavily on the work of Chuck Byers, Lucent Technologies Jim Kennedy, Intel Mark Overgaard, Pigeon Point Systems Michael Thompson, Pentair/Schroff Henry Wong, Motorolawho jointly presente
2、d a more detailed half-day AdvancedTCA seminar on May 21, 2003, see: http:/www.picmg.org/advancedTCA_Tutorial_0503.stmz I am also indebted to Joe Pavlat, President of PICMG, for diverse content and adviceSlide 3A dvanced T CA TM October 1, 2003Todays Goalz Describe the AdvancedTCA platform, and its
3、applications, in enough detail so that you can make informed decisionsOutlinez AdvancedTCA background and market focusz Technical overviewz Details, details, detailsz Application examplesz Current market statusz Conclusions and Q module power control; electronic keying; active cooling controlSlide 8
4、A dvanced T CA TM October 1, 2003AdvancedTCA Features (cont.)z Telecom centric I/O Multi-protocol support for interfaces up to 40 Gb/s Front-to-back clearances for simultaneous front and rear I/O including fiber bend radii Optional rear transition modules for rear I/Oz Availability scales to 99.999%
5、 or more Single board failure domain Hot swap capability for all boards 11,000 person hours of meetings and conference calls; Untold hours of individual workz Real inter-operable products available today Fifth inter-op workshop held September 2003Slide 11A dvanced T CA TM October 1, 2003Details, Det
6、ails, Details.z Mechanicalz Power could be fiber, coax, signal, etc. Separate keyingz Zone 2 for base interface and fabricz Zone 1 for power and system managementSlide 22A dvanced T CA TM October 1, 2003Backplanez Connector population options depend upon fabric architecturez Full mesh backplane show
7、n hereZone 1, Power N+1 Cooling; 72 hr A/C failure means high ambient temperaturesz 200 W per board with forced air cooling 16 boards in a 12U shelf, 3200 watts/shelf 3 shelves per frame, 10 kW framez Provide framework for interoperability Designer, manufacturer, system integrator Define thermal int
8、erfaces z Provide design guidelinesSlide 30A dvanced T CA TM October 1, 2003Source: PICMGComputational Fluid DynamicsExtensive Simulations Runz Determine “up front” if 200 W per slot was possiblez Followed with flow chamber measurementsz Final design supports Up to 200 W per slot Less than 10 C temperature rise, with 55 C intake air and one failed fan
