1、Host System Single Cell Li-lonBattery PackPACK-PROTECTIONICCHGDSGTempSenseSOC_INTCurrentSenseTPACK+VoltageSenseFETsPowerManagementControllerVCCDATALDOI2CSDQCEBAT_GDProductFolderSample see TIs Terms ofUse.TI E2E Online Community TIs Engineer-to-Engineer (E2E) Community. Created to foster collaboratio
2、namong engineers. At , you can ask questions, share knowledge, explore ideas and helpsolve problems with fellow engineers.Design Support TIs Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.12.3商商标标NanoFree, E2E are trademark
3、s of Texas Instruments.I2C is a trademark of NXP Semiconductors.12.4静静电电放放电电警警告告ESD可能会损坏该集成电路。德州仪器(TI)建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序,可能会损坏集成电路。ESD的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。12.5 GlossarySLYZ022 TI Glossary.This glossary lists and explains terms, a
4、cronyms, and definitions.13机机械械、封封装装和和可可订订购购信信息息以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。重重要要声声明明德州仪器(TI)及其下属子公司有权根据JESD46最新标准,对所提供的产品和服务进行更正、修改、增强、改进或其它更改，并有权根据JESD48最新标准中止提供任何产品和服务。客户在下订单前应获取最新的相关信息,并验证这些信息是否完整且是最新的。所有产品的销售都遵循在订单确认时所提供的TI销售条款与条件。TI保
5、证其所销售的组件的性能符合产品销售时TI半导体产品销售条件与条款的适用规范。仅在TI保证的范围内，且TI认为有必要时才会使用测试或其它质量控制技术。除非适用法律做出了硬性规定，否则没有必要对每种组件的所有参数进行测试。TI对应用帮助或客户产品设计不承担任何义务。客户应对其使用TI组件的产品和应用自行负责。为尽量减小与客户产品和应用相关的风险，客户应提供充分的设计与操作安全措施。TI不对任何TI专利权、版权、屏蔽作品权或其它与使用了TI组件或服务的组合设备、机器或流程相关的TI知识产权中授予的直接或隐含权限作出任何保证或解释。TI所发布的与第三方产品或服务有关的信息，不能构成从TI获得使用这些产
6、品或服务的许可、授权、或认可。使用此类信息可能需要获得第三方的专利权或其它知识产权方面的许可，或是TI的专利权或其它知识产权方面的许可。对于TI的产品手册或数据表中TI信息的重要部分，仅在没有对内容进行任何篡改且带有相关授权、条件、限制和声明的情况下才允许进行复制。TI对此类篡改过的文件不承担任何责任或义务。复制第三方的信息可能需要服从额外的限制条件。在转售TI组件或服务时，如果对该组件或服务参数的陈述与TI标明的参数相比存在差异或虚假成分，则会失去相关TI组件或服务的所有明示或暗示授权，且这是不正当的、欺诈性商业行为。TI对任何此类虚假陈述均不承担任何责任或义务。客户认可并同意，尽管任何应用
7、相关信息或支持仍可能由TI提供，但他们将独力负责满足与其产品及在其应用中使用TI产品相关的所有法律、法规和安全相关要求。客户声明并同意，他们具备制定与实施安全措施所需的全部专业技术和知识，可预见故障的危险后果、监测故障及其后果、降低有可能造成人身伤害的故障的发生机率并采取适当的补救措施。客户将全额赔偿因在此类安全关键应用中使用任何TI组件而对TI及其代理造成的任何损失。在某些场合中，为了推进安全相关应用有可能对TI组件进行特别的促销。TI的目标是利用此类组件帮助客户设计和创立其特有的可满足适用的功能安全性标准和要求的终端产品解决方案。尽管如此，此类组件仍然服从这些条款。TI组件未获得用于FDA
8、 Class III（或类似的生命攸关医疗设备）的授权许可，除非各方授权官员已经达成了专门管控此类使用的特别协议。只有那些TI特别注明属于军用等级或“增强型塑料”的TI组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同意，对并非指定面向军事或航空航天用途的TI组件进行军事或航空航天方面的应用，其风险由客户单独承担，并且由客户独力负责满足与此类使用相关的所有法律和法规要求。TI已明确指定符合ISO/TS16949要求的产品，这些产品主要用于汽车。在任何情况下，因使用非指定产品而无法达到ISO/TS16949要求，TI不承担任何责任。产品应用数字音频 -数字信号处理器 NOTICE邮寄
9、地址：上海市浦东新区世纪大道1568号，中建大厦32楼邮政编码：200122Copyright 2016,德州仪器半导体技术（上海）有限公司PACKAGE OPTION ADDENDUM 7-Apr-2016Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp (C) Device Marking(4/5)SamplesBQ27320Y
10、ZFR ACTIVE DSBGA YZF 15 3000 Green (RoHS& no Sb/Br)SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27320BQ27320YZFT ACTIVE DSBGA YZF 15 250 Green (RoHS& no Sb/Br)SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27320(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs
11、.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is no
12、t in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http:/ for the latest availabilityinformation and a
13、dditional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TIs terms “Lead-Free“ or “Pb-Free“ mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1%
14、 by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and packa
15、ge, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines “Green“ to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br o
16、r Sb do not exceed 0.1% by weightin homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, o
17、r the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a “ will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the en
18、tire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.Important Information and D
19、isclaimer:The information provided on this page represents TIs knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to b
20、etter integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain informati
21、on to be proprietary, and thus CAS numbers and other limited information may not be available for release.PACKAGE OPTION ADDENDUM 7-Apr-2016Addendum-Page 2In no event shall TIs liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold
22、by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevice PackageTypePackageDrawingPins SPQ ReelDiameter(mm)ReelWidthW1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantBQ27320YZFR DSBGA YZF 15 3000 180.0 8.4 2.1 2.76 0.81 4.0 8.0 Q1BQ27320YZFT DSBGA YZF 15 250 180.
23、0 8.4 2.1 2.76 0.81 4.0 8.0 Q1PACKAGE MATERIALS INFORMATION 22-Jun-2017Pack Materials-Page 1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)BQ27320YZFR DSBGA YZF 15 3000 182.0 182.0 20.0BQ27320YZFT DSBGA YZF 15 250 182.0 182.0 20.0PACKAGE MATERIALS INFORMATION 22-Jun-2017Pack Materials-Page 2
