1、 l:2011-08-26;:2011-08-29; “:SE1 S “(50373047,50673096, 51073168,50803068,50903087, 50873104,51011120100,50610305028,50403025);Te: V(1960-), 3,S S ,/ L i ,1999 MSE M1 S,1 5: 0 !9、!、 ?#;Y “ :E-mail:.0 Z杨士勇,范 琳,冀 棉,胡爱军,杨海霞,刘金刚,何民辉(中国科学院化学研究所高技术材料实验室,北京 100190)K1: 0、 0 ?,#s 、 、 ?,t?、t b、 bW/ 5 1N。1 S S
2、 M 5Z。1oM: ; 0; ?; ?引言YPB s 0、 0、 300, P500)K 8( :1600MPa, w 110GPa;371/w 850MPa, w 100GPa。1.3 0426(800) 8 t?、t bf 、 、 4、 1400MPa, w 100GPa;450/w 800MPa, w 80GPa。1.4 0RTM 8 M , S / ?Z p, 7Z a .(ResinTransfer Molding,RTM) 0 8,?Z 0 )RTM 8“ , KHRTM-300、KHRTM-350、KHRTM-400。KHRTM-350 T3008,RTM i/ 8 ?, H3
3、50/ VCs ?, _350/ w 1000MPa,w 100GPa,W - M 35MPa,i LC 350mm,550mmaqRTM。2 耐高温聚酰亚胺超级工程塑料| M8(j 、Y )9 100MPa, % V4GPa; w 120MPa, w 6GPa; 390。V2 VPI ?。V2 V PI ?Table 2 Mechanical propertiesat elevated temperaturesof thehot press-moldedPI engineeringplastics kTV ,250h ) , V5%。 6,HTPI“ s 0 ?,-250Hq/, 1 ? 3
4、 A 。HTPI“ s 0 ?, “ , z1 ?。V3 1 0 ?。1 /PVr1106MPam/min,V/ F 、 F A Y 、 F 2 10100。 / “ 1,1M; VL , l f ? 3 H,HTPI q?T,? 3 、 5 ?v 4 Y#。 6,HTPI s ?, V LC/A8 , P, P P B , V S N Y ?1 p。m2 V ,q“ 。V3 V PI 1 0 ?Table 3 Wearabilityof thehot press-moldedPI engineeringplastics“ / z/mm q10-6 mm3(Nm)-1HTPI-1400 0.3
5、9 3.06 1.40HTPI-1400-C 0.28 3.20 1.60HTPI-1400-G 0.33 2.54 0.80HTPI-1400-F 0.37 3.96 3.03HTPI-1400-M 0.19 2.43 0.70:C:15%8;G:15% F x;F:15% Yx;M:15%= ;。73 10 s 0 Y m2 V PI) ,q“ Figure 2 Photographsof the hot press-molded PI engineering plastic parts2.2 PI) PI) , V d、 D C、 Y B“, n59 176MPa, % 10GPa, w
6、 277MPa, w 13.5GPa;7c30%j 8PI i/ % 135MPa, % 7.5GPa, w 210MPa, w 9.0GPa。m3 V ,q, ! ,qK C0.2mm。m3 V PI) ,qFigure3 Photographsof the high-temperature extruded PI engineering plastic partsPI) Hq :(1) / “ 、 0 ? ,q;(2)s F M M ,q;(3)s1 ? ,q;(4)/A8 ,q;(5) F w、 % F ? ,q;(6) 0 K、 0 、 F 3 ,q;(7) PV300 , r4004
7、50 ,q。 5 : F、D0a300km/h EY“dA 0 T ; ? ! 、M M 1 ; 6, 0 B M ?1o 。 W90 M, ? 0/ 1o ,450nmoi; qV94%。i s 0 ?8 、 ?, A U、 ? 5 -。m5 bW 00 。 B cv ,cv0v / Vs 37V , VrE075 10 s 0 Y m4 i “ Figure 4 Developedtransparent polyimide filmsm5 F0 Figure 5 Chemical structures of the atom oxygen resistant polyimide films
8、 =B S K,V7s bW F0 ?。m6 F0?。0 Y 8.461020atom/cm2/,SKapton PI0 K q3.010-24atom/cm3,7 ! F0PIKapton23%27%, F0 ?4 3.74.4。 PIE bW, Vv4 bWf ( ,Z), :,uk ,S , V.t b ,2007,27(3):6065.26 , ,Z), V.s0,2008,3(5):460465.27 , ,/,Z), V. ,2008,22(6):615619.28 ,Z), , V.s0Y,2010,12:1421.29 V.8/ ,1998,23(6):41.30 3 , ,
9、Y,Z), ,S , V.s0Y,2003,4:1024.32 ,Z), Y, ,S , V.s0Y,2003,5:1727.33 QianZ G,Pang Z Z,LiZ X,He M H,Liu JG,Fan L,Yang S Y.J Polym Sci Part A:Polym Chem,2002,40(17):30123020.34 QianZ G,Ge Z Y,LiZ X,He M H,Liu JG,Pang Z Z,Fan L,Yang S Y.Polymer,2002,43(22):60576063.35 Tao L M,Yang H X,Liu J G,Fan L,Yang S
10、 Y.J PolymSci,Part A:Polym Chem,2010,48:46684680.36 Xie K,Liu J G,Zhou H W,Zhang S Y,He M H,Yang S Y.Polymer,2001,42:7267727.37 Xie K,Zhang S Y,Liu J G,He M H,Yang S Y.J PolymSci,Part A:Polym Chem Ed,2001,39(15):25812590.38 GeZ Y,Yang S Y,Tao Z Q,Liu J G,Fan L.Polymer,2004,45(11):36273635.39 Yang S
11、Y,Ge Z Y,Yin D X,Liu JG,Li Y F,Fan L.JPolym Sci,Part A:Polym Chem,2004,42(17):41434152.40 Li H S,Liu J G,Rui J M,Fan L,Yang S Y.J Polym Sci,Part A:Polym Chem,2006,44(8):26652674.Advances inHighTemperaturePolyimideMaterialsYANG Shi-yong,FAN Lin,JI Mian,HU Ai-jun,YANG Hai-xia,LIU Jin-gang,HE Min-hui(T
12、he Laboratory of Advenced Polymer Materials,Institute of Chemistry ,Chinese Academy of Sciences,Beijing 100190,China)Abstract:Advanced polyimide materials have been extensively used in aerospace, aviation andmicroelectronicindustries due to their outstanding thermal and cryogenic resistance,high mechanicalandelectrical insulatingproperties,and low dielectricconstant and dissipation factor,etc.A review willbegiven in the progressof thehigh temperaturepolyimidematerialsdevelopedin this Laboratory.Keywords:Polyimide;Thermal resistance;Mechanical properties;DielectricalConstant78 s 0 Y 2011 M10
