1、PCB 工程英文用语句汇总1规格：spec工程问题：engineering query（EQ）生产文件：production gerber电测成本：ET（ electrical test） cost通断测试：Open and short testingIPC 标准： IPC standardIPC 二级： IPC class 2修改：revision公差：tolerance忽略：ignore(omit)工具孔：tooling hole安装孔：mounting hole元件孔：component hole槽孔：slot邮票孔：snap off hole导通孔：via盲孔： blind via埋孔
2、：buried via金属化孔：PTH(plating through hole)非金属化孔：NPTH( no plating through hole)孔位：hole location附边：waste tab铜条：copper strip拼板强度：panel strong板厚：board thickness削铜：shave the copper露铜：copper exposure光标点：fiducial mark内弧：inside radius焊环：annular ring单板尺寸：single size拼板尺寸：panel size铣：routing铣刀：routerV-cut：scori
3、ng哑光：matt光亮的：glossy锡珠：solder ball(solder plugs)阻焊：solder mask(solder resist)阻焊开窗：solder mask opening单面开窗：single side mask opening补油：touch up solder mask补线：track welds毛刺：burrs去毛刺：deburr镀层厚度：plating thickness清洁度：cleanliness离子污染：ionic contamination阻燃性：flammability retardant黑化：black oxidation棕化：brown ox
4、idation红化：red oxidation可焊性：solderability焊料：solder角标：corner mark特性阻抗：characteristic impedance正像：positive负片：negative镜像：mirror线宽：conductor width线距：conductor spacing做样：build sample成品：finished下移：shift down垂直地：vertically水平的：horizontally波峰焊：wave solder钻孔数据：drilling dateUl 标记：Ul Marking蚀刻标记：etched marking周期
5、：date code翘曲：bow and twist外层：outer layer内层：internal layer顶层：top layer底层：bottom layer元件面：component side焊接面：solder side阻焊层：solder mask layer丝印层：legend layer (silkscreen layer or over layer)兰胶层：peelable SM layer贴片层：paste mask layer碳油层：carbon layer外形层：outline layer(profile layer)白油：white ink绿油：green ink
6、喷锡：hot air leveling (HAL)水金：flash gold插头镀金：plated gold edge-board contacts金手指：Gold-finger防氧化：Entek(OSP)沉金：Immersion gold (chem. Gold)沉锡：Immersion Tin(chem.Tin)沉银：Immersion Silver (chem. silver)单面板：single sided board双面板：double sided board多层板：multilayer board刚性板：rigid board挠性板：flexible board刚挠板：flex-r
7、igid board铣：CNC (mill , routing)冲：punching倒角：beveling 倒斜角：chamfer倒圆角：fillet尺寸：dimension介电常数：Dielectric constant菲林：film成像：Imaging板镀：Panel Plating图镀：Pattern Plating后清洗：Final Cleaning叠层：layup (stack-up)污染焊盘：contaminate pad分孔图：drill chart标靶盘： target pad外形公差：routing tolerance芯板：core常用语句、厚度要求孔内铜厚 0.001“太紧
8、对我们的生产，建议按 IPC 二级 0.0008“。The copper thickness of the wall of the plated-through holes is specified 0.001“. Its too tight for our production. We suggest as per IPC class 2.thats to say ,Its 0.0008“ .2.要求金手指镀金厚度为 1.2-1.5um，我们加工太困难，建议按我们常规0.45um。The plating thickness of Au in edge contact is specified
9、 1.2-1.5um,it is too tough for us, we suggest following our PCB 工程英文用语句汇总2normal standard ,that is to say 0.45um instead.3.建议所要求的铜厚 2OZ 为成品铜厚，而且我们将用基铜 1.5OZ 电镀到 2OZ。The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ coppe
10、r thickness and plate to 2OZ for our production. 4.要求锡厚为 0.0005-0.003“，我们做不到这么厚，建议按 IPC 二级，即保证可焊性，The solder thickness is required to plated 0.0005-0.003“ ,We can not reach the requirement .We suggest following IPC class 2 for the solder thickness and we will assure the solderability. 二、公差1. XXX.的尺寸
11、公差为+/-0.005，这要求是太紧对我们生产，建议公差放松到+/-0.008“。The tolerance of dimension is specified XXX.+/-0.005“ .It is tight for our production .We suggest +/-0.008“ instead。2.在*.pdf 文件中要求外形公差为+/-0.005“，建议按 IPC 二级+/-0.01“代替。The profile tolerance is specified +/-0.005“ in *.pdf file. We suggest as per IPC class 2，tha
12、t is to say, it is +/-0.01“.3. 在叠层图中要求板厚公差为+/-0.007“，而 notes 1 中要求板厚公差为+/-0.005“，他们是不同的，建议 0.062“+/-0.007“是可接受的，因为 +/-0.005“对我们来说太难控制了。The tolerance of the board thickness is specified +/-0.007“ in layup detail which is different form NOTES 1 +/-0.005“.We suggest 0.062“+/-0.007“ is acceptable for +/
13、-0.005“ is very tough for us to control.4.外形公差要求+/-0.1mm ，这超出了我们生产，建议按+/-0.2mm 控制。The tolerance of the outline is specified +/-0.1mm.Its above us.We suggest +/-0.2mm instead.5. v-cut 留厚公差为+/-0.06mm 上下偏移公差为+/-0.05mm ，这两个公差都太紧，建议两个公差都按+/-0.1mm 控制。The remain tolerance of v-cut is specified +/-0.06mm an
14、d offset tolerance is +/-0.05mm. they are too tight for us,we suggest both tolerance are +/-0.1mm instead.6.孔位公差为 0.05mm，这是太紧对我们，建议用+/-0.076mm 替代。The tolerance of the hole position is specified 0.05mm. Its too tight for us, We suggest +/-0.076mm instead.7. 角度公差为 +/-0.5mm，这是太紧对我们，v-cut 角度我们将控制在 30+/-
15、5 度。The tolerance of angle is +/-0.5 degree ,it is tight for us , we would like to control the angle of v-cut within 30+/-5 degree.8.在 1MB5476-01.pdf 文件中要求孔到板中心的公差是+/-0.05mm ，这是太紧对我们，建议安 IPC 二级。It is special that the tolerance of the hole to board center is +/-0.05mm in the 1MB5476-01.pdf file,it is
16、 too tight for us ,we suggest as per IPC class 2 .9.要求线宽和线间距公差为+/-0.03，这是太紧对我们，请确认放松到+/-20%。It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , it is tight for us , we would like to relax to +/-20%.Pls confirm.10.3.0的孔径公差要求+0.05mm，这太紧对我们，请确认放松到+0.1/-0mm。The tol
17、erance of the holes with diameter 3.0mm is required to control within +0.05mm ,it is tight for us , we would like to relax to +0.1/-0mm.Pls confirm.三、线路层1.两个孔到外形很近，这将引起露铜和破孔，建议允许露铜与破孔。Two holes are near the outline,it will cause copper exposed and hole broken,we suggest copper exposed and hole broke
18、n is permitable.2.有些盘离外形很近，建议削铜皮0.4mm，避免露铜。Some pads are close to the outline .We suggest shaving the pads about 0.4mm avoid to the copper exposure.3. 焊盘延伸出板外，如按原设计，板边将会露铜，建议允许露铜。The copper pad extend to the board outline, it will lead to copper exposed if we follow Gerber to do,We suggest copper ex
19、posed is acceptable.4.有三个盘离 v-cut 线很近将会引起露铜，建议削焊盘 0.4mm 避免露铜。The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm avoid to the copper exposure.5.底层有些地方线路网格间距仅有0.178mm，这种网格间距我们生产无法做到，建议减小线宽使间距达到 0.2mm.The copper grids on bottom side is only
20、0.178mm in some places,we can not do it per this gap,so we suggest decreasing the trace width to make copper grids to 0.2mm.6. 既然没有功能上的影响，我们建议所有层附边均加些铜皮以提高电镀质量。We suggest putting some extra copper on the waste tab in all layers to improve plating quality since this is no function effect.7.建议加在顶层空白区域
21、加些铜以提高电镀质量。We suggest putting some copper in blank area on top side to improve plated quality.8.我们发现有两处铜皮间距仅有0.013mm，建议把它们连接起来。We have found that the gap between two block copper is only 0.013mm on bottom side,we suggest they are connected.9. 两个光标点处在 v-cut 线上，它们将被削到，我们建议向左边移 1.0mm。The two fiducial m
22、arks are over v-groove line . They will be cut . We suggest moving them 1.0mm toward the left . 四、孔层PCB 工程英文用语句汇总31. 两个直径 2.0MM 的孔，4 个直径4.0MM 的孔， 4 个直径 1.3MM 的孔双面没有焊盘，但它们被定义成 PTH 孔，我们建议做 NPTH 孔The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no pads on top and bott
23、om copper layer .But they are specified PTH in drill chart. We suggest build them as NPTH.2这些孔（直径1.4MM， 1.6mm,1.8mm,2.5mm）被定义成 PTH 孔，但它们的焊盘与孔径等大，我们建议做 NPTH 孔。These holes (1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads which are the same as the holes in copper layer .We suggest them N
24、PTH.3.六个直径 0.25MM 的孔在分孔图中定义为 NPTH 孔，但它们的线路焊盘比孔大，我们建议做 PTH 孔。The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger than the holes in copper layers .We sugget them PTH .4. 直径 0.11“的孔对应的焊盘比孔大，但它们被定义成 NPTH 孔，我们建议沿孔边削铜皮 0.3MM ，请确认The hole with dia.0.11“ have p
25、ad which is larger than the hole in top and bottom copper layer .But its specified NPTH.we suggest shaving the pads 0.3mm around the hole.Pls confirm.5.GERBER 中孔的类型没有定义， 2 个直径 0.120“的孔双面没有焊盘，我们想确认这 2 个直径 0.120”的孔为 NPTH 孔。The hole type(PTH or NPTH) did not be define in the Gerber, the two holes of di
26、ameter 0.120 inch have not copper pads on both sides, we would like to confirm the two holes of diameter 0.120 inch are non-plating holes, please confirm .6.一些 1.5mm 的孔靠得非常近，建议把他们制成槽孔。Some holes with dia.1.5mm are very close each other, we suggest doing them oval hole.7.有两个 0.991、 0.762重叠在一起，建议保留一个
27、0.991mm 的孔。There are two holes with dia.0.991 mm and dia.0.762 mm overlap each other in one place,we suggest only dia.0.991mm remain there.8.在 DRD 孔表中直径 0.012 英寸孔数是291，而在钻孔文件中孔数是 290，请确认孔数是 290 而不是 291。The quantity of diameter 0.012 inch in the hole chart of file DRD is 291, but(thruhole,tap) it is
28、only 290. please confirm the quantity of diameter 0.012 inch holes in the drill flie should be 290 not 291.9.在孔表中标明 1.7*1.9mm 的槽数量为4 个，但 gerber 中仅有两个，建议按gerber 制作。In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found two slots in the gerber file ,we suggest as
29、per gerber file.10.因为铣外形没有定位孔，我们建议附边加四个 2.0mm孔。As no located holes for our routing,we suggest four additional holes with dia.2.0mmin waste tab.五、阻焊层1在字符“J3“处，一些 0.065 inch & 0.0461 inch 的孔两面没有开窗，未避免阻焊污染焊盘，在对孔双面加开窗。On the location of “J3“,some holes of diameter 0.065 inch & 0.0461 inch have not mask
30、opening on both sides, we would like to add mask opening for these holes to avoid solder resist encroach the solder pad on both sides.2.这些焊盘仅 TOP 面有阻焊开窗，为了避免油墨渗上焊盘，我们建议在BOTTOM 面也加上与 TOP 面等大的阻焊开窗These pads have single side mask opening on the top side , we suggest extra mask opening on the bottom sid
31、e with same size as pads to avoid mask onto pad.3.我们发现 6 个直径 0.8MM 的孔双面没有阻焊开窗，我们认为它们应为元件孔，建议双面加直径 1.75MM 的阻焊开窗。We found the 6 holes with dia.0.8mm have not solder-mask opening on both sides. We think they should be component holes. We suggest putting dia.1.75mm solder mask opening on their pads on b
32、oth sides.4.我们发现单板内有些光标点没开窗，这点我们应该按原设计吗？We found some fiducials without mask opening in the unit.Should we following the original design?5.锡珠，小挡点根据原设计多数过孔没有开窗，它们也没有堵孔要求，在我们生产过程中，因为孔内没充满绿油锡将会流进这些孔内，为此我们有三种建议：建议 1：允许部分过孔孔内有锡珠。建议 2：若不同意建议 1，我们将对这些孔双面加一比孔大些的开窗，使用这种方法的结果是：这些过孔的孔壁不会有绿油，过孔焊盘被绿油覆盖但有部分锡环。建议
33、3：若不同意以上两点，我们将对双面未开窗的过孔进行堵孔，但这将增加成本和增加制程时间，对我们来说这种是最不利的选择。我们希望你能选择建议 1 或建议 2。Most vias have no solder mask opening as per original design and no vias-plugged request .During our process, the solder will flow into the vias ,for they arent filled with solder resist completely.So our suggestion have th
34、ree:suggestion1 :Solder ball in partial vias is permitted.Pls confirm.suggestion2: If you dont agree with our suggestion 1, we would like to put an opening with a size little larger than holes on both side .In this way,the wall of the vias will have no any solder resist ,one partial pads will be PCB
35、 工程英文用语句汇总4soldered and the other will be covered with solder resist.Pls confirm.suggestion3: If you dont agree with above two,we will have to plug those vias which have no opening on both side with solder resist . But it will increase our production cost and cause lead-time much. It is the worst wa
36、y for us.We would like to hope you could choose our suggestion 1or 2.9. 过孔要求堵孔，但一些过孔顶层有开窗，建议保留过孔开窗且对 0.46mm的过孔堵孔。The via is specified to be plugged. But some vias have mask opening in top layer. We suggest all vias with dia.0.406mm will be plugged and their mask opening in top layer will be kept. 12
37、. 根据原设计光标点开窗压到周围的些线或盘，建议削光标点开窗，避免露线。In the borad ,some soldermask opening of fiducial marks cover the nearby traces or pads on top side per original design. We suggest that shave a little soldermask opening of fiducial marks to avoid the trace exposed .14. 开窗与线路盘现状不同，我们应该修改开窗使按键处全部上金还是依据原设计制作？The so
38、lder mask opening shape mismatch the circuit pad , should we modify the solder mask opening shape to assure all the key pad will be covered with gold completely , or we will follow Gerber to do . 15. 能我们使用太阳 PSR 2000 油墨代替太阳 PSR 4000 油墨？因为我们没有这类型的油墨。Can we use the solder-mask type with TAYO ink PSR 2
39、000 instead of TAYO ink PSR 4000 H85?because we have not this type六、字符层1.大部分的丝印字符都在焊盘上。我们建议此板没有白字，如果需要丝印字符，我们建议删去上焊盘的字符。Most of silkscreen is on the pads, we suggest no silkscreen, if we need to do silkscreen we suggest removal of those which are on pads.2.原设计白油上焊盘，为了避免油墨污染焊盘，我们建议削去上焊盘的白油，请确认。There
40、is white ink on the top pads per original design, We suggest shaving the white ink in case of they contaminate pads. Pls confirm.3.一些字符靠近焊盘，恐怕它们会污染焊盘，建议允许削少许字符，也就是说字符残缺是允许的。Some legends are close to pads .we are afraid they will contaminate the pads.so we suggest shaving them a bit.that is to say th
41、e defective legends is permittable.4.GERBER 文件没有发现丝印层，因此建议此板没有字符，如果需要丝印字符，请将字符文件发给我们。We didnt find any silkscreen layer in gerber file. So we suggest no silkscreen layers .If need ,Pls send us the file.5.在 U1 和 U5 区域，两个 IC 焊盘的间距只有 0.3MM ，如果按原设计制作，白油会污染焊盘，要不白油做少许更改，白油上焊盘是允许的。In U1 & U5 area the gap b
42、etween two IC pads is only 0.3mm and the white ink will contaminate pads if we follow the original gerber, the other is to make minor change to white ink and IC pads contaminated is allowed.Pls confirm.6.按原设计，字符在大锡面上，是否为了避免白油污染锡面需要削掉白油，或者需要我们按原设计制作？请指示The notation just lie on the large solder pad pe
43、r original design , if need us to shave ink to avoid ink contaminate the solder pad or need us to follow gerber to do? please advise.7. 所有底层字符都没镜像，建议没有底层字符或如果要做出他们需要镜像，请提出你的建议。All the legends on bottom side are no mirror per gerber file,we suggest no bottom side silkscreen or they are mirror if we n
44、eed to do them.Pls advise.8在 GM4 层有些字符，我们忽略它们或是加到顶层？There are some legends on the GM4,should we omit them or put them on top side silkscreen?9.由于单元比较小，没有足够的空间加我们的 UL 标志及周期在每个单元内，我们只能丝印我们的 UL 标志及周期在附边。As the unit is so small ,there is no large enough bare space to add our UL logo and date code in eac
45、h unit we have to add our UL logo and date code on the waste tab by silkscreen.10.我们发现其他制造商的标志及周期在附边上，我们建议用我们的 UL 标志及周期替代加在附边上（同样板一样） ，请确认。We find the LOGO and the date code of other PCB manufacture is only in waste tab. We suggest using our LOGO instead.(is only in waste tab the same as the sample.
46、).Pls confirm.11.顶层字符模糊不清，是否按 3.bmp 图示修改？The legend is illegibility on the top layer silkscreen. Should we modify it as 3.bmp?12.板外有些字符和线路，建议删去,请确认。There are some circuit & notation out of the board,we suggest delete them.pls confirm.13. 字符层有些网格间距仅有 0.076mm,对我们生产来说间距太小，建议按图示修改。In top silkscreen laye
47、r, There is some grids.But the space is only 0.076mm .The space is too small to produce. We suggest modifying these grids like 3.bmp shown.七、外形层1. *.DWG 中没体现拼板方向，建议拼PCB 工程英文用语句汇总5板按照我们附件中的图所示。We suggest panelization per our attached drawing for it does not show the unit-pcbs exact direction in the *
48、.DWG.2. 单板外形与拼板外形不重合，建议按单板调整外形。The unit outline cannt match the panel profile.We suggest following the unit outline to modify. 3. 标注尺寸与实测尺寸不同，建议以标注尺寸为准。The actual gerber dimension is different from the description in drill chart.we suggest per actual gerber.4.建议 v-cut 留厚按前版本 0.3+/-0.1mm控制。We suggest
49、 the remain of the v-cut line as per old version.(0.3+/-0.1mm).5.要求的 v-cut 角度是 30-45 度，但我V-CUT 刀是 30, 45,60 度，它们的公差是+/-5 度，因此我们建议 V-CUT 角度30+/-5 是允许的。The angle of V-CUT is specified 30-45 degree.But our normal reamer of V-CUT is only 30， 45,60 degree.Their tolerance is +/-5 degree .So we have to suggest the angle of V-CUT 30+/-5 degree is permitted.6.建议附边与拼板相连以增加强度。We suggest waste tabs connected around the panel to have it stronger.7. 在 gerber 文件中我们没有发现有外形层，请发外形文件给我们，否则我们无法制作。We did not find the outline of the board in gerber file ,please send outline gerber file to us,
