1、最新 料推荐PCB板材厚度规格：0.5mm，0.7mm ，0.8mm，1.0mm，1.2mm ，1.5mm，1.6mm，2.0mm， 2.4mm，3.2mm，6.4mmPCB板上铜箔的厚度规格：18um, 25um, 35um, 70um 和 105um常用半固化片规格：型号10802116L2116A2116H15007628L7628A7628H7628M厚 mil 344.55677.59.38板厚一般分为含铜和不含铜两种厚度一含铜厚度：规格配料结构规格配料结构0.1H/H11061.31/1676281/112116H/H77628H/1210802/2776280.2H/H11506
2、1.41/177628T/T17628H/H776282/211062/2776282/2115061.51/187628H/217628H/H876280.31/122116T/T87628H/1221162/287628H/H1080+2116+10801.61/187628T/T1080+2116+1080H/H876282/21080+2116+10802/2876281/11080+7628+10800.41.7H/H276281/197628T/T27628H/H976282/2276282/2976280.51/17628+1080+76281.81/197628H/H7628+
3、1080+7628H/H976282/27628+1080+76282/2976280.61/1376281.91/110 7628H/H37628H/H10 76282/2376282/210 76280.71/12116+27628+21162.01/110 7628H/H1080+37628+1080H/H1176282/21080+37628+10802.21/11176280.81/147628H/H12 7628H/H476282/212 76282/2476282.31/112 76280.91/127628+1080+2 7628H/H12 7628H/H2 7628+2116
4、+2 76282/212 76282/22 7628+2116+2 76282.41/113 76281.01/157628H/H13 7628H/H576282/213 76282/2576282.51/113 76281.11/157628H/H13 7628H/H676282/216 76282/2676283.01/116 76281.21/167628H/H16 7628H/H676283.21/117 76282/217 76281最新 料推荐二不含铜厚度厚度 mil厚度 mm配料结构备注20.0501106不含 2OZ铜箔30.0750.076主 :1 1080 次 :1 108
5、6不含 2OZ铜箔厚度 mil厚度 mm配料结构备注40.100.102主 :1 2116 次 :1 3313 或 2 106 或 1 2113 或 1 2313 或 1080+10650.127主 :1 2116次 :2 108060.1500.152主 :1 1506次 :2 108070.178主 :1 7628次 :1080+21168 0.2000.203主 :1 7628 次 :2 2116 或 221139 0.2280.23022116100.250.25422116110.280主 :1080+2116+1080 次 :2 2165120.3000.305主 :2 1506
6、次 :2116+1080+2116130.33主 :1080+7628+1080 次 :2 1506140.3560.3627628150.3827628160.4060.41主 :2 7628 次 :3 2116170.43主 :7628+1080+7628 次 :2 7628180.4570.467628+1080+7628190.487628+2116+7628200.5080.51主 :7628+2116+7628 次 :7628+2 1080+7628 或 37628210.5337628220.5637628230.5837628240.600.61主 :3 7628 次 :211
7、6+2 7628+2116250.64主 :3 7628 次 :2116+2 7628+2116260.661080+37628+1080270.691080+37628+1080280.710.711主 :4 7628 次 :4 7628300.7647628310.790.8047628友情备注：1 foot = 12 inch = 304.8 mm1inch = 25.4 mm1 mil=0.0254 mm1 inch=1000 mil1OZ=28.375g1 OZ 铜箔其真正厚度为1.38mil 或 35m2最新 料推荐一、芯板、半固化片规格：1生益芯板常见规格：0.1mm（含铜厚）0
8、.2mm5.120.3mm9.060.4mm12.990.5mm16.930.6mm20.870.7mm24.80.8mm28.740.9mm36.611mm44.491.2mm52.361.5mm56.31.6mm60.242mm75.982.4mm91.732半固化片：10803.0mil21164.2mil76287.0mil3流胶厚：10802.5mil76286.5mil0.14mm=2*10800.21mm=2*21160.24mm=7628+10800.36mm=2*76280.4mm=2*7628+1080二、常用半固化片在不同铜厚、不同图形厚度变化：1 HOZCopper/g
9、ndGnd/gndCopper/signalGnd/signalSignal/signal76287.37.06.86.76.621164.64.44.24.03.833133.93.83.73.53.310802.82.62.52.42.27628H7.67.37.17.06.92116H4.94.74.54.34.13313H4.14.03.93.73.51018H2.92.72.62.52.37628C7.16.86.66.56.43313C3.73.63.53.23.13最新 料推荐2 1OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/
10、signal76287.16.86.66.56.421164.54.34.13.93.733133.83.73.63.43.210802.82.62.52.42.27628H7.47.16.96.86.72116H4.84.64.44.24.03313H4.03.93.83.63.41018H2.92.72.62.52.37628C6.96.66.46.36.23313C3.63.53.43.23.03 2OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.86.56.36.16.021164.24.03.83.53.333
11、133.53.43.33.12.810802.62.42.32.11.97628H7.16.86.66.46.32116H4.54.34.13.83.63313H3.73.63.53.33.01018H2.72.52.42.22.07628C6.66.36.15.95.83313C3.33.23.12.92.64 3OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.56.26.05.75.621164.03.83.63.23.033133.33.23.12.82.510802.42.22.11.81.67628H6.86.
12、56.36.05.92116H4.34.13.93.53.33313H3.53.43.33.02.71018H2.52.32.21.91.77628C6.36.05.85.55.43313C3.13.02.92.62.3注： Gnd 为 65%以上的大铜箔，H 为高树脂含量， C 为低树脂含量。4最新 料推荐S0401粘结片压合厚度（ 100残铜率）指标压合厚度压合厚度树脂含量 m/20mMil规格106713502.0 0.41080L61 3712.80.41080A64 3783.10.41080H68 3903.50.42116L50 31134.40.62116A52 31204.7
13、0.62116H56 31335.20.6331355 31004.00.67628L41 31857.30.87628A43 31957.70.87628M46 32108.30.87628H50 32309.10.81506A45 31606.30.81506H49 31756.90.8S0701粘结片压合厚度（残铜率100%）指标压合厚度压合厚度树脂含量 m/20mMil规格106713512.0 0.41080L61 3722.80.41080A64 3803.10.41080H68 3923.60.42116L50 31154.50.62116A52 31214.80.62116H5
14、6 31355.30.6331355 31024.00.67628L41 31887.40.87628A43 31987.80.87628M46 32138.40.87628H50 32359.30.81506A45 31626.40.81506H48 31756.90.85最新 料推荐S1000B 粘结片压合厚度（残铜率100%）指标树脂含量压合厚度压合厚度 m/20mMil规格106713471.9 0.41080L63 3712.80.41080A66 3783.10.41080H68 3833.30.42116L52 31124.40.62116A55 31214.80.62116H5
15、8 31325.20.6331355 3943.70.67628L43 31857.30.87628A46 31987.80.87628M48 32078.10.87628H50 32188.60.81506A45 31515.90.81506H48 31626.40.8S0155 粘结片压合厚度（ 100%残铜率）指标压合厚度压合厚度树脂含量 m/20mMil规格106713491.9 0.41080L62 3722.80.41080A65 3793.10.41080H68 3883.60.42116L51 31144.50.62116A53 31204.70.62116H56 31305.10.6331356 31004.00.67628L42 31877.40.87628A44 31967.70.87628M46 32058.10.87628H50 32278.90.81506A45 31566.10.81506H48 31686.60.86最新 料推荐7
