1、1Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyElectronic packaging material team2012.02EMC Training MaterialEMC培 训资 料2Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyContents 目 录1. Abstract 摘要2. Raw Material 原材料3. Manufacture 制造4. Properties & Characteristi
2、c 特性5. Common Mold-ability Problem & Possible remedies常 见 注塑 问题 及建 议3Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyAbstract 摘要4Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyWhat is inside EMC? EMC中有什 么Epoxy Resin环氧树 脂OCH2CHCH2OR环氧树 脂的特性1. Resin as a thermo
3、setting resin suitable for EMC热 固性 树 脂适合用于 EMC2. Excellent mechanical strength.很好的机械强度3. easier than ceramic can be used as general-purpose resin与 陶瓷相比制作 简单 ，通用性强4. In various types of resins have been developed树 脂 种类 多5. Hardener systems have been studied in several resin.可 选择 的硬化 剂种类 多EPOXY MOLDIN
4、G COMPOUND5Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyMake a framework in the shape of the molding process is a constant.使得注塑工 艺 固定Some of Semiconductor Packaging Process一些半 导 体的包封工 艺What is inside EMC? EMC中有什 么EPOXY MOLDING COMPOUND6Value InnovationFirst ! Best ! Smart !The
5、 Best Fine Chemical CompanyOrganic & inorganic compounds 有机和无机化合物Organic 有机Epoxy Resin 环氧树 脂Hardener Resin 硬化 剂Silicone 有机硅Wax ；蜡Organic Flame Retardant 有机阻燃 剂Catalyst 催化 剂Silica 硅微粉Inorganic Flame Retardant无机阻燃 剂Inorganic 无机Coupling Agent偶 联剂Colorant着色 剂What is inside EMC? EMC中有什 么EPOXY MOLDING COM
6、POUND7Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyEpoxy Mold Compound Roles EMC的作用 Protect the electric component from the environment (moisture, temperature, contamination, and etc). 保 护电 子元器件不受 环 境影 响 (湿 度， 温 度， 污 染等 ) Protect the chip from mechanical shock.保 护 芯片不受撞 击 Prov
7、ide structure and support.提供 结构 支撑 Provide electrical insulation.提供 电绝缘 性 Heat dissipation on the package operation 包封 过 程中易于 热扩 散Good EMC should have:好的 EMC应该 包含：1. Good Moldability 好的成模性 Good visual inspection No visual defects like incomplete fill, mold voids, flash, wax stain, sticky, etc.好的 视觉检
8、查 能力 -没 有 视觉 缺陷如 为填 充， 气 孔，毛刺，油 污 ，粘模等 Good wire sweep performance, Good delamination performance 好的金 线 冲歪和分 层 表 现 Fast curing 快速固化2. Good Reliability 好的可靠性 Good moisture resistance (PCT Test) 好的潮 湿 抵抗性（ PCT测试 ） Good thermal shock resistance (TC Test) 好的抗 热 冲 击 性（ TC测试 ） Others reliability testing 其
9、他可靠性 测试8Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyCatalyst 催化 剂Accelerate reaction speed 加速反 应进 程Below 0.5% Coupling Agent 偶 联剂Bonding between resin & filler使得 树 脂 与 硅粉 键 合Below 1% Flame retardant 阻燃 剂To meet UL-94 requirement达 到 UL-94标 准1 5%WaxProvide release between mold
10、& EMC促使 EMC与 模具分离Below 0.5%Low stress absorbers低 应 力吸收 剂Reduce stress 减 少 应 力Below 3%Colorant 着色 剂Coloring , Marking 着色 ,印字below 0.5%Composition of EMC and their Functionalities EMC的 组 分及其作用Epoxy + Hardener环氧树 脂和硬化 剂Provide cross linking reaction提供交 联 反 应10 30%Silica硅粉Give the strength提供强度72 90%9Val
11、ue InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyWhat is the Cross-linking reaction ? 什 么 是交 联 反 应10Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyWhat is the Cross-linking reaction ? 什 么 是交 联 反 应A-Stage A阶 段Raw material原材料B-Stage B阶 段EMC TabletEMC饼 料C-Stage C阶 段
12、After Molding封装好后C-Stage C阶 段After PMC后烘 烤 后11Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyRaw Material 原材料12Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyEpoxy Resin 环氧树 脂OCN (Ortho-Cresol Novolac 邻 甲 酚酚醛 ) Bi-phenyl 联苯 型Multi-Functional (TPM) 多官能 团DCPD
13、(Di-Cyclopentadiene) 环 戊二 烯Multi-Aromatic (Bi-phenyl contained) 多 环 芳 烃CH 2O C H 2 CH CH 2OCH 2O C H 2 CH CH 2O( ) nO C H 2 CH CH 2OCH 3 CH 3 CH 3- Low cost, Good mold-ability 低成本，好的成模性- Middle Tg, reactivity, water absorption 中等 Tg，反 应 性和吸水性- Application :应 用 TR, DIP, PLCC, SOP, QFP O C H 2 CH CH 2
14、OCH 2 OCHCH 2O CH 3CH 3CH 3CH 3- Lowest Viscosity , High Cost & Adhesion 低粘度 ,高成本高 结 合力- Low Tg, reactivity, water absorption, Modulus 低 Tg,反 应 性，吸水率和模量- Application应 用 : Thin PKG薄型封装 (TSOP, TQFP, TQFN, FBGA etc) CH 2 OCHCH 2OCHO C H 2 CH CH 2OO C H 2 CH CH 2OOCH 2CHO C H 2CHO C H 2 CH CH 2O( ) n- H
15、ighest Tg, reactivity, water absorption, Heat resistance-最 高 Tg，反 应 性，吸水率和抗 热 性- High Cost, Low warpage, 高成本和低 翘 曲- Application应 用 : TR (High voltage) , BGA- Low water absorption 低吸水率- High adhesion, toughness, flame retardancy 高 结 合力， 刚性和阻燃性- High curability 高固化性- Low water absorption 低吸水性- High ad
16、hesion 高 结 合力- High toughness 高强度O C H 2 C H C H 2OC H 2 C H 2O C H 2 C H C H 2OHnBrominated Epoxy (Br-epoxy) 溴 化 环氧树 脂CH 2O C H 2 CH CH 2OCH 2O C H 2 CH CH 2O( ) nO C H 2 CH CH 2OB r B r B r- Flame retardancy 阻燃性好13Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyEpoxy Resin (con
17、t.) 环氧树 脂Summary Properties Level of Epoxy resin 总结 环氧树 脂的特性水准Resin树 脂Viscosity粘度TgWater Absorption吸水率Adhesion结合力Modulus模量OCN 2 3 2 3 2Biphenyl 5 6 4 1 4Multi-functional 1 1 1 4 1Naphthol 1 2 5 2 3DCPD 3 4 3 2 3Multi-aromatic 4 5 4 1 514Value InnovationFirst ! Best ! Smart !The Best Fine Chemical Co
18、mpanyHardener Resin 硬化 剂PN (Phenol Novolac) 酚醛树 脂 Xyloc 低吸水性Multi-Functional (TPM) 多官能 团 Multi-Aromatic (Bi-phenyl contained)多 环 芳 烃- Low cost, Good mold-ability 低成本，好的成模性- Middle Tg, reactivity, water absorption 中等 Tg，反 应 性和吸水率- Application 应 用 : TR, DIP, PLCC, SOP, QFP- High Cost & Adhesion 高成本和高
19、结 合力- Low Tg, reactivity, water absorption, Modulus 低 Tg，反 应性，低吸水率和低模量- Application 应 用 : Thin PKG薄型封装 (TSOP, TQFP, TQFN, FBGA etc) - Highest Tg, reactivity, water absorption, Heat resistance最高的 Tg，反 应 性，吸水率和 热 抵抗率- High Cost, Low warpage, 高成本，低 翘 曲- Application应 用 : TR (High voltage) , BGA- Low wat
20、er absorption 低吸水性- High adhesion, toughness, flame retardancy 高 结 合力，高韧 性，高 难 燃性- High curability 高固化性CH 2 CH( ) nOH OH OH2CH 2( ) nOH OHCH 2 CH 2OHCH 2CH CH( ) nOH OH OHOH OHO HC H 2 C H 2O HnO HC H 2 C H 215Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanySilica 硅粉B. Manufactur
21、ing Process of Silica 硅粉生 产 工 艺 C. Shape of Silica particle 硅粉 颗 粒的形 状Spherical 球形 Angular 角形Advantage 优 点 Disadvantage 缺点Reduced Shrinkage , Improved Toughness & Abrasion Resistance降低收 缩 率，提供粗糙度和抗磨 损 性Reduced CTE & Water Absorption , Increased Thermal Conductivity减 少 CTE和吸水率，增加 热传导 率Increased Visco
22、sity & Weight & Dielectric Constant增加粘度和重量和介 电 常 数Matching Difficulties 匹配 难A .Characteristic of Silica 硅粉性 质Flow-ability流 动 性Up Down16Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyUsually consist of a combination of two or more, and make choice suitable combination for maximum
23、 flow- ability.通常 两 到更多 种 硅粉粒度 组 合可以更好的提供流 动 性D. Loading of Silica 硅粉的堆 积 装 载E. S.S.A (Specific Surface Area 比表面 积 ) of SilicaContents of Silica (wt %)72 76 80 84 88PropertiesF. Relationship between silica conts. & EMC properties填 料含量 与 EMC特性的 关 系S.S.A UpSmaller the average particle size减 小平均粒 径More
24、 the fine particle加大小 颗 粒的比例Lower the level of spherical降低球形度Silica (cont.) 填 料含量17Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanySiR1O R1OR1OHH H(CH2)3OCH2CHCH2OInorganic material (Silica)surface 硅粉表面OrganicFunctionInorganicFunctionEpoxy, Amino, Mercapto环氧 基， 氨 基和 巯 基Ethoxy, Me
25、thoxy乙 氧 基，甲 氧 基ex) Epoxy Func.A. Object 功能1. Coupling between organic resin and inorganic filler把有机 树 脂和无机硅粉 连 接起 来2. Adhesion improvement of EMC with L/F and other metal surface(Ag, Au) 提高 EMC与 LF和其他金 属 表面的 结 合力B. Treatment method 处 理方法1. Master Batch with resin 与 母体 树 脂混合2. Dry mixing with silica
26、 与 硅粉干混合Coupling Agent 偶 联剂18Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyA. Object 功能 : Reaction rate control of epoxy and hardener 调 控 环氧树 脂和硬化 剂 的反 应 速度C. Treatment method 处 理方法1. Master Batch with resin 与 母体 树 脂混合2. Dry mixing with other raw materials 与 其他原材料干混和B. Kinds 种类
27、Catalyst 催化 剂Kinds MW Property 特性 Molecular Structure 分子 结构P 262.3 mp = 86Imidazole咪唑 82 mp = 140N 152 bp = 240Patent专 利 658.6 mp = 300P 3N NP + -B 4 419Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyAccelerating of reaction加速反 应Case 1 : Attack Epoxy ring进 攻 环氧树 脂 环Amine, Imidaz
28、ole typeCase 2 : Attack Phenol进攻苯酚Organo Phosphine typeD. Curing Mechanism 固化机理R1 CH CH2 O R2OHR1 CH CH2 + HO R2OEpoxy PhenolR1 CH CH2OR1 CH CH2 O R2O OHCH2 CH R112Catalyst (cont.) 催化 剂 含量20Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyBase Resin基本 树 脂Modifier调节剂Sea-Island Stru
29、cture 海 岛结构Inter Penetrating 互相交 联 的 网状结构Networks Structure+ Resin 树 脂Resin 树 脂(Terminated) 终结A. Object 功能 Stress relaxation. 释 放 应 力Modifier (Low Stress Additive) 调节剂 （低 应 力 剂 ）21Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyB. Silicone Oil 硅油Ex 1) Side-chained Epoxy 单边侧链环氧树 脂
30、Modifier (Low Stress Additive) 调节剂 （低 应 力 剂 ）22Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyC. Silicone Powder(有机硅粉末 )1. Methyl silicone powder : Low stress, Low water absorption, Average particle size=20甲基型有机硅粉末：低 应 力，低吸水率，平均粒 径 =20um2. Silicone rubber : Low stress, Average p
31、article size=5有机硅橡 胶 ：低 应 力，平均粒 径 =5umD. MBS (Metacryl-Butadiene-Styrene) Copolymer : Core-Shell structureMBS(间甲酚 - 丁二烯 - 苯乙烯 ) 共聚物：核 -壳结构Shell : PMMA 壳 ： PMMACore : Butadiene-Styrene Copolymer核： 丁二烯 - 苯乙烯共聚物 Average particle size=102 , Resin Master Batch平均粒 径 =102um，母体 树 脂Modifier (Low Stress Addit
32、ive) 调节剂 (低 应 力添加 剂 )23Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyA. Releasing mechanism 脱 模机理By heating 通 过 加 热Wax Layer 蜡 层PackageMOLDDemolding 脱 模WAX 蜡24Value InnovationFirst ! Best ! Smart !The Best Fine Chemical Company Brominated Epoxy 溴 化 环氧树 脂 Antimony Trioxide 三 氧 化
33、二 锑Sb2O3 + 2HBr 2SbOBr + H2O Carbonization layer formation by dehydration 脱 水后形成 碳 化 层 SbOBr : Pick up free-radical of chain RXN 接收 RXN链 上的自由基 SbBr3 : Prevent for oxide 阻止 氧 化Sb(n-1)OnBr or nSb(n-2)O(n-1) + SbBr3(Gas)A. Kinds 种类HBr Oxidation Radical RXN氧 化反 应 的自由基Preventing 阻止PackageMelting Sb2O3 La
34、yer Sb2O5+ O2B. Mechanism 机理Flame Retardant 阻燃 剂25Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyEMC ManufactureEMC制造26Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyHow to Manufacture EMC? 如何生 产 EMCMixer混合机RAW MATERIAL WAREHOUSEHammer MillS-45C Mini Ram SKH
35、-55Pipe line 传输 管道RAW MATERIAL SUPPLING 原材料供体 设备STORAGE & WEIGHING 储 存和称 重MOVING BIN 转 移箱KNEADING 混 炼COOLING 冷却CRUSHING粉碎PELLETIZER 打 锭原材料 仓库54321RMetal Detector 1 金 检 机 1Weight Detector重量 检查 机Metal Detector 2金 检 机 2 KTMCPOWDER WAREHOUSE 半成品 仓库Magnetic Separator磁分离器UTILITY ROOM设备 控制室BLENDING 混合27Val
36、ue InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyMixerSilica硅粉Epoxy环氧树 脂Hardener硬化 剂Flame Reardant阻燃 剂Wax蜡Additive添加 剂 Colorant着色 剂 Catalyst催化 剂Mixed in a powder state以粉末 状态 混合Control Room 控制室 Automated Control facility (4th floor)自 动 控制 设 施Weighing & Mixing 称 量和混合28Value InnovationF
37、irst ! Best ! Smart !The Best Fine Chemical CompanyImportant Kneading Settings:重要的混 炼参数设 定Kneading temperature 混 炼温 度Kneading Pressure 混 炼压 力Screw RPM 螺杆 转 速Screw design 螺杆 设计Kneading 混 炼Control Temp. (until 100 )控制 温 度 (100 )Mixing Powder 混合粉末Melted Mixing State熔融 状态 混合Crushing 粉碎Sheet 薄片 Cooling B
38、elt冷却 带Cold Air 冷空 气Cold Air 冷空 气Twin Screw Extruder 双 螺旋 挤 杆Powder State (Semi Product, Particle size below 1 mm)粉末 状 (半成品，粒 径 ： 1mm)29Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyPowder 粉末Press 压 力Press 压 力Pelletizing Product 锭状 成品KTMC-5800GXJC9071500115 KGProduct SizeInspection 检查Visual Check 外 观检查Weigh Check 重量 检查Height Check 高度 检查Shipment 运输Pelletizing & Packing 打 锭 和包装30Value InnovationFirst ! Best ! Smart !The Best Fine Chemical CompanyEMC Properties & CharacteristicEMC的特性
