1、,Thru RTY Innovation,Achieve,10 million per year,LG Electronics / Digital Appliance CompanyLGETA MWO,Vision,12.5,11.8,10,1,10.0,9.8,(04 Target),(03, Million),TA(10.0),TA(11.1),Global No.1 MWO Division ( 05 Sales: M$ 385 ；Profit: 8 % ),China Market Top 1 ( 05 China M/S : 45% ),Cost Competition,Before
2、,2005,Now,As the basement of Profit Turnaround,Fast Innovation,Fast Growth,MWO Maker Benchmarking,Vision,Vision,1/19,Big Y Issue,7.1,10.0,02,03,CMO,Productivity loss,Portfolio by Category,High,Low,Price,Profit,High,Quality loss,Parts loss,Fast Growth,New MDL,Accelerate tool shift ( 0.7 1.8),Shorten
3、the development period,Increasing number of parts,M unit / year,2/19,Input,Output,Process,Assy Line,Press,Welding,Painting,Purchase,IQC,OQC,PCB,Supplier,Customer,Logistics system (Material, Product) Parts loss controlInspection SystemBox quality control,Round Cavity strengthPCB ICT FCT control Powde
4、r qualityGap defect .Product and Quality StrategyIR sensor qualityPress line system,Quick response systemOutgoing Inspection systemMaterial storage system,Main Issue,Big Y Issue,3/19,Define,Measure,Analysis,Improve,Control,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Better logistics,Worst logistics,
5、IQC,Waiting for ?,Stock,Product stock,Assy line,Painting line,PCB line,Neck Point,Plan change Everyday Stock is not enoughElevator is not enoughPacking Time too longBroken BoxCheck time conflict Poor loading method,Logistics improvement,Best practice-1,4/19,Vendor and supervisor meeting,Define,Measu
6、re,Analysis,Improve,Control,Logistics improvement,Best practice-1,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,5/19,Best practice-1,Define,Measure,Analysis,Improve,Control,Waiting for ,Ppk=-1.01,Miscellaneous ratio,EA/h,One-way ANOVA: make invoice, invoice, inspection, check, stock, recover Analysis
7、of Variance Source DF SS MS F P Factor 5 908047 181609 70.14 0.000 Error 138 357333 2589 Total 143 1265379 Individual 95% CIs For MeanBased on Pooled StDev Level N Mean StDev -+-+-+-+- make inv 24 14.70 5.71 (-*-) invoice 24 21.98 10.96 (-*-) inspecti 24 15.06 2.41 (-*-) check 24 26.75 15.64 (-*-) s
8、tock 24 229.85 122.93 (-*-) recover 24 8.27 4.47 (-*-) -+-+-+-+- Pooled StDev = 50.89 0 80 160 240,Make invoice,Inspect,Stock,Recover part,Check unload,Invoice check,Logistics improvement,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,6/19,7/19,Define,Measure,Analysis,Improve,Control,IQC,Stock,Product
9、stock,Assy line,Painting line,PCB line,Press stock,Support time control,Load method,Box stock,Best practice-1,Logistics improvement,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Best Practice 2 Assy RTY innovation,Define,Measure,Analysis,Improve,Control,Forget self check,Latch Adjust,D/Frame,Latch,L/B
10、oard,Cavity,Man,Old or new,Method,Mould aging,Total inspection,burr,Machine,Parameter injection,Material,Gage aging,The way,PPK=0.06,Latch 3 mould is CTQ,One-way ANOVA: latch1, latch2, latch3, latch4 Analysis of Variance Source DF SS MS F P Factor 3 53.18 17.73 3.40 0.020 Error 116 605.11 5.22 Total
11、 119 658.30 Individual 95% CIs For Mean Based on Pooled StDev Level N Mean StDev -+-+-+-+- latch1 30 100.92 0.94 (-*-) latch2 30 100.92 0.76 (-*-) latch3 30 102.27 4.30 (-*-) latch4 30 100.52 0.95 (-*-) -+-+-+-+- Pooled StDev = 2.28 100.0 101.0 102.0 103.0,Latch adjustment improvement,Best practice-
12、2,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,8/19,Define,Measure,Analysis,Improve,Control,Regression Analysis: time versus latch b, latch b-p, latch b-l, latch The regression equation is time = - 0.24 + 0.0176 latch b + 0.0920 latch b-p + 0.278 latch b-l- 0.0148 latch Predictor Coef SE Coef T P Con
13、stant -0.243 3.481 -0.07 0.945 latch b 0.01756 0.03172 0.55 0.585 latch b-l 0.09197 0.02284 4.03 0.000 latch b-p 0.27811 0.02761 10.07 0.000 latch -0.01481 0.02400 -0.62 0.543 S = 0.02795 R-Sq = 81.9% R-Sq(adj) = 79.0%,Regression Analysis: time versus latch b-p, latch b-l The regression equation is
14、time = 0.019 + 0.0948 latch b-p + 0.278 latch b-l Predictor Coef SE Coef T P Constant 0.0192 0.6785 0.03 0.978 latch b- 0.09475 0.02186 4.33 0.000 latch b- 0.27777 0.02589 10.73 0.000 S = 0.02717 R-Sq = 81.6% R-Sq(adj) = 80.2%,PPK=2.19,Pooling,Latch adjustment improvement,Best practice-2,Supplier,IQ
15、C,Painting,PCB,Assy,OQC,Customer,9/19,Define,Measure,Analysis,Improve,Control,Past film,Hold,Put film,Put,Take off,Press film,Hold plate,Turn around,Hang,2.8,0.9,1.0,1.0,1.8,1.3,0.7,1.0,2.0,Sec.,03,2.3,0.8,0.8,0.9,1.7,1.2,0.7,0.8,1.1,Ppk= -0.31,02,Chi-Sq = 5.692 + 0.008 +0.011 + 0.000 +0.077 + 0.000
16、 +6.151 + 0.008 +2.628 + 0.003 +1.681 + 0.002 +5.037 + 0.007 +0.001 + 0.000 +1.080 + 0.001 +0.699 + 0.001 +0.001 + 0.000 = 23.089 DF = 10, P-Value = 0.010,Scratch by Model Analysis,Chi-Square Test: Defect2, Total2 Expected counts are printed below observed countsDefect2 Total2 Total1 9 14783 1479219
17、.49 14772.512 5 14783 1478819.48 14768.523 2 14784 1478619.48 14766.524 62 14784 1484619.56 14826.44 Total 78 59134 59212,Chi-Sq = 5.642 + 0.007 +10.764 + 0.014 +15.683 + 0.021 +92.114 + 0.122 = 124.367 DF = 3, P-Value = 0.000,Scratch by Vendor Analysis,Best practice-2,Supplier,IQC,Painting,PCB,Assy
18、,OQC,Customer,Door assy process improvement,10/19,Define,Measure,Analysis,Improve,Control,Door assy process improvement,Best practice-2,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,11/19,Define,Measure,Analysis,Improve,Control,Standard work,VCD training,Standard line,Standard sample,Other line,Traini
19、ng Process,Training for new employeeWhen line stop , trainingSupervisor inspectioninspect oneself.,VOC research,Standard modify,Process training,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Best practice-2,12/19,Define,Measure,Analysis,Improve,Control,Painting line improvement,Powder different Slow l
20、ine speed Painting robot defect Program different,New model new Problems,Painting condition,Powder condition,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Best practice-3,13/19,Estimated Regression Coefficients for cost_1 Term Coef SE Coef T P Constant 0.498799 1.06587 0.468 0.045 PG 0.016906 0.08130
21、0.208 0.037 PSP 0.016195 0.09905 0.164 0.002 voltage 0.003204 0.00554 0.579 0.029 S = 1.1027 R-Sq = 98.2% R-Sq(adj) = 92.6%,14/19,Analysis of Variance for intencity Source DF Seq SS Adj SS Adj MS F P Regression 10 399.405 399.4050 39.94050 16.54 0.003Linear 5 370.783 42.4636 8.49272 3.52 0.097Intera
22、ction 5 28.623 28.6225 5.72450 2.37 0.183 Residual Error 5 12.073 12.0725 2.41450 Total 15 411.478,Define,Measure,Analysis,Improve,Control,Ppk=0.37,Estimated Regression Coefficients for intencity Term Coef SE Coef T P Constant 0.525 34.493 0.015 0.088 voltage 0.045 0.105 0.432 0.042 PG -9.175 5.124
23、-1.791 0.033 PSP -7.250 5.298 -1.368 0.029 time 16.875 25.325 0.666 0.535 dianji 627.500 506.498 1.239 0.070 voltage*PG 0.034 0.016 2.188 0.080 voltage*PSP 0.026 0.016 1.673 0.155 voltage*time -0.065 0.078 -0.837 0.441 voltage*dianji -2.700 1.554 -1.738 0.043 PG*PSP 0.288 0.388 0.740 0.046 S = 1.554
24、 R-Sq = 97.1% R-Sq(adj) = 91.2%,Pooling,Ppk=1.19,02.12,03.6,3.6,2.75,21%,RTYz,Painting line improvement,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Best practice-3,Best Practice 4 PCB line improvement,Define,Measure,Analysis,Improve,Control,PCB line improvement,Ppk =-0.74,LEAD,Head Adjust,ANVIL high
25、,(Head),1.2+0.5,1.5+0.1,Spec,Pre _CTQ,Knife,CUTTER,Part,Eyelet,5mm,10mm,RT,ICT,MAN Insert,Auto Soldering,ICT,LED SOLDER,FCT,C/P serve,PCB serve,K/M past,SCREW,FCT,Auto Insert,Solder,Assemblage,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Best practice-4,15/19,16/19,Define,Measure,Analysis,Improve,Con
26、trol,Term Coef SE Coef T P Constant -325.8 534.135 -0.610 0.006 cutter 44.4 84.500 0.525 0.001 anvil -11.6 11.390 -1.017 0.033 head 77.4 57.426 1.347 0.208 cutter*counter -1.6 3.369 -0.467 0.651 anvil*anvil -0.3 0.135 -2.408 0.037 head*head -8.1 3.369 -2.408 0.037 cutter*anvil 1.0 0.904 1.051 0.318
27、cutter*head -4.3 4.521 -0.940 0.369 anvil*head 0.4 0.904 0.442 0.668 S = 0.1279 R-Sq = 83.0% R-Sq(adj) =79.7%,Finding Optimized Condition,Ppk =-0.74,Ppk =2.17,Before,After,Cutter Anvil Head 12.5 1.2 1.5,PCB line improvement,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Best practice-4,Best Practice 5
28、Part quality innovation,10 million TDR Activity,Define,Measure,Analysis,Improve,Control,Vendor parts improvement,Vendor TDR meeting,Before,Now,Quality ?,Supplier,IQC,Painting,PCB,Assy,OQC,Customer,Best practice-5,17/19,System Control,Control,Lead time,RTYq,Bar cord system,Feb.,March.,Apr.,May.,Jun.,122,96,83,64,32,Quality Control,RTY,Feb.,March.,Apr.,May.,Jun.,3254,2243,514,1067,1939,PPM,Min.,3.51,18/19,Future Plan,Yft1,Yft2,Yft3,Yft4,Yft5,Yft6,Yft1,Yft2,Yft3,Yft4,DMS Building,19/19,Fast Growth Fast Innovation,Thank You,LGETA MWO,
