1、ConfidentialSOP ASSEMBLY PROCESS FLOW & QUALITY CONTROL INSTRUCTIONConfidentialContents1.Package Instruction2.Process Flow3.Quality ControlConfidentialPackage Instruction1. SOP 2. SSOP 3. TSSOP 4. MFPASEASEConfidentialPackage InstructionConfidentialASY process flowWafer SawDie Attach Wire Bond Wafer
2、 MountWafer GrindingEpoxy Cure MoldingPost Mold CurePlatingTrim/FormPacking & ShippingDe-junkLaser Marking前段制程 后段制程WaferDie (chip)Die on Lead frameEpoxyLead FrameBefore AfterLaser MarkingLaser MarkingLaser MarkingLaser MarkingConfidentialWafer GrindingLOADUNLOADGRINGINGPurpose:Grinding the wafer to
3、Customer required thicknessWafer Grinding晶圓 (未研磨 ) 研磨機 晶圓 (研磨後 )Confidential晶元背面 Wafer backsideFrameMount TapePurpose: Combine the wafer with Dicing tape onto the frame for die sawingWafer mount MachineWafer MountFrameConfidentialPurpose: To separate dies from each other for die attachMonitorLoad/Un
4、loadSawingCleaningMachineWafer SawConfidentialBefore wafer saw:After wafer saw:Wafer SawConfidentialPurpose:Attach the dies with epoxy on substrate for the following processDie AttachOutputDie bondSubstrate load bondConfidentialWorking flow:Die AttachRobber tipLead-frameEpoxyConfidentialPurpose: Sol
5、idify the epoxy after D/AInsideOvenEpoxy CureConfidentialPurpose: Connecting the chip and the exterior circuitinputinput outputBond locationTheory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag)Wire BondGold wireleadDieAl padCapillaryConfide
6、ntialMold MachineMoldingPurpose: Seal the product with EMC to prevent die, gold wire from being damaged, contaminated and oxygenic.ConfidentialMoldingMoldingTop chaseAir vent Bottom chase Cavity Leadframe Plunger PotGate insertRunner CompoundBottom cull blockTop cull blockConfidentialMoldingMoldingT
7、op chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger ConfidentialMoldingMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger ConfidentialMoldingAfter MoldMoldingTop cha
8、seAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger EpoxyLead FrameConfidentialPurpose： Use laser light irradiated by CO2 or YAG to vapour the EMC to show content on the package， such as date, schedule, place of production and so on.Laser Mark
9、inglaser EMC vapouredBefore AfterLaser markingConfidentialOvenInsidePurpose: To let EMC react completely so that products can be protected more effectively.Post mold cureConfidentialDe-junkPurpose： Remove the dem-bar of leadframe.Working areaBefore AfterLaser MarkingLaser MarkingConfidentialPlatingP
10、urpose: To plating Sn on the lead which will mount on board pad.loadunloadPlating lineConfidentialPlatingAfterBefore投料區電解去膠高壓噴洗酸洗收料區活化槽 電鍍槽中和槽熱D. I.水烘乾SOLDER PLATING (S/P 區 )ELECTRO DEFLASH (E/D區 )面板操作ConfidentialPurpose: Remove the tie-bar and lead-frame and form products to units from strips, fill
11、 them into tubes and then pass to next process.Trim FormSaw work area unloadWorking area unloadLaser markingConfidentialTrim FormWorking areaLaser markingunloadunloadLead Cut FormingConfidentialQuality ControlDie Saw切偏Chipping外观检查划片宽度量测RejRejConfidentialLead FrameEpoxyDieQuality ControlDie ShearEpoxy Void CheckDie AttachConfidentialQuality ControlEpoxy Thickness & Fillet HeightDie AttachDie Location RejConfidentialQuality ControlWire Bond外观检查第二焊点重叠Rej Rej RejRej第二焊点偏移 线弧不良RejRejConfidentialDieQuality Control推球测试拉力测试Wire Bond
