1、USB3.0連接器高速傳輸測試要領 Presented by: LiTek Technologies (厘科科技 ) Leo Lee (李文福 ) USB3.0連接器高速傳輸測試要領 USB3.0 Compliance Group B-4 USB3.0 Connector Impedance USB3.0 Crosstalk USB3.0 Other Issues USB3.0 Compliance Group B-4 (1) Group B-4-1: D+/D- Pair Attenuation Group B-4-2: D+/D- Pair Propagation Delay Group
2、B-4-3: D+/D- Pair Propagation Delay Skew Group B-4-4: Differential Impedance (SS) of Mated Connectors Group B-4-5: Differential Insertion Loss (SS) of Mated Cable Assemblies Group B-4-6: Differential to Common Mode Conversion (SS) of Mated Cable Assembly Group B-4-7: Differential Near-End Crosstalk
3、between SS Pairs Group B-4-8: Differential Near-End and Far_End Crosstalk between SS and D+/D- Pairs Group B-4, Suitable only for USB3.0 Receptalces, Cable Plugs, Cable Assemblies USB3.0 Type A SMT Plug for Dongles should meet other Limits USB3.0 Compliance Group B-4 (2) Group B-4-4 Group B-4-5 Grou
4、p B-4-6 Group B-4-7, Type A: 0.9%; Type B:1.8%; Micro B:1.2% Group B-4-8, Type A: 2%; Type B:2%; Micro B:2% USB3.0 Compliance Group B-4 (3) Test Points and Range a) From TP1 to TP2 b) Receptacles Included c) SMA and Trace may be removed Rise-time: (50ps, 200ps and 500ps) a) BW=0.35/Tr= 50ps:7GHz; 20
5、0ps:1.75GHz; 500ps:0.7GHz. b) 50ps(20%80%): Group B-4-4 and Group B-4-7 c) 200ps(10%90%): Group B-4-2 and Group B-4-3 d) 500ps(10%90%): Group B-4-8 Frequency Range: (400MHz, 7.5GHz) a) 400MHz: Group B-4-1 b) 7.5GHz: Group B-4-5 and Group B-4-6 ECN 016: (USB3.0 Connector Crosstalk) a) Group B-4-7 and
6、 Group B-4-8 changed from Frequency to time domain. USB3.0 Compliance Group B-4 (4) Group B-4-1, Group B-4-2 and Group B-4-3 a) For D+/D-, High Speed Pair b) Follow original USB2.0 Specification Group B-4-4: (Mated Impedance of SS Pairs) a) 50ps(20%80%) rise-time. b) Range: 75105 Ohms Group B-4-5: (
7、Loss of SS Pairs) a) 7.5GHz, 3th or key frequency points. (5000/2 *3=7500) b) Key Points: 2.5GHz with 7.5dB limit. c) Include Connector and Cable areas. Group B-4-6: (Differential to Common Mode Conversion) a) EMI protection concern ECN 016: (USB3.0 Connector Crosstalk) a) Group B-4-7 and Group B-4-
8、8 changed from Frequency to time domain. USB3.0 Compliance Group B-4 (5) USB3.0 Type A SMT Plug Compliance Group B-4 a) Calibration plane changed to Coaxial end. Fixture effects are included into the results. b) Group B-4-1, Group B-4-2, Group B-4-3 for D+/D- Pairs c) Group B-4-4, rise-time changed
9、to 46.5ps(20%80%) d) Group B-4-5 with new limit e) Group B-4-6 removed, it is not easy to meet for connector only. Replaced by Intra-Pair Skew with 4ps limit. f) Group B-4-7, rise-time changed to 46.5ps(20%80%) g) Group B-4-8, rise-time changed to 493ps(10%90%) USB3.0 Connector Impedance (1) Group B
10、-4-4, Mated Connector Impedance for SS Pairs a) Type A Connectors b) Type B Connectors c) Type Micro B Connectors Connector Via hole and SMT Pad layout Host and Device Connector Area Impedance Testing For Type A Connector, Vbus and Gnd effect USB3.0 Connector Impedance (2) Type A Connectors a) Defin
11、ed as SSGSS, RX-, RX+, GND, TX-, TX+ (Not symmetric for each pair) b) For Single-ended Impedance concern, RX- and TX+ are larger than RX+ and TX-. c) With 2mm pitch for each SS pins, the connector width is very important to meet the impedance. d) GND Pin width is very important for Crosstalk Issue U
12、SB3.0 Connector Impedance (3) Type B Connectors a) Defined as SSGSS, TX-, TX+, GND, RX-, RX+ (Not symmetric for each pair) b) For Single-ended Impedance concern, TX- and RX+ are larger than TX+ and RX-. c) With 1mm pitch for each SS pins, the connector width is very important to meet the impedance.
13、d) GND Pin width is very important for Crosstalk Issue USB3.0 Connector Impedance (4) Type Micro B Connectors a) Defined as SSGSS, TX-, TX+, GND, RX-, RX+ (Not symmetric for each pair) b) For Single-ended Impedance concern, TX- and RX+ are larger than TX+ and RX-. c) With 0.65mm pitch for each SS pi
14、ns, the connector width is very important to meet the impedance. d) GND Pin width is very important for Crosstalk Issue USB3.0 Connector Impedance (5) Connector Via hole and SMT Pad Layout a) Via hole structure is very important for impedance control, remove Anti-Pads for inner layers. b) Remove SMT
15、 Pads reference Ground by suitable range. USB3.0 Connector Impedance (6) Host and Device Connector Area Impedance Testing a) Watch Impedance of Connector, via hole or SMT Pads area. b) Watch components near connectors. c) Watch Traces Impedance of SS Pairs. USB3.0 Connector Impedance (7) For Type A
16、Connector, Vbus and Gnd effect a) Vbus and GND let SS Pairs Impedance lower b) Vbus and GND let SS Pairs Insertion Loss lower c) Vbus Influences TX+ while GND (Pin4) influences RX- USB3.0 Crosstalk (1) USB3.0 Type A Crosstalk: a) SS Drain Wire (Pin7) Place an important role. (NEXT Between SS Pairs)
17、b) Let the distance of TX- and RX+ as far as possible. (NEXT between SS Pairs) c) Let D+/D- as close as possible, as thin as possible. (NEXT,FEXT between D+/D- and SS Pairs) d) Consider b) also helps for Crosstalk between D+/D- and SS Pairs. e) Let the distance of SS Pairs and D+/D- as far as possib
18、le. (NEXT, FEXT between D+/D- and SS Pairs) USB3.0 Crosstalk (2) USB3.0 Type B Crosstalk: a) SS Drain Wire (Pin7) Place an important role. (NEXT Between SS Pairs) b) Let TX+ and RX- as far as possible when leave the standard contact area. c) Let GND (Pin7) as wide as possible. d) It is not easy to r
19、educe the crosstalk, so the limit of B type is larger than A Type. (A Type is 0.9% while B type is 1.8%) e) Let the length of SS Pairs as short as possible. f) The NEXT and FEXT of D+/D- to SS Pairs are small since the distance is so far. USB3.0 Crosstalk (3) USB3.0 Type Micro B Crosstalk: a) SS Dra
20、in Wire (Pin7) Place an important role. (NEXT Between SS Pairs) b) Let the wide of SS Pins as small as possible. c) Let the length of SS Pins as short as possible. d) Micro B Plugs crosstalk is larger than Micro B Receptacle e) D+/D- and SS Pairs are not in the same area. USB3.0 Crosstalk (4) Crosst
21、alk other concerns: a) In Receiver side, CLTE (Equalizer function) will also enlarge the crosstalk effects. b) Crosstalk in Type B side, 1.8% means 1000 * 0.18=18mV. The Eye height in Receiver side should be larger than 100mV. It means the crosstalk here is 18%. c) When a USB3.0 Hubs connected to ho
22、st, both D+/D- and SS Pairs will be running. In this case, crosstalk between D+/D- and SS pairs are under consideration. USB3.0 Other Issues (1) Testing Compliance Group B-4 by Tektronics TDR a) It is more critical for impedance while calculating multi-reflection effects. Testing Compliance Group B-
23、4 by Agilent ENA TDR a) At least with 4Port and 8.5GHz Test Board and TRL Calibration Kit for Group B-4 USB3.0 Other Issues (2) Group B-4-1, B-4-2, B-4-3 are easy to pass. a) Most of effects are from Cable Assembly. So, a good cable will meet these. Group B-4-4 depends on connector, plug and wire ma
24、nagements. Group B-4-5 depends on both cable and connector, but the effect of cable is larger than connector area. Group B-4-6 also depends on both cable and connector. When the cable is shorten, it is not easy to pass. That is why Type A SMT plug testing will be not included with this item. Group B
25、-4-7 and B-4-8 depend on connector area. USB3.0 Other Issues (3) Group B-4-1, B-4-2, B-4-3 are easy to pass. a) Most of effects are from Cable Assembly. So, a good cable will meet these. Group B-4-4 depends on connector, plug and wire managements. Group B-4-5 depends on both cable and connector, but
26、 the effect of cable is larger than connector area. Group B-4-6 also depends on both cable and connector. When the cable is shorten, it is not easy to pass. That is why Type A SMT plug testing will be not included with this item. Group B-4-7 and B-4-8 depend on connector and wire management area. a)
27、 The breakout distance for wire termination should be kept as small as possible for both EMI and Signal Integrity. USB3.0 Other Issues (4) USB3.0 Raw Cable Length a) 1M: 30AWG/32AWG for SS Pairs. b) 2M: 28AWG for SS Pairs. c) 3M: 26AWG/28AWG for SS Pairs. USB3.0 Raw Cable SCD21 Issue a) Under -25dB for application length. b) = USB3.0 Raw Cable Breakout Distance for each SS Pair a) Less than 4mm after SDP Structure b) Less than 2mm with Insulation c) Less than 2mm only conductors 2MM 2MM SCD12=1/2(S13+S23-S14-S24)
