1、Global Solutions for Complex Parts and Assemblies 汽车电子行业Press-Fit技术 无焊接解决方案 Automotive Press-Fit Technology Solderless Solutions 连接器及堆栈应用 Connectors and Stacking Applications 传感器及控制模块 Molded Sensor & Control Modules 马达及开关控制 Motor & Flapper Controls 总线连接及保险盒 Bus Bar Interconnects & Fuse Receptacles 轮
2、胎压力监控 Tire Pressure Monitors 连接盒 Junction Boxes 引擎及变速器控制 Engine & Transmission Controllers : Interplex Electronic (Hangzhou) Co., Ltd. No.3 Ave.8 HEDA Hangzhou, China Tel: +86 571 8691 3333 Fax: +86 571 8691 2222 t 提供全球性精密零部件生产和组装服务厚度 Press-Fit Thickness 材料 Alloy Options 导电率 Conductivity (IACS) PCB
3、板孔 Nominal PCB Hole Size 磷青铜 Phosphor Bronze 锡黄铜 Tinned Brass 13% to 15% 25% to 30% * 1.020 mm 磷青铜 Phosphor Bronze 锡黄铜 Tinned Brass 高导电合金 High Conductivity Alloy 13% to 15% 25% to 30% 75% to 80% * 1.486 mm World Solutions in Precision Parts and Assemblies 规格参数 Press-Fit Sizes and Technology Copyrigh
4、t 2008 Interplex Industries t : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : :3.8mm3.5mm1.2mm .80mm - Thick .64mm - Thick1.66mm 怡得乐的Press-fit技术是一种无焊接连接Pin技术。它的设计及测试能够达到汽车电子的各项测试要求 （基于IEC,EIA和SAE等国际标准），其中包括振动，机械性能及热冲击（温度高达125）测试。 Interplexs
5、Press-Fit, Solderless Interconnect Technology is designed and tested to meet standard automotive requirements for vibration, mechanical & thermal shock for temperatures up to 125 C, as de ned by the IEC, EIA and SAE. 这种技术允许组装端子与印刷电路板（PCB）电镀通孔进行连接，通过这种技术可以实现一种机械式电 导通与维护而无需使用焊接技术。This technology allow
6、s for the assembly of a terminal or electrical lead to a printed circuit boards (PCB) plated-through hole in such a way that an electrical mechanical connection is created and maintained without the application of solder. In re E 这 导 导 导 a 怡得乐电子Press-Fit无焊接技术特性 Interplexs Press-Fit Solderless Techno
7、logy Features: 无焊接技术设计和测试满足汽车电子要求 Solderless Technology design & tested to meet automotive requirements 采用“针眼”设计 Proven “Eye of the Needle” design 已通过125操作温度的认证,选用合适的合金材料可满足150要求 Quali ed to 125 C operational temperatures with optional 150 C alloys available 符合IEC，EIA和SAE标准 Requirements de ned by IE
8、C, EIA and SAE 已经拥有0.64mm与0.8mm两种厚度规格Press-fit的产品设计 Designs available for both .64mm and .80mm thick press- t sections 采用高导电性能材料 High conductive material options 兼容各种PCB电镀形式 Compatible with various PCB plating types *“应用图纸”定义详细PCB板孔的结构及公差要求 Request “Application Drawings “ for details and tolerances
9、on PCB hole construction. 先进的Press-Fit方案 Advanced Engineered Press-Fit Solutions 公司先期工程技术小组与客户协作，共同开发Press-fit应用方案，如：非连续端子、 连接组装、以及客户注塑件包装与特殊要求的组装。此外，怡得乐还致力于产品设计、 工程应用、生产制造与自动化研究，帮助客户开发适合于任一特殊应用领域的技术解决方案。 The companys Advanced Engineering team works with customers to develop press- t solutions for a
10、pplications such as discrete terminals and connect or assemblies, as well as custom-molded packages and specialized assemblies. In addition, Interplex leverages its expertise in product design, applications engineering, manufacturing and automation to help customers create the proper turnkey solutio
11、n for any particular application. PCB Pressed Onto Contacts in Module Input/Output Connections PCB to Motor Leads Antenna PCB to PCB 概念 Concept 设计 Design 制样 Prototype 产品 Production 机械和环境测试总结 Summary Results of Mechanical and Environmental Tests 此外,公司还可以利用其全球生产制造资源来满足任一区域生产制造或自动化要求。In addition, the c
12、ompany can leverage its global manufacturing resources to meet any regional manufacturingor automation requirements. : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 测试项目 Test Item 规格 Acceptance Criteria 测试内容 Testing for: 结果 Result 0.64mm插入力
13、和保持力 .64mm Insertion & Retention Force 97N-最大插入力 97N-Insertion-Max. 20N-最小保持力 20N-Retention-Min. PCB板孔径在上限和下限值时的插拔力Forces in Upper & Lower Limit Hole Sizes 通过 Pass 0.80mm插入力和保持力 .80mm Insertion & Retention Force 178N-最大插入力 178N-Insertion-Max. 62N-最小保持力 62N-Retention-Min. PCB板孔径在上限和下限值时的插拔力 Forces in
14、 Upper & Lower Limit Hole Sizes 通过 Pass 电镀通孔 PTH Integrity 根据IEC 60352-5 Per IEC 60352-5 电镀通孔的变形 Deformation of Plated Through Hole 通过 Pass 随机振动 Random Vibration 接触电阻增加值 3.0 m 根据IEC, EIA,SAE Increase of Contact Resistance 3.0 m Per IEC, EIA, SAE 接触点的移动 Movement of Contact Points 通过 Pass 热冲击 Thermal
15、Shock 接触点的移动 Movement of Contact Points 通过 Pass 热老化 Thermal Aging 端子和PCB板的应力释放 Stress Relaxation of Terminal and PCB 氧化膜的生长 Growth of Oxide Film 通过 Pass 温湿度循环 Temp/Humidity Cycle 氧化膜的生长 Growth of Oxide Film 通过 Pass 混入流动气体 Mixing Flowing Gas 滚镀影响 E ectiveness of Barrier Plating 通过 Pass 详细测试结果请参阅“测试总结
16、报告” Detail Test “Summary Reports” Available on Request Copyright 2008 Interplex Industries t Press-Fit Technology Automotive Products 汽车电子产品: 怡得乐是一家全球多方位集成制造商，专业提供小型高精密产品及组装件，共有29家工厂分布在全球 11个国家。怡得乐为客户提供从概念到开发以及大批量生产的服务，可用于各个领域。Press-Fit 技术可 设计用于单个金属件冲压，注塑及镶嵌式注塑和组装件，可用于生产电子和机械半成品。 Interplex is a ver
17、tically integrated global manufacturer of small precision parts and assemblies with over 29 worldwide locations in 11 Countries. Interplex o ers complete solutions from concept through development and into scalable high volume production for almost any application requirement. Press-Fit sections can
18、 be designed into discrete metals stampings, molded and overmolded shrouds, housings and assemblies and/or incorporated into complete electronic and mechanical sub-assemblies. 怡得乐全球分布 Interplex Global Locations Americas California: Interplex Nascal Connecticut: Interplex Technologies Florida: Interp
19、lex Proto-Stamp Florida: Interplex Sunbelt Illinois: Interplex Daystar Kentucky: Interplex Plastics Massachusetts: Interplex Etch Logic Massachusetts: Interplex Metal Logic Michigan: Interplex Engineering Center New Jersey: Interplex NAS New Jersey: Interplex Precision Machining New York: Interplex
20、Industries, Inc. Ohio: Interplex Medical Rhode Island: Interplex Automation Rhode Island: Interplex Engineered Products Rhode Island: Interplex Metals Mexico: Interplex Mexico Europe France: Interplex Soprec France: Interplex Microtech Germany: Interplex NAS GmbH Hungary: Interplex Hungary Scotland:
21、 Interplex PMP Asia China: Interplex Electronics (Dalian) China: Interplex Electronics (Hangzhou) China: Interplex Stewart EFI India: Interplex Electronics India Korea: Interplex Quantum Malaysia: Interplex Electronics Malaysia Singapore: Interplex Singapore Interplex Electronic (Hangzhou) Co., Ltd. No.3 Ave.8 HEDA Hangzhou, China Tel: +86 571 8691 3333 Fax: +86 571 8691 2222 t
