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类型IGBT导热硅脂地涂抹及其表面粗糙度要求.doc

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    IGBT导热硅脂地涂抹及其表面粗糙度要求.doc
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    1、-_Thermal grease forInfineon modulesWhat should be the behavior and how agrease has to look like-_BaginskiIFAG AIM PMD ID AE2007-06-01-_ConsiderationsInfineon modules with baseplate: Roughness of baseplateRZmax. = 16 m;RZtyp. = 4 6 mInfineon modules without baseplate: Roughness of ceramicRZmax. = 9

    2、m; RZtyp. = 3 4 mHeatsink: Specification of roughness regarding Application NoteModules with and without baseplate: RZmax. = 10 m-_The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any descri

    3、ption of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and envi

    4、ronmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual pr

    5、operty rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 2-_ConsiderationsExample of roughness of baseplate and heatsinkBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsink-_The informa

    6、tion given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this c

    7、ommunication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Te

    8、chnologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Techn

    9、ologies 2006. All rights reserved. Page 3-_ConsiderationsThermal conductivity:Copper: 390 W / mKAluminium: 237 W / mKThermal compound: 1 W / mKCopperTIMAluminium= Thermal barrier-_The information given in this presentation is given as a hint for the implementation of the Infineon Technologies compon

    10、ents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before

    11、 implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation

    12、warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 4-_ConsiderationsRth CH metall Metal to Metal contact essential-_Diag

    13、ram with thermal grease Diagram with thermal greaseRth JCRth CHthermalgreaseRth HAR Rth greaseRth JCRth CH Rth CHthermalmetallgreaseRth HA| Rmetall th grease= Thermal grease that fills only the gapes is preferedThe information given in this presentation is given as a hint for the implementation of t

    14、he Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are t

    15、o beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind

    16、 (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 5-_ConsiderationsThermal grease consis

    17、ts of different componentsOily partsOnly needed to adjust the viscosity of the greaseThermal conducting partsNecessary to conduct baseplate and heatsink togetherBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsink-_The information given in this presentation is given as a hint for the implementation of the Inf

    18、ineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beve

    19、rified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (incl

    20、uding without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 6-_ConsiderationsThermal interface material:

    21、 Example for better understandingGrain size: Up to 70 m-_The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the

    22、Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must veri

    23、fy any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information g

    24、iven in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 7-_ConsiderationsExample: Thermal grease with 40 m size in applicationTemperaturedrop390 W/mKSmalltemp. dropBaseplateNo chance to moveOilypart1 W/mKBigtemp. drop Heat conductingpart237 W/mKSma

    25、lltemp. drop-_HeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. T

    26、he statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in

    27、 the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08

    28、Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 8-_ConsiderationsExample of grains of 40 m sizeGrease workslike distancespacers BaseplateHeatsink-_= RthCH = badThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies c

    29、omponents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user b

    30、efore implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limita

    31、tion warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 9-_ConsiderationsExample: Thermal grease with 5 m size in applic

    32、ationTemperaturedropBaseplateHeatsink-_The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technolog

    33、ies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function de

    34、scribed herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this prese

    35、ntation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 10-_ConsiderationsExample of grains of 5 m sizeHole to fix module with the heatsinkBaseplateHeatsinkMetal to metal contact possible-_= RthCH = goodThe information given in this presentation is given as a hint f

    36、or the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or sugges

    37、tion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties a

    38、nd liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 11-_Consider

    39、ationsViscosity of thermal grease: High viscosity (hard)BaseplateHeatsinkBaseplateHeatsinkDots ofgreasePermanentgap-_HeatsinkBaseplateThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any des

    40、cription of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and e

    41、nvironmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual

    42、 property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 12-_ConsiderationsViscosity of thermal grease: Low viscosity (fluid)BaseplateHeatsinkBaseplateHeatsinkDots ofgrease

    43、Greasecomesout-_HeatsinkBaseplateThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies co

    44、mponents. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function describe

    45、d herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentatio

    46、n.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 13-_ConsiderationsRoughness of heatsinkBaseplateRZtyp. = 6 mRZmax. = 1 mHeatsinkPermanent distance-_The information given in this presentation is given as a hint for the implementation of the Infineon Technologies co

    47、mponents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user be

    48、fore implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitat

    49、ion warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08 Baginski Copyright Infineon Technologies 2006. All rights reserved. Page 14-_ConsiderationsRoughness of heatsinkBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsinkCrossover possible-_The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certai

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