1、 PCBA检验规范编 号：版 本：V1.0生效日期：文档说明页1修订情况表修订历史版本 说明 作者 审核 批准 生效日期2术语表术语表名称 说明深圳国人通信有限公司 目录目 录1. 目的(PURPOSE) 12. 范围(SCOPE) .1 3. 名词解释(WORDS EXPLANATION)14. 参考文件(REFERENCE DOCUMENT) 15. 职责(RESPONSIBILITY) .16. 作业流程及内容(Flow chart and content).17. 修订权限(AUTHORITY OF MODIFICATION)28. 附件(ATTACHMENT).28.1 附件一(PC
2、BA).48.2 附件二(机构类).428.3 附件三(其它).52PCBA 检验规范- 1 -PCBA检验规范1 目的(Purpose)建立产品外观目视检验标准, 使产品检验之判定有所依循, 同时藉由检验资料的回馈分析建立良好的 workmanship,防止不良之发生.To establish the standard inspection of product cosmetic for operation to follow, and establish well workmanship by feedback and analyzing the inspection document t
3、o void failure.2 范围(Scope)本规范适用于所有产品(含半成品及成品 PCBA)的外观目视检验, 包含自行生产制造之 PCBA, 委托外包生产制造之 PCBA, 以及外购入厂组立或单独包装出货之 PCBA 等.It fits all product(containing product and PCBA) appearance inspection, including PCBA made by self or by other company and other.3 名词解释(Words explanation)无(None)4 参考文件(Reference docume
4、nt)ANS/IPC-A-610D5 职责(Responsibility)5.1 生产单位(Production unit):负责产品检验之执行.Be responsible for doing product inspection5.2 质量管理部(Quality unit):负责产品规格之制定及产品品质之抽样检验管制Be responsible for making product specification and controlling the spot check of product quality6 作业流程及内容(Flow chart and content )6.1检验前的准
5、备(preparation for inspecting):PCBA 检验规范- 2 -检验前须先确认所使用的工具,材料, 胶,清洁剂等, 是否合乎规定. 检验 PCBA 时必须配戴防静电手套或防静电手环, 而成品有外壳部分则不在此限.Before inspecting, be sure of the tool, material, glue, cleanser, etc. Operator should have wrist strap or electrostatic glove for prevention ESD(Electronic static Discharge ), but t
6、he finished good with。6.2 若有检验标准未规范的异常现象发生时，不代表该产品允收或拒收，应向值班工程师询问。It is not means the product accept or reject that the standard of inspection have some abnormal , but should feed back to engineer to confirm. 6.3 检验环境要求光线充足,以目视为主, 辅以放大镜和卡尺6.4 外观检验项目基准参见附件一三。The item of cosmetic inspection standard r
7、eference Appendix 1 to 3.7 修订权限(Authority of modification)本规范由质量管理部工程师撰写, 经研发单位及生产单位会签, 由质量管理部最高主管核准后实施, 修改程序亦同.This criteria is prepared by Quality unit engineer and signed off with R&D(Research and Develop department )and Production unit, and then approve by Quality manager. Modify procedure as th
8、e same above.8 附件 Attachment ( 含记录表单)8.1 附件一：PCBA Appendix 1: PCBA 8.2 附件二：机构类Appendix 2: Mechanical 8.3 附件三：其它Appendix 3: Other附 件 预 览 总 表PCBA 检验规范- 3 -附件一: PCBA 类附件二: 机构类(Mechanical)附件三: 其它(Other)1 外壳(Housing) 1 标签(Label)2 托架,承座(Chassis) 2 Barcode3 铭板(Overlay) 3 包装袋(PE bag)4 散热片(Heat sink) 4 外箱(Ca
9、rton)5 绝缘片(Insulator) 5 Housing6 螺丝,螺帽,垫片 (Screw nut)1 SMT 零件(SMT component)1-1 焊点规格 (SolderingSPEC)1-2 焊点异常 (Solderingabnormal)1-3 零件损坏 (Component damage)1-4 点胶 (Staking adhesive gluing)7 DC series converter 系列成品外观检验标准8 Transformer9 Shielding cover 外观检验标准2 Dip 零件(DIP component)2-1 焊点规格 (DIP SPEC)2-
10、2 引脚突出 (Lead protrusion)2-3 通孔 (PTH)2-4 插件外观 (Appearance)2-5 点胶 (Adhesive gluing)2-6 DIP 高翘(DIP componentlifted)3 PCB3-1 marking3-2 外观 (Surfaceappearance)3-3 焊锡性 (Solderability)4 Connector, PIN & 金手指(Golden finger)5 其它(Other)5-1 螺丝 (Screw)5-2 跳线 (Jump)附件一: PCBA 类1 SMT 零件(SMT component)1-1 焊点规格 (Sold
11、ering SPEC)PCBA 检验规范- 4 -1-1-1 Chip 零件(Chip component)DefectSide overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less零件偏移 D50% W 或 D50% P 拒收DefectSide overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever
12、is less零件偏移 D50% W 或 D50% P 拒收Defect Any end overhang (B)零件超出 pad 拒收DefectComponent in reserved to lacquer to go to circuit to form a short circuit零件在有保护漆之线路上造成短路拒收AcceptableEnd joint width (C) is minimum 50% of component termination width (W) or 50% land width (P) whichever is less零件焊点宽度 C50%W or C
13、50% P 允收PCBA 检验规范- 5 -AcceptableMaximum fillet height (E) may overhang the lend or extend onto the of the end cap metallization, but not extend further onto the component body锡高超过金属端,但未延伸至零件本体允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收DefectMinimum fillet high (F) is less than 2
14、5% termination high (H), or fillet high (F) is less than 0.5mmHigh voltage capacitance minimum fillet high (F) is less than 50% termination high (H), or fillet high (F) is less than 0.75mm爬锡高度 F50% W or 50% P. 拒收DefectAny end overhang (B)零件超出 pad 拒收AcceptableEnd joint width (C) is minimum 50% compon
15、ent diameter (W) or land width (P),whichever is less零件连接直径宽度 C50% W or 50% P 允收PCBA 检验规范- 7 -AcceptableSide joint length(D) is minimum 50% length of component termination(T) or land length(S), whichever is less侧面焊点长度 D50%T or 50%S 允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收Accep
16、tableMinimum fillet heitht(F) is solder thickness(G) plus 25% diameter(W) of the component end cap焊锡高度 F25%(G+W) 允收AcceptableEnd overlap(J) between the component termination and the land is minimum 50% the length of the component termination(T)零件末端与 PAD 重叠部分 J50%T 允收DefectEnd overlap(J) is less than
17、 50% of the length of component零件末端与 PAD 重叠部分 J50% W 拒收DefectEnd joint width (C) is less than 50% castellation width (W)零件末端焊点宽度 C50% W 拒收PCBA 检验规范- 10 -DefectMinimum end joint width (C) is less 50% lead Width (W)焊点宽度 C50% W 拒收PCBA 检验规范- 12 -DefectMinimum end joint width (C) is less than 50% lead wi
18、dth/diameter (W)焊锡宽度 C50% W 拒收PCBA 检验规范- 13 -AcceptableMinimum end joint width (C) is 50% lead width (W)焊锡宽度 C50%W 允收DefectSide joint fillet (D) less than 150% lead width焊锡宽度 (D) 小于 150% 引脚宽度(W) 拒收DefectSolder fillet touches package body焊锡延伸至零件本体上 拒收1-1-7 I 形引脚 (Butt/I Joints)DefectAny toe overhang
19、(B)侧边突出 拒收DefectEnd joint width (C) is less than 75% lead width (W)焊锡宽度 C50%W 拒收焊锡高度 F1.6mm or H2.1mm零件浮起 D1.6mm 或 H2.1mm 拒收2-4-2 定位- 垂直(Orientation-Vertical)DefectPolarized component is mounted backwards零件极性反 拒收AcceptableThe height of the component body above the H is 0.4mm to 3.2mm零件高度 H 不得超出 0.4mm3.2mm 拒收The angle of the component lead does not greater the 45零件倾斜度不大于 45 度 允收2-4-3 DIP & SIPDefectTitle of the component exceeds max component height limits or lead protrusion does not meet acceptance requirement组件倾斜超出高度上限或引脚未出 拒收2-4-4 引脚跨越导线(Leads crossing conductors)
