1、5544332211D DC CB BA ACPU SIGNALDDR3 MEMORYeMMC, SPI NOR FLASHSD CARD, SATALVDS, HDMIEPCD EXP PORTSCAMERA, EXP PORTSENSORSAUDIOUSBEHTERNETJTAG, DEBUGmPCIe CONNAUX SDIO CONN, CANGPS MODULEAUX VOLT REGTable of ContentTITLE PAGECPU POWERPage 1Page 2Page 3Page 4Page 5Page 6Page 7Page 8Page 9Page 10Page
2、11Page 12Page 13Page 14Page 15Page 16Page 17Page 18i.MX6 SMART DEVICE SYSTEMX1Revision HistoryRev. Code Date Description11/02/2011 Rev X1 Draft1. Unless Otherwise Specified:All resistors are in ohms, 5%, 1/16 WattAll capacitors are in uF, 20%, 50VAll voltages are DCAll polarized capacitors are Tanta
3、lum3. Interrupted lines coded with the same letter or lettercombinations are electrically connected.4. Device type number is for reference only. The numbervaries with the manufacturer.5. Special signal usage:_B or n Denotes - Active-Low Signal HIGH within electric specification. If using aCODEC othe
4、r than the one used in this design, it maybe possbile to switch pull up resistors back to 4.7K.I2C3_SDAI2C3_SDAI2C3_SDAI2C3_SCLI2C3_SCLI2C3_SCLGEN_3V3GEN_3V3GEN_1V8GEN_1V8 GEN_3V3 GEN_3V3I2C1_SCL3I2C1_SDA3CSI0_SCL 8CSI0_SDA 8I2C2_SCL3I2C2_SDA3MIPI_I2C_SCL 8MIPI_I2C_SDA 8I2C3_SDA3I2C3_SCL3 LVDS1_EDID
5、_SCL 7LVDS1_EDID_SDA 7LVDS1_TOUCH_SCL 7LVDS1_TOUCH_SDA 7LVDS0_EDID_SCL 7LVDS0_EDID_SDA 7LVDS0_TOUCH_SCL 7LVDS0_TOUCH_SDA 7HDMI_DDC_CLK_IN 3,7HDMI_DDC_DAT_IN 3,7LCD_I2C_SCL 9LCD_I2C_SDA 9EPDC_I2C3_SCL 9EPDC_I2C3_SDA 9CODEC_I2C_CLK 10CODEC_I2C_DAT 10TS_SCL 9TS_SDA 9ACC_SCK 14ACC_SDA 14DEC_SDA 14DEC_SC
6、K 14ALS_SCK 14ALS_SDA 14BAR_SCK 14BAR_SDA 14PCIe_SMB_CLK 16PCIe_SMB_DATA 16CSPI1_MOSI3CSPI1_CLK3 CSPI1_CS03SPINOR_MISO 5,15SPINOR_CLK 5,15 SPINOR_MOSI 5,15 SPINOR_CS0 5,15CSPI1_MISO3EPDC_MISO 9EPDC_CSP1_CLK 9 EPDC_MOSI 9 EPDC_CS0 9PMIC_SCL 19PMIC_SDA 19CSI2_SDA 8CSI2_SCL 8Drawing Title:Size Document
7、 Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SOURCE:SCH-27392 PDF:SPF-27392 C3MCIMX6Q-SMART DEVICE PLATFORMCTuesday, February 19, 2013COMM CHANNEL STEERING22 25_ X_R154 0R63 0R11 0R153 0R188 0R71 0R182 0R12 0R204 0R181 0R205 0ABR590 0R517 0R193 0R200 0R521 0R202 0R39 0R18
8、7 0ABR586 0R1694.7KR198 0A BR173 0R203 0R550 0A BR176 0DNPABR584 0R1704.7KA BR177 0R1784.7KR1892.37KA BR175 0R622 0ABR583 0R1794.7KR306 0R1832.37KR580 0R117 0A BR174 0DNPR621 0R23 0R116 0A BR172 0R53 0R190 05544332211D DC CB BA ABuild Option:MCIMX6Q-SDPMCIMX6DL-SDPBuild Option:MCIMX6Q-SDBExtra Bulk
9、Capacitors not populated:C39, C54, C68, C606, C607, C608, C609, C610, C611, C612, C673, C6813.BlueTooth Connector Isolation Resistors:R209, R210, R211, R212, R213, R214, R2154.Extra Bulk Capacitors not populated:C39, C54, C68, C606, C607, C608, C609, C610, C611, C612, C673, C68110. BlueTooth Connect
10、or Isolation Resistors:R209, R210, R211, R212, R213, R214, R2159.4.5.6. EPDC Port Connector not populated:J5087.Audio Block Components not populated:C1, C128, C558, R569, R573, U501, U510, U5218.Ambient Light Sensor not populated:C108, R184, R185, R188, R190, R191, U17GPS Module not populated:C115,
11、C118, C764, C765, J12, L22, L23, Q516, Q517, Q518,Q519, R186, R192, R194, R664, R668, R669, R671, R672,R673, U191.1.CAN Output not populated:J102. OverVoltage Protection circuit not populated:(OverVoltage Protection provided by battery charge ICs)D5, D500, D501, D502, D503, J501, Q1, Q6,Q503, R1, R2
12、, R3, R303, R500, R505, R520, R524, SW32.Battery Charging circuit not populated:C507, C508, C510, C511, C512, C513, C514, C515, C517, C518,C520, C521, C526, C527, C528, C529, CON2, CON3, L502,L503, R512, R513, R514, R515, R516, R518, R519, R527,R528, R530, R531, R532, R533, R534, R535, R536, R537,R5
13、38, R539, R542, R565, R577, R729, RT500, RT501, U502, U5033. SPI NOR Flash not populated:C83, R149, R643, R646, U14MIPI Display/Camera Expansion Ports not populated:C28, C29, C30, C50, C116, C117, C123, C124, C585, C587, C588,C602, J11, J5, L25, R26, R165, R173, R175, R726, U10CAN Output not populat
14、ed:J10Drawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SOURCE:SCH-27392 PDF:SPF-27392 C3MCIMX6Q-SMART DEVICE PLATFORMCTuesday, February 19, 2013BUILD OPTON TABLES23 25_ X_5544332211D DC CB BA APIN MUX TABLESDrawing Title:Size Document Number RevDate
15、: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SOURCE:SCH-27392 PDF:SPF-27392 C3MCIMX6Q-SMART DEVICE PLATFORMCTuesday, February 19, 2013PIN MUX TABLE24 25_ X_5544332211D DC CB BA AREV: Change: Reference Defect Number:B4 Removed buffers U500 and U520 from digital microphone data outputs. E
16、NGR00181056 ENGR00211969B4 The Battery Charge Done LED is disconnected and R522 is depopulated. New parts RX2, CX1 and UX1 are added. Traces show required hand modifications. ENGR00211943B4 Optional Power On Circuit has been disabled and U511 and R578 are now DNP. A new Diode DX1 has been added to a
17、llow EIM_D29 to sense a button ENGR00181039 ENGR00211948B4 RESET button SW2 now connects to The PWRON pin of The PMIC. ENGR00211979B4 Added 10K pull down resistor RX3 to SDCKE0 trace. ENGR00211962B4 SIM Card Connector CON1 is now populated by default. ENGR00224087B4 Battery Connector Header CON3 is
18、now populated by default. ENGR00224089B4 Changed resistors R174 and R176 and to depopulated by default. LVDS0 EDID will not be connected to I2C2 channel unless needed.ENGR00211965B4 Replaced digital microphones with Analog Devices ADMP421. ENGR00211964B4 Disabled USR_DEF_GRN_LED circuit. Configured
19、GPIO_1 for WDOG_B output. ENGR00211973C Q512 is Changed to populated. ENGR00211943C Optional Start Up Circuit has been modified. ENGR00181039 CPMIC Programming MicroProcessor is removed. ENGR00224090CAdd DNP Input to U13 buffer for USB_OTG_PWR_EN. Buffer now powered from GEN_3V3.ENGR00319341C FA_ANA
20、 and VDD_FA signals now connected to ground. ENGR00213511C Added resistor options to EIM_DA7 trace to EPD connector. ENGR00181054 ENGR00211953C Connected EIM_DA9 to EPDC Connector J508 to supply SDCE5 if needed. ENGR00213510C Optional LDO U9 is now depopulated. ENGR00224091C Added Connector J13 to s
21、upport BT from SDIO Card. Connector is isolated by DNP resistors on Rev C boards.ENGR00181035 ENGR00211946C Added GPIO control of Battery Charge Enable pins. ENGR00217643CChanged C594 to 0.22uF, changed C31 to 47uF, added C555 as second 22uF capacitor in parallel with C546, changed C561, C562, C586
22、and C596 to 0.47uF. Changes made per recommendation of MMPF0100NPEP team.ENGR00224093C Added additional 47uF bulk capacitor C769 to SD2 socket VDD supply. ENGR00224094C Added option to route HDMI DDC comms seperate from I2C2 comms channel. ENGR00215026C C597 populated to provide debounce to RESET ci
23、rcuit. ENGR00224095C Depopulated C68, C612. Populated C682, C716 closer to pins. ENGR00224096C Depopulated C39, C606, C607, C608, C609, C610, C673 and C681. ENGR00224097C Added DNP R302 to provide alternate 5V supply path to USB_H1_VBUS. ENGR00224098C Added DNP R632 to provide alternate gating of PM
24、IC_5V source (tied to VDDSOC).ENGR00224098C Added DNP L25 and L26 to provide alternate 2.8V supply path to camera modules.ENGR00224099C Added TP31, TP32, TP509, and TP510 to bring out third data lane for both LVDS0 and LVDS1.ENGR00214325 ENGR00214502CChange blocking capacitors C6 and C7 to Zero Ohm
25、resistors R307 and R308. PCIe specification requires blocking capacitors to be on transmit side of ENGR00226040C2 Depopulate L10 and L17. Move Ferrite beads to L25 and L26 ENGR00231769C3 Changed R97 and R106 pull up resistors to 4.7K to reduce current on VSNVS ENGR00237171C3 Changed R19 to 10K pull
26、up resistor to prevent WDOG reset during POR. ENGR00234394C3 Added note to BlueTooth connector that RXD and TXD traces are crossed. ENGR00239363TDA 4100TDA 4112TDA 41361. Digital microphone ANALOG DEVICES ADMP421was used in place of WOLFSON WM7230 due tosupply shortage. Affects U500 and U520.Replace
27、d TDA 41001. Digital microphone ANALOG DEVICES ADMP421was used in place of WOLFSON WM7230 due tosupply shortage. Affects U500 and U520.2. Q512 was depopulated due to schematic mistake.Removes battery charge from USB option.3. Depopulate R30 on MCIMX6DL-SD boards only.i.MX6DL Processor configured for
28、 Smart PMIC mode.Not compatible with board design. Removes SWability to shutdown the board.1. Solder a 0402 2.2M Ohm resistor across pins ofC55. Some i.MX6Q Processors require this resistorto stabalize the 24MHz crystal circuit, in order tostart up within the required time interval.HISTORY OF TEMPOR
29、ARYDEVIATIONSTDA 4221 (6DL) / TDA 4222 (6Q)1. Schematic revision B3 changed DDR3 memory to MT41K128M16JT-125:K. Due to unavailability of new part, this TDA autorizes the continued use of MT41J128M16HA-15.2. Change C540 to 1.0uF capacitor.3. Change resistors R183 and R189 to 2.37K Ohm resistors.TDA 4
30、2751. Remove buffers U500 and U520 from digital Microphone data signal. Replace with hand wire mod.2. Add WDOG_B reset capability (UX1, RX2, CX1).3. Add diode DX1 to EIM_D19 to allow GPIO sense ofpower button press.4.Change RESET button press to connect to PMIC PWRON pin. RESET press now causes glob
31、al reset.5. Add 10K pull down resistor RX3 to SDCKE0 pin.6. Depopulate Resistors R174 and R176 to disconnect LVDS0 EDID from I2C2 communications channel.7. Populate Battery Conector Header CON3.8. Populate SIM Card Connector CON1.9. Remove U1 from BOM (in preparation for next revision MX 6 silicon).
32、10. On MCIMX6DL-SDP boards, populate resistor R30with 1K Ohm resistor.CHANGE REVISIONDEFECT TRACKINGTDA 44251. Depopulate ferrite beads L10 and L17.2. Populate ferrite beads L25 and L26(wih Murata BLM18PG121SH1).TDA 45021. Change R17, R21, R25, R27, R68, R85, R582, andR660 to 0.5% resistors due to parts availability.Drawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SOURCE:SCH-27392 PDF:SPF-27392 C3MCIMX6Q-SMART DEVICE PLATFORMCTuesday, February 19, 2013TEMPORARY DEVIATIONS25 25_ X_
