1、The fifth chapter:5All kinds of IC Reliability Test and analysisPDF created with pdfFactory Pro trial version Kinds of IC Reliability Test iteml MSL or Pre-condition Testl T/C Test (Temperature Cycling Test)l T/S Test (Thermal Shock Test)l HTST (High Temperature Storage Test)l T&H Test (Temperature
2、& Humidity Test)l THB Test (Temperature, Humidity & Bias Test)l PCT (Pressure Cooker Test)l Un-Bias HAST (Highly Accelerated Stress Test)l HAST (Highly Accelerated Stress Test)l HTOL (High Temperature Operation Life Test / Burn-in)l Data Retention Teat(數據保持測試)l Joint Defect Test(連接點缺陷測試)l Migration
3、Defect Test(移植缺陷測試)l Other TestPDF created with pdfFactory Pro trial version Packing Level Reliability TestT&HHTST/C T/S(option) PCT(option)PRECON TESTUn-biasHASTPDF created with pdfFactory Pro trial version MSL and Pre-conditionl The purpose of MSL (moisture sensitive level) test is:(1) To specify
4、packing method, dry pack or normal pack.(2) To specify the level of pre-condition test.l The purpose of pre-condition test is:(1) To simulate(模擬) the procedure (程序)of shipping, storage and SMD board mount.Reference: JESD22-A113, J-STD-020PDF created with pdfFactory Pro trial version IC Transportatio
5、n EnvironmentDryPackT/CT&HPCBReflow for Soldering220/240/260PDF created with pdfFactory Pro trial version MSL Test Flow & Simulate ItemEXT. Visual INSP & O/S TestSAM InspectionTemperature Cycle Test(-55oC/125oC, 5X)Dry Bake(125oC, 24HRS)Temp & Humidity Test(Level 1,2,2a,3,4,5,6)Reflow(220/235/260oC,
6、 3X)Simulate Temp. Changes during Transportation to customerSimulate Drying Process of silica gel(硅膠凝體) by dry packSimulate Moisture Absorption in Production lineSimulate Soldering ProcessElectrical TestNDT(Non-Destructive Test 非破壞性試驗)using SAMDecisionEXT. Visual INSP & O/S TestSAM InspectionElectri
7、cal TestNDT using SAMPDF created with pdfFactory Pro trial version Moisture Sensitive Level(滲透必要條件)PDF created with pdfFactory Pro trial version Moisture Distribution(濕度分配)Critical Point for Interfacial Moisture(界面濕度臨界點)is Pad Top CornerLevel 3, 30C/60%, 192hr, 20x20x1.4 QFP Min =0.875mg/cm3 Max =2.
8、216 0.875 1.024 1.173 1.322 1.471 1.620 1.769 1.918 2.067 2.216 PDF created with pdfFactory Pro trial version Moisture Absorption & De-sorptionMOISTURE ABSORPTION潮濕吸收0.000.050.100.150.200.250.300.350.400 2448 729612014 168192216240Time(hrs)Moisture(wt %)L3 L2 L1MOISTURE DESORPTION潮氣吸附作用0.000.050.100
9、.150.200.250.300.350.400 6 12 18 24 30 36 42 48Time(hrs)Moisture(wt%)L3 L2 L1PDF created with pdfFactory Pro trial version Defect after MSL/Pre-con. Test1. Package Crack2. Delamination3. Electrical Open/ShortDELAMINATIONPKG CRACKPKG CRACKCHIP CRACKPDF created with pdfFactory Pro trial version Defect
10、 after MSL/Pre-con. TestDie TopDelaminationDie Crack Package CrackPDF created with pdfFactory Pro trial version Factors cause MSL failure1. Moisture Exist Inside PackageLiquid Gas : Volume Expansion 1900X2. CTE Difference in Semiconductor Materials 3. Low Adhesive (低粘接性)btw Semiconductor Materials4.
11、 Low Strength (低應力)of Semiconductor Materials1900XLiquid Gas240deg.CPDF created with pdfFactory Pro trial version MSD control processMaterial ReceiveIncoming inspectionWarehouse storageSMTRepairedProcess Control Item1. Do not open vacuum packing.2. Check is there any damage of vacuum packing.3. If v
12、acuum pack damage, ask buyer inform supplier to rework, or change vacuum bag internally by receiving warehouse ,or base on indicator color to decide baking or not when take off vacuum packing1. Finish incoming inspection within 30 minutes after open vacuum packing, then re-packing again.2. Stick (粘貼
13、)a control label on the bag, to record open/re-packing time for floor life evaluation.1. Check vacuum packing before issue material, no damage, no improper sealing.2. For reel package, one reel as one unit when issue material.3. For tray package, base on MO Qty, issue material within 30 minutes. If
14、open the vacuum packing, its necessary to stick a control label on the bag to record open/repacking time for floor life evaluation.1. Check the indicator immediately when take off vacuum bag. If there is no indicator, check is there any control label from IQC or warehouse.2. Take off vacuum packing
15、on line, and control by components moisture sensitive level.3. Store the MSD component in the moisture-proof cabinet(防潮柜) when line down or SMT machine down time. Record open time & entrance cabinet time on the control label, to evaluate floor life.4. Programming MSD IC within 1 hour. Use tray & vac
16、uum packing after IC programming. Stick a control label on it for floor life evaluation.1. Follow component MSL to bake PCBA before repairing.2. Take of NG IC from PCBA by heat up under the PCBA to avoid ICdelamination.PDF created with pdfFactory Pro trial version Process contentsl Base on indicator
17、 color to decide baking or not when take off vacuum packing.l Baking condition:(1) Tray: use 125C, follow MSL criteria to define baking time.(2) Reel: use 40C, 5%RH, follow MSL criteria to define baking time.l There will be baking condition outside the vacuum bag normally. If there is no definition,
18、 follow the table(4-1) next page to do baking.l Control item of moisture-proof cabinet:(1)Moisture controller should be “ON”.(2)Carton & paper can not put into cabinet.(3)The data of electronic moisture monitor should within specific value.(4)Keep cabinet temperature on 255C, moisture 5%10%RH.PDF cr
19、eated with pdfFactory Pro trial version Reference baking conditionPDF created with pdfFactory Pro trial version Reliability: Bath Curve Design issue Test SPEC Process Deviation Component / Material Application issue Design Margin Component / Material wearPDF created with pdfFactory Pro trial version
20、 Difference between Reliability & Screen100%Sampling, LTPD is typical usedSample SizeBurn-inTemp. CyclingLong term reliability with or without Pre-conditioningTestNondestructiveDestructive(破壞性)RemarkEliminate Early Failure(排除早期失效)Check the Quality performancePurposeScreenReliabilityPDF created with
21、pdfFactory Pro trial version Stress affect ReliabilitylThermal Stress(熱應力)lHumidity Stress(濕度應力)lBias StresslPressure Stress(壓應力)lMechanical Stress(機械應力)lVibration Stress(振動應力)lOthers StressPDF created with pdfFactory Pro trial version Reflow Profile SettingPDF created with pdfFactory Pro trial vers
22、ion Typical Reflow ProfilePDF created with pdfFactory Pro trial version Purpose of T/C & T/STo know the durability ofSemiconductor package resisting expansion and shrinkage by high and low Temperature.PDF created with pdfFactory Pro trial version Temperature Cycle TestTest Conditions:1) Temp : C, +1
23、50 / -65 oCB, +125/ -55oC 2) Time : 15 min/ zone3) Read-out Point : 500,1000 cycles4) Reference: Mil-Std-883, 1010JESD22-A104 Measurement:-Open/Short Test-65 CAir150 CAirT/C ChamberPDF created with pdfFactory Pro trial version Effect of T/C TestEMCCu L/FCu L/F SILICON CHIPWIREEMCCu L/FCu L/F SILICON
24、 CHIPWIREExpansionShrinkage-65 CAir150 CAirT/C ChamberPDF created with pdfFactory Pro trial version Thermal Shock (The 熱沖擊)Test150 C Liquid -65 C LiquidTest Conditions:1) Temp : +150 / -65 deg.C2) Time : 5 min/ zone3) Read-out Point : 1000 cycle4) Reference: JESD22-A106Measurement:-Open/Short TestPD
25、F created with pdfFactory Pro trial version Failure Mode after T/C & T/SFa1) Open or Intermittent(間斷性) Open due to Bond Lift or Ball Neck Broken by the Chip Surface Delamination2) Short due to Die Crack & Passivation(鈍化) Crack.3) Parameter Drift due to Resistance of PN Junction increaseDELAMINATIONC
26、HIP CRACKPDF created with pdfFactory Pro trial version OPEN after T/C & T/SDie Top Delamination& Ball Neck BrokenDelaminationDelaminationBroken Neck(斷頸)PDF created with pdfFactory Pro trial version OPEN Failure Improvement1. Reduce the CTE difference Between EMC & SiChip.(CTE of EMC : CTE of Si= 3 :
27、 1 2 or 1 : 1)2. Coating(覆蓋) SiChip Surface with Gel.DieEMCGel(凝膠體)PDF created with pdfFactory Pro trial version HTST, HTOL & Data RetentionPurpose of HTSTTo know the durability of Semiconductor package when exposed under the high Temperature for long time. Purpose of HTOL & Data RetentionTo know th
28、e durability of Semiconductor Device when exposed under the high Temperature andPower/Signal for long time. Device Level Reliability.PDF created with pdfFactory Pro trial version High Temperature Storage Test150 CN2 gasTest Conditions:1) Temp : 150 deg.C2) Read-out Point : 500, 1000 Hrs3) Reference: JESD22-A103Measurement:-Open/Short TestPDF created with pdfFactory Pro trial version High Temperature Operation LifeTest Conditions:1) Temp : 150 deg.C2) Read-out Point : 500, 1000 Hrs3) Reference: JESD22-A108Measurement:-DC and AC parameter150 CN2 gasPDF created with pdfFactory Pro trial version
