1、WIRE BOND PROCESS INTRODUCTION,CONTENTS,ASSEMBLY FLOW OF PLASTIC ICWire Bond 原理M/C IntroductionWire Bond ProcessMaterial SPECCalculatorDEFECT,封裝簡介,晶片Die,金線 Gold Wire,導線架 Lead fram,Wafer Grinding,Die Bonding,Wafer Saw,toaster,Wire Bonding,Die Surface Coating,Molding,Laser Mark,Solder BallPlacement,Si
2、ngulation,Packing,封裝流程,Dejunk TRIM,Solder Plating,Solder Plating,Dejunk TRIM,TRIM/ FORMING,BGA,SURFACE MOUNTPKG,THROUGH HOLE PKG,Wire Bond 原理,pad,lead,Gold wire,Ball Bond ( 1st Bond ),Wedge Bond ( 2nd Bond ),Al,B.PRINCIPLE,銲接條件,HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time
3、) Welding Tempature (Heater) THERMAL BONING Thermal Compressure Ultrasonic Energy (Power),Bond Head ASSY,Low impact force Real time Bonding Force monitoringHigh resolution z-axis position with 2.5 micron per step resolutionFast contact detectionSuppressed Force vibrationFast Force responseFast respo
4、nse voice coil wire clamp,X Y Table,Linear 3 phase AC Servo motor High power AC Current Amplifier DSP based control platform High X-Y positioning accuracy of +/- 1 mm Resolution of 0.2 mm,W/H ASSY,changeover Fully programmable indexer & tracks Motorized window clamp with soft close feature Output in
5、dexer with leadframe jam protection featureTool less conversion window clamps and top plate enables fast device,Eagle,Bonding System Bonding Method Thermosonic (TS) BQM Mode Constant Current, Voltage, Power and Normal(Programmable) Loop Type Normal, Low, Square & J XY Resolution 0.2 um Z Resolution
6、(capillary travelling motion)2.5 um Fine Pitch Capability 35 mm pitch 0.6 mil wire No. of Bonding Wires up to 1000 Program Storage 1000 programs on Hard Disk Multimode Transducer SystemProgrammable profile, control and vibration modes,MACHINE SPECIFICATIONS (I),Eagle,Vision System Pattern Recognitio
7、n Time 70 ms / point Pattern Recognition Accuracy + 0.37 um Lead Locator Detection 12 ms / lead (3 leads/frame) Lead Locator Accuracy + 2.4 um Post Bond Inspection First Bond, Second BondWire Tracing Max. Die Level Different 400 500 umFacilities Voltage 110 VAC (optional 100/120/200/210/ 220/230/240
8、 VAC,MACHINE SPECIFICATIONS (II),Eagle,Material Handling System Indexing Speed 200 250 ms 0.5 “ pitch Indexer Resolution 1um Leadframe Position Accuracy + 2 mil Applicable Leadframe W = 17 75 mm bonding area in Y = 65mm= 17 90 mm bonding area in Y = 54mmL = 280 mm MaximumT = 0.075 0.8 mmApplicable M
9、agazine W = 100 mm (Maximum)L = 140 300 mmH = 180 mm (Maximum) Magazine Pitch 2.4 10 mm (0.09” 0.39 “) Device Changeover 4 minutes Package Changeover 5 minutes Number of Buffer Magazine 3 (max. 435 mm),MACHINE SPECIFICATIONS (III),Bonding Process,The Wire Bond Temp,PREHEAT BONDSITE CU L/F200+/-10 20
10、0+/-10 AL L/F210+/-10 230+/-10 BGA 150+/-10 160+/-10 TFBGA150+/-10 160+/-10 LBGA 150+/-10 160+/-10 NOT INCLUDE DEDICATE LINE,pad,lead,Free air ball is captured in the chamfer,pad,lead,Free air ball is captured in the chamfer,SEARCH HEIGHT,pad,lead,Free air ball is captured in the chamfer,SEARCH SPEE
11、D1,SEARCH TOL 1,Free air ball is captured in the chamfer,pad,lead,SEARCH SPEED1,SEARCH TOL 1,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,Free air ball is captured in the chamfer,pad,lead,SEA
12、RCH TOL 1,SEARCH SPEED1,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,IMPACT FORCE,Formation of a first bond Contact,pad,lead,heat,PRESSURE,Ultra Sonic Vibration,Formation of a first bond Base,pad,lead,Ultra Sonic Vibratio
13、n,heat,PRESSURE,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position
14、,pad,lead,RH,Formation of a loop,pad,lead,RD (Reverse Distance),Formation of a loop,pad,lead,pad,lead,pad,lead,Calculated Wire Length,WIRE CLAMP CLOSE,pad,lead,Calculated Wire Length,pad,lead,SEARCH DELAY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJEC
15、TORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,2nd Search Height,Search Speed 2,Search Tol 2,pad,lead,Search Speed 2,Search Tol 2,pad,lead,Search Speed 2,Search Tol 2,Formation of a second bond,pad,lead,heat,Formation of a second bon
16、d Contact,pad,lead,heat,heat,pad,lead,heat,heat,Formation of a second bond Base,pad,lead,pad,lead,pad,lead,pad,lead,Tail length,pad,lead,pad,lead,pad,lead,Disconnection of the tail,pad,lead,Disconnection of the tail,pad,lead,Formation of a new free air ball,Material,Leadfram Capillary Gold Wire,Lead
17、fram (I),Leadfram ( II ),CAPILLARY (I),Capillary Manufacturer(SPT, GAISER, PECO, TOTO)Capillary Data( Tip , Hole , CD , FA&OR , IC ),CAPILLARY (II),CAPILLARY (III),How To Design Your Capillary,TIP Pad PitchPad pitch x 1.3 TIP Hole . .Wire DiameterWire diameter + 0.30.5 = H CDPad size/open/1st BallCD
18、 + 0.4 0.6 = 1st Bond Ball size FA & OR.Pad pitch(um) FA 100 0,4 90/100 4,8,1190 11,15 IC type loop type,Gold Wire,Gold Wire Manufacturer(Nippon , SUMTOMO , TANAKA. )Gold Wire Data( Wire Diameter , Type , ),SPEC,Pad Open & Bond Pad PitchBall SizeBall ThicknessLoop heightWire PullBall shortCrater Tes
19、t,BPO&BPP,單位: um or Mil BPO :是指Pad內層X方向及Y方向的size,一般是取最小值為 我們的dataBPO :是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推;或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP,但是一般我們要取一個Die上最小的BPP,Bond Pad Pitch,Bond Pad Open,Bond Pad Open,Ball Size,Ball Thickness,Ball Size & Ball Thickness,單位: um，Mil量測倍率: 50XBall Thickness 計算公式60 um BPP 1/
20、2 WD=50%60 um BPP 1/2 WD=40%50%,Ball Size,Loop Heigh,單位: um，Mil量測倍率: 20X,Loop Height,線長,Wire Pull,1 Lifted Bond (Rejected)2 Break at neck (Refer wire-pull spec)3 Break at wire ( Refer wire-pull spec)4 Break at stitch (Refer stitch-pull spec)5 Lifted weld (Rejected),Ball Short,單位: gram or g/milBall S
21、hear 計算公式Intermetallic（IMC）有75%的共晶,SHEAR STRENGTH 標準為6.0g/mil。SHEAR STRENGTHBall Shear/Area (g/mil) Ball Shear = x; Ball Size = y; Area = (y/2) x/(y/2) = z g/mil,C,Ball bond,Test specimen,Specimen clamp,Shearing ram,Wire,Bond shoulder,Interfacial contact ball bond weld area,Bonding pad,h,(A) Unshear
22、ed,C,L,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Full ball attached to wire-except for regions of intermetallic voiding,Ball separated at bonding pad- Ball interface-residual intermetallic (and sometimes portion of unalloyed ball and metal) on pad in bond interaction area,(D) Ball bon
23、d-bonding pad interface separation (typical Au to Al),C,Test specimen,Specimen clamp,Shearing ram,Wire,Minor fragment of ball attached to wire,Bonding pad,C,L,Ball sheared too high (off line, etc.)only a portion of shoulder and ball top removed,Interfacial contact ball bond weld area,(B) Wire (ball
24、top and/or side) shear,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Major portion of ball attached to wire,Interfacial contact- ball bond weld area intact,(C) Below center line shear, ball sheared through (typically Au to Au),C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Pad m
25、etallization separates from underlying surface,Residual pad on ball ball-pad interface remains intact,(E) Bond pad lifts,Test specimen,Specimen clamp,C,Ball bond,C,L,Bonding pad,Bonding pad lifts, taking portion of underlying substrate material with it,(F) Cratering,Residual pad and substrate attach
26、ed to ball,ball-pad interface remains intact,Shear Failure Modes,Crater Test,Calculate (I),UP Time =,(Total Actual Production Times Total Repair Time ),Total Actual Production Time,DOWN TIME RATE=,Total Repair Time,Total Actual Production Times,Total Operator Actual Repair Time,Total Operator Repair
27、 Frequency Stoppages,Total Actual Production Times Total Operator Repair Time,Total Operator Repair Frequency Stoppages,Total Technical Actual Repair Times,Total Technical Repair Frequency Stoppages,MTTS (MEAN TIME TO STOP ) =,MTBS (MEAN TIME BETWEEN STOP)=,MTTA (MEAN TIME TO ASSISTANCE ) =,Calculat
28、e (II),MTBA (Mean Time Between Assistance) =,Total Actual Production Times Total Technican Repair Times,Total Technical Repair Frequency Stoppages,MTBF(Mean Time Between Failure)=,Total Actual Production Times Total Technician Repair Time,Total Change Parts Repair Frequency Stoppage,規格寬度,製程寬度,規格上限 -
29、 規格下限,6 ( 公差),(上限 or 下限 ) - 平均值,三個公差,CP ( 製程能力指標) =,CPK =,=,Quality,正常品Material Problem 1st Bond issue (Peeling , Ball Lift , Off Center)2nd Bond issue (滑針，縫點脫，short tail )Looping Fail (wire snake wire，sweep wire loop base bent ),正常品,Material Problem,With Ball,Wire,Pad Size,Missing Ball,Wire Broken,
30、Bonding Ball Inspection,Ball Detection,Ball Size,Pad Center,Ball Center,Ball Placement (X,Y),Ball Off Pad,Bonding Ball Inspection (cont.),Ball Measurement,Peeling,1st Bond Fail ( I ),Ball Lift,1st Bond Fail (II),Ball Lift,Neck Crack,1st Bond Fail ( III ),Off Center,1st Bond Fail (IV),Off Center Ball
31、,1st Bond Fail (V),Smash Ball,Smash Ball,With Weld,Wire,Capillary Mark,Missing Weld,Wire Broken,Lead,Bonding Weld Inspection,Weld Detection,2nd Bond Fail ( I ),滑針,2nd Bond Fail ( II ),縫點脫落,Looping Fail(Wire Short I),Wire Sweep,Looping Fail(Wire Short II),Loop Base Bend,Looping Fail(Wire Short III),Excessive Loop,Wire Short,THE END,
