1、Rev:ACrystal Supplier Assessment Checklist for Process capability & Engineering Technique晶振供應商制程能力&工程技朮評估表 Page1 of 2Company Name 公司名稱: 台州雅晶电子有限公司Manufacturing Location 制造地點:中国浙江台州经济开发区经一路655号Commodity 產品類別: CrystalDate of Supplier Self-Assessment 供應商自評日期: 2007/08/15 Foxconn Assessment Team 富士康評估人員:
2、 Self-Assessment Provided By / Title 自評人及職稱: 何勇 副总经理 Survey Date 稽核日期:Item 项目Suppliers Self Assessment 供应商自评 Foxconns on-site audit 富士康现场稽核A D R Score Comments A D R Score CommentsCheck appropriate boxes with an “x-lower case“. Provide score 0-to-5, or identify N/A per guidelines. Provide Comments.1
3、.0 Research & Design 研究&设计1.1 Does a technology roadmap exist? Is product development schedulefollowed? 是否有技术发展方向存在?产品是否有可持续发展计划? x x x 5 q q q1.2Is there a effective design system/ flow (Design for cost, design formanufacturing and design for customer )?是否有有效的设计系统/流程(对于成本、生产和客户地设计)x x x 5 q q q1.3I
4、s there a special and adequate Lab for Research & Design? are there someadequate reliability test equipment? Life test etc 是否有专业的、足够的实验室来R&D?是否有足够的信赖性（可靠性）测试仪器？x x x 4 q q q1.4 Is there a special and adequate team for Research & Design? (educationalbackground & experience) 是否有专业的、足够的团队来R&D(学历经验) x x
5、 x 4 q q q1.5Is there an adequate procedure for sample trial run and submit the qualifiedsample to customer in time? 是否有合理的样品实验流程来为客户及时提供合格样品？x x x 5 q q q1.6Is there a proper procedure for technology communication / publishing andpatent application? Is it be implemented adquately and effectively? (
6、Take anexample)是否有合理的程序为技术交流发行和专利申请？是否有效的贯彻实施？x x x 5 q q q1.7 Can you design and manufacture fargoing products to satisfy customerrequirements. 为满足客户的需求而设计及生产出各种产品? x x x 5 q q qRev:A1.8Do you have the capability to create your own Manufacturing Drawings andWork Instructions for new projects? 是否有新产
7、品的开发及作业指导书的能力？x x x 5 q q q1.9Do you have the capability to Research & Design new raw material?(if there isthe capability to approve new raw material or apply new raw material inproduct.etc) 是否有新材料的研发和设计能力？（是否有新材料的导入及在生产中的应用能力？）x x x 5 q q q1.10 Do you have the capability to integrate from simulatio
8、n analysis to massproduction? 是否有能力把仿真分析整和到主要生产中去？ x x x 3 q q q1.11Do you have the capability of web based data sharing for Quality, delivery andmanufacturing status reports? 基于网络的数据分享，是否有产品质量、出货和生产状况的报告？x x x 5 q q q1.12Is there a closed-loop process to ensure that any changes made to themanufactu
9、ring data are approved in writing by customer(Foxconn)? (not justthe original equipment manufacturer). 是否有用书面文件方式来确认生产中的应对客户（富士康）的数据变更的完善的流程?x x x 5 q q q2.0 Process Capability 制程能力2.1Does factory offer a good manufacturing flow? If define control process andimplement it. 工厂内是否有完善的制造流程?是如何去定义过程的控制并贯
10、彻实施?x x x 5 q q q2.2Is automated handling equipment used wherever possible e.g. Robotics, stripfeed etc? (If so please describe how wide spread this is deployed) 是否有自动化处理设备,比如用传输带的机器设备(如有,请描述范围有多广?)x x x 4 q q q2.3Is there an effective process defined to significantly reduce or phase-out theuse of L
11、ead (Pb) or ODC (Ozone-Depletion Chemicals) in manufacturingprocess and products? 在生产过程中是否有有效的方式来减少铅或减少破坏臭氧层的措施?x x x 5 q q q2.4 Is there an effective and proper SOP(or WI) for each process station? 每个流程的站点是否有正确的作业指导书? x x x 5 q q q2.5 Does operator follow interrelated SOP(or WI) strictly? 作业员是否有严格的
12、遵照sop作业？ x x x 5 q q q2.6 Do the operators adequately trained and qualified? 员工上岗是否有经过足够的培训？ x x x 5 q q q2.7Is there plan in place to properly address environmental concerns? Handlingof hazardous materials? 是否在合适的地方并有计划的宣导有关环境方面的问题？如何处理有害物质？x x x 5 q q q2.8Is the capability of critical processes an
13、d critical parameters measured andmonitored (Provide Cpk targets)? 关键制程能力和關鍵參數是否被有效測量和管控(規定制程能力指數目標)？x x x 5 q q q2.8.1 Lamping(Rough Lapping,Lamping)研磨(粗磨，細磨) q q q q q q2.8.1.1 Is carrier thickness properly controlled?是否對載具厚度做適當管制？ x x x 5 q q qRev:A2.8.1.2 Is content of rubbing water and using ti
14、me properly controlled?是否對研磨液配方及使用時間做適當管制？ x x x 5 q q q2.8.1.3 Is flatness limit of platform and running speed of machine required andproperly controlled?是否對槃面平面度和機台轉速做要求和適當管制？ x x x 5 q q q2.8.1.4 Is measuring tool effectively controlled?是否對檢測工具做有效控制？ x x x 5 q q q2.8.1.5 Is controlling method def
15、ined and properly controlled?是否對控制方法做定義和有效管制？ x x x 5 q q q2.8.2 Cleaning and Baking清洗及烘烤 x x x 5 q q q2.8.2.1 Is cleaning time effectively controlled?是否對清洗時間做有效管制？ x x x 5 q q q2.8.2.2 Is proportion of liquor content properly controlled? 是否對溶液配比做適當管控？ x x x 5 q q q2.8.2.3 Is temperature of oven eff
16、ectively controlled?是否對烤箱溫度做有效管制？ x x x 5 q q q2.8.3 Gluing of Wafer晶片膠合 q q q q q q2.8.3.1 Is kind of glue properly controlled?是否對膠種做適當管制？ x x x 5 q q q2.8.3.2 Is temperature of gluing effectively controlled?是否對膠合溫度有效控制? x x x 5 q q q2.8.3.3 Is vertical of square defined and properly controlled?是否對
17、直角尺之垂直度做定義和適當管制？ x x x 5 q q q2.8.3.4 Is glue and length defined and properly controlled?是否對膠和長度定義和適當的管制？ x x x 5 q q q2.8.3.5 Is detecting tool effectively controlled?是否對檢測工具做有效管制? x x x 5 q q q2.8.4 Removing Seed切割 q q q q q q2.8.4.1 Is cutting diameter and maximum speed effectively controlled?是否對
18、綫徑和最高速度做有效控制？ x x x 5 q q q2.8.4.2 Is speed of cutting and moving speed of glued wafer defined and properlycontrolled?是否對切割速度和供綫速度做定義和適當管制? x x x 5 q q q2.8.4.3 Is sand water proportion and using time effectively controlled?是否對沙液配比及使用時間做有效控制？ x x x 5 q q q2.8.5 Etching煮膠 q q q q q q2.8.5.1 Is lotion
19、 of coming ungluing effectively controlled?是否對脫膠濟做有效管制？ x x x 5 q q q2.8.5.2 Is mode of coming ungluing effectively controlled?是否對脫膠方式做有效管制？ x x x 5 q q q2.8.5.3 Is baking temperature effectively controlled?是否對烘烤溫度做有效管制？ x x x 5 q q q2.8.6 Blank Cleaning and Baking晶片清洗，烘烤 q q q q q q2.8.6.1 Is pure
20、water properly controlled?是否對純水的純度做適當管制？ x x x 5 q q q2.8.6.2 Is intension of cleaning properly controlled?是否對振洗的強度做適當管制？ x x x 5 q q q2.8.6.3 Is temperature of hot water effectively controlled?是否對熱水溫度做有效管制？ x x x 5 q q q2.8.6.4 Is cleaning time properly controlled?是否對清洗時間做適當管制？ x x x 5 q q qRev:A2.
21、8.6.5 Is temperature and time of baking effectively controlled?是否對烘烤溫度及時間做有效管制？ x x x 5 q q q2.8.6.6 Is cleaning and baking tools properly controlled?是否對工具做適當管制？ x x x 5 q q q2.8.7 Blank Arraying排片 q q q 5 q q q2.8.7.1 Is mask specification effectively controlled?是否對Mask規格做有效管制？ x x x 5 q q q2.8.7.2
22、 Is mask pure limit properly controlled?是否對Mask純淨度做適當管制？ x x x 5 q q q2.8.7.3 Is arraying method properly controlled?是否對工具做適當管制？ x x x 5 q q q2.8.8 Plating蒸鍍 q q q q q q2.8.8.1 Is mask changing time defined and properly controlled?是否對Mask更換時間做定義和適當管制？ x x x 5 q q q2.8.8.2 Is parameter of machine eff
23、ectively controlled?是否對幾台參數做有效管制？ x x x 5 q q q2.8.8.3 Is tool of plating properly controlled?是否對蒸鍍工具做適當管制? x x x 5 q q q2.8.9 Base Coating and Baking固定點膠，烘烤 q q q q q q2.8.9.1 Is kind of base properly controlled?是否對基座種類做適當管制? x x x 5 q q q2.8.9.2 Is kind of adhesive properly controlled?是否對銀膠種類做適當管制
24、? x x x 5 q q q2.8.9.3 Is changing time of adhesive properly controlled?是否對銀膠更換時間做適當管制？ x x x 5 q q q2.8.9.4 Is storage temperature of adhesive properly controlled?是否對儲存銀膠溫度做適當管制? x x x 5 q q q2.8.9.5 Is temperature and time of baking properly controlled?是否對烘烤溫度及時間做適當管制? x x x 5 q q q2.8.9.6 Is adhe
25、sive degree test defined and properly controlled?是否對粘度測試做定義和適當管制? x x x 5 q q q2.8.9.7 Is tool coating and baking properly controlled?是否對點膠和烘烤工具做適當管制? x x x 5 q q q2.8.10 Fine Adjusting微調 q q q q q q2.8.11 Sealing焊封 q q q q q q2.8.11.1Is vacuum degree properly controlled?是否對真空度做適當管制? x x x 5 q q q2.
26、8.11.2Is gross and fine leakage test properly controlled?是否對組漏測試做適當管制？ x x x 5 q q q2.8.12 Aging老化 q q q q q q2.8.12.1Is aging temperature defined and properly controlled?是否對老化溫度做定義和適當管制？ x x x 5 q q q2.8.12.2Is aging time effectively controlled?是否對老化時間做有效管制？ x x x 5 q q q2.8.13 Final Testing測試 q q
27、q q q q2.8.13.1Is load frequency and equivalent series resistance testing properly controlled?是否對負載頻率,等效串聯電阻進行測試並適當管制？ x x x 5 q q q2.8.13.2Is testing tool properly controlled?是否對測試工具做適當管制? x x x 5 q q qRev:A2.8.13.3Is controlling method controlled defined and effectively controled?是否對測試的控制方法定義和有效管制
28、？ x x x 5 q q q2.8.14 Packing包裝 q q q q q q2.9Is first article assessment or first piece evaluation part of the formalqualification process for new product introduction and/or new production run.对于新产品的说明或管理是否有最初的评估报告或对其正式的资格认证部分做出相关的评论？x x x 5 q q q2.10 Is the defect rate monitored and is there an e
29、ffective plan for continuousimprovement? 不良率是否有得到监控，是否有有效的持续改进计划？ x x x 5 q q q2.11Are advanced problem solving techniques used by engineers to solveproblems? (ie: Design of Experiments, planned experimentation, advanceddiagnostic tools, etc.) 工程师是否有解决技术性问题的一般能力？x x x 5 q q q2.12Do you have set-up s
30、heets or master programs for tool setting and processstart up under revision control to ensure only the latest version is used? 是否有安排表或主要计划来设定工具和在修订控制下启动流程来保证是在使用最新版本x x x 5 q q q3.0 Equipment, Tooling and fixture management仪器设备、工具、治具管理3.1Is there an adequate instruction for each equipment? And the
31、instruction isproperly followed? 是否每个设备有足够的指令？这些指令是否正确的被执行？x x x 5 q q q3.2 Are equipments maintenance practices documented, adequately defined andfollowed? 设备维护是否有文件支持，充分定义和执行？ x x x 5 q q q3.3Do you have the special & qualified members to calibrate eqipments? And allequipments were calibrated in t
32、ime? 是否有特别的和合格的成员来校准仪器？所有仪器是否有及时校准？x x x 5 q q q3.4 Do you have the capability to measure and monitor equipments (ProvideGRR targets)? 是否有能力测量和监控设备？（提供目标） x x x 5 q q q3.5 Is there adequate control for tool and fixture by P/N or revision？ 是否有通过或修订文件来充分管控工具和治具？ x x x 5 q q q3.6Do you have the capabil
33、ity to design and manufacture tool and fixture on site?(Stamping, punching, forming, fixtures and automation) 是否有现场研发、设计工具或治具的能力？（冲压、钻孔、成型、固定、自动操作）x x x 5 q q q3.7 Do you have the capability of tool and fixture repair and upgrade on site? 是否有现场维修、改善工具和治具的能力？ x x x 5 q q q4.0 Inspection & Reliability
34、 检验可靠性Rev:A4.1 Do the inspectors adequately trained and qualified? 检验员是否有经过合格的训练？ x x x 5 q q q4.2 Is there proper environment to inspection (Such as temperature, humidity,etc.) 产品是否是在适当的环境下检验的？（如温度、湿度等） x x x 5 q q q4.3 Inspection of feed-in and shipment 進料和包裝出貨檢驗4.3.1 Is there right inspection flo
35、w for feed-in? Is it implemented?是否有適當的進料檢驗流程并有效被實施? x x x 5 q q q4.3.2 Is there appropriate test equipment for dust of pin plating in feed-in? Does ithave inspect of sample?進料檢驗是否有檢驗pin鍍層之設備并進行適當抽檢? x x x 5 q q q4.3.3Is there appropriate test equipment for size of chip board?Does it haveinspect of
36、sample?進料檢驗是否有檢驗Chip基板尺寸之適當設備(如3Dmeasurement)并進行適當抽檢?x x x 5 q q q4.3.4 Is there appropriate test flow in packing test station?Is it implemented?包裝測試工站是否有適當之測試作業流程(如阻值尺寸等抽樣測量)并被有效實施? x x x 5 q q q4.3.5 Is numerical value of conn controlled by Cpk analyse in finished product test?連接器成品測試是否有對阻值做Cpk分析與
37、管制? x x x 5 q q q4.3.6 Is it defined for peeling force of tape properly?Does it have timing test?是否對Tape之Peeling force 做適當定義并適時測試? x x x 5 q q q4.3.7 Is there appropriate test flow for shipment?Is it implemented?是否有適當的出貨檢驗流程(包括Label, 數量包裝外觀電性參數之抽檢)并有效被實施? x x x 5 q q q4.4 Test of dependability.可靠性測試
38、4.4.1Are reliability test documented, adequately defined? Is there an available testschedule and adequately followed? 可靠性实验是否有文件依据及充分定义？是否有有用的测试计划表并充分利用？x x x 5 q q q4.4.2Is there appropriate test equipment for Solderability? Is this equipment usedfor testing Conn?是否有合適的Solderability測試儀(如Wetting bal
39、ance system)并進行有效之測試?x x x 5 q q q4.4.3 Is there appropriate test equipment for Load life in humidity Conn?是否有合適的壽命測試設備? x x x 5 q q qRev:A4.4.4 Has the test result been kept back? 測試結果有無留下記錄? x x x 5 q q q4.4.5 Has the test result been feed back to R/D and product line?測試結果有無回應給 R/D 和生產線(Feed back
40、system)? x x x 5 q q q4.4.6 Were the test tools or instruments calibrated as the criterion.量測工具或儀器有無訂定校正規範? x x x 5 q q q4.4.7Does the QA check the product at any reason or time?(Suchas:temperature,humidity,time,supply voltage,the words of output and input) 產品在任何狀況下, 品管有無抽檢? (溫濕度,時间, 電壓供應,輸入及輸出之文字.)
41、x x x 5 q q q4.4.8Is there establishment of the test condition about theenvironment(temperature,humidity,time and frequency)有無制定環境測試之管制條件? (濕度, 溫度, 時間, 頻率)x x x 5 q q q4.4.9 Is there MTBF and the standard 有無實做MTBF及標準 x x x 5 q q q4.4.10 Is there manage criterion of the product that after the reliabl
42、e test? If have,howto do ? 有無訂定產品完成可靠度測試之後的管理規範? 若有, 如何管理? x x x 5 q q q4.4.11Is there appropriate test equipment for Pb whisker ? Is this equipment usedfor testing Pb whisker properly? 是否有合適的錫須測試設備并對連接器進行適當之錫須測試? q q q5 失效分析 FA5.1 Is there RMA criterion? 有無產品出售後之不良分析程序(RMA 規範) ? x x x 5 q q q5.2 Ar
43、e there a special department to deal with the untreaded product 有無明確的部門來分析維修退回之不良品? x x x 5 q q q5.3 Is there FA and the method of the obviate 有無不良分析及排除之方法? x x x 5 q q q5.4 Can the untreaded product been requested to research and analysis可不可以要求退回之不良品作研究分析? x x x 5 q q qRev:A5.5 Is there equipment f
44、or analysis product ? If have not, how to analysis thefailure product?有無測試儀器來分析零件? 若無, 如何分析故障零件或物料? x x x 5 q q q5.6 Is there a process to deal with “NTF(No Trouble Found)“?有無訂定程序來處理“NTF(No Trouble Found)“的狀況? x x x 5 q q q5.7 Are there special engineers for failure analysis? 有无专业的工程师做失效分析？ x x x 5
45、q q q5.8Is there a meeting for project and QA with customer?(if have ,who is thecharge department ? What is cycle? And how about the record?)有無希望定期與客戶召開工程，品管會議? (若有, 負責部門? 週期? 記錄? )x x x 5 q q qAVERAGE SCORE 平均得分 5.0 #DIV/0!Rev: ASupplier Assessment Scoring Guideline (for HONHAI FOXCONN use only) Pa
46、ge 2 of 2DefinitionsAPPROACH x Documented process, defined procedures or measurements with goals and objectives.Management involvement or organizational structure are adequately defined to assure proper implementation.DEPLOYMENT x Implementation of the defined approach in critical business or operat
47、ional areas.Responsible employees understand the processes and the needs for on-going execution.RESULT x Demonstration of effectiveness.Scoring for Approach, Deployment, or Results (“ADR“) is based on the typical practices for the commodity being assessed.Score Questionnaire Scoring CriteriaNo Syste
48、m orNo Process in Place 0 When there is minimum acceptable evidence in all three ADR areas.Major Deficiency 1 When there is acceptable evidence in only ONE of three ADR areas,minimum acceptable evidence for the other two areas.Improvement Necessary 3 When there is acceptable evidence in TWO of three
49、 ADR areas,minimum acceptable evidence for the other area.Satisfactory 4 When there is acceptable evidence in all THREE ADR areas.Outstanding 5When there is strong evidence in all three ADR areas exceeding industry norm,Demonstration of SIGNIFICANT successes in product quality or customer satisfaction as a result.Supplier must provide detail.(Example: Supplier has web-based system allowing customers access to WIP (work-in-process) status orproduction yield data. Management proactively uses data driving continuous improvement. Or, Supplier hasc
