品 质 系 统 常 见 英 文 简 介.doc

1、 品 質 系 統 常 見 英 文 簡 介撰寫時間:2001/9/17 版本:1.21. QC : quality control 品質管制 2.IQC : incoming quality control 進料品質管制 3.OQC : output quality control 出貨品質管制4.PQC : process quality control 製程品質管制也稱 IPQC : in process quality control .5 . AQL : acceptable quality level 允收標準 6.CQA: customer quality assurance 客戶品

2、質保証7.MA : major defeat 主要缺點 8. MI : minor defeat 次要缺點9. CR :critical defeat 關鍵缺點 10. SMT : surface mounting technology 表面粘貼技術11 . SMD : surface mounting device SMC : surface mounting component 表面粘貼元件12 . ECN : engineering change notice 工程變更通知 13 . DCN : design change notice 設計變更通知14 . PCB : printed

3、circuit board 印刷電路板 15 . PCBA : printed circuit board assembly 裝配印刷電路板16 . BOM : bill of material 材料清單 17. BIOS : basically input and output system 基本輸入輸出系統18. MIL-STD-105E : 美國陸軍標準,也稱單次抽樣計劃.19 . ISO : international standard organization 國際標準化組織20 . DRAM: 內存條 21 . Polarity : 電性 22 . Icicles : 錫尖 23

4、. Non-wetting : 空焊24 . Short circuit : 短路 25 . Missing component : 缺件 26 . Wrong component : 錯件 27 . Excess component : 多件 28 . Insufficient solder : 錫少 29 . Excessive solder : 錫多30 . Solder residue : 錫渣 31 . Solder ball : 錫球 32 . Tombstone : 墓碑 33 . Sideward : 側立 34 . Component damage : 零件破損 35 . G

5、old finger : 金手指36 . SOP : standard operation process 標準操作流程 37 . SIP : standard inspection process 標準檢驗流程38 . The good and not good segregation :良品和不良品區分39 . OBW : on board writer 熸錄 BIOS 40 . Simple random sampling : 簡單隨機抽樣41 . Histogram : 直方圖 42 . Standard deviation : 標準差43 . CIP : Continuous imp

6、rovement program 44 . SPC : Statistical process control45 . Sub-contractors : 分包商 46 . SQE : Supplier quality engineering 47 . Sampling sample :抽樣計劃 48 . Loader : 治具 49 . QTS: Quality tracking system 品質追查系統50 . Debug : 調試 51 . Spare parts :備用品 52 . Inventory report for : 庫存表53 . Manpower/Tact estima

7、tion 工時預算 54 . Calibration : 校驗 55 . S/N :serial number 序號 56 . Corrugated pad : 波紋墊 57 .Takeout tray : 內包裝盒 58 . Outerbox : 外包裝箱 59 . Vericode : 檢驗碼 60 . Sum of square : 平方和 61 . Range : 全距62 . Conductive bag : 保護袋 63 . Preventive maintenance :預防性維護 64 . Base unit : 基體65 . Fixture : 制具 66 . Probe :

8、 探針 67 . Host probe : 主探針 68 . Golden card : 樣本卡69 . Diagnostics program : 診斷程序 70 . Frame : 屏面 71 . Lint-free gloves : 靜電手套 72 .Wrist wrap : 靜電手環 73 . Target value : 目標值 74. Related department : 相關部門75. lifted solder 浮焊 76.plug hole 孔塞 77. Wrong direction 极性反 ponent damage or broken 零件破損 79.Unmelet

9、ed solder 熔錫不良 80.flux residue 松香未拭 81.wrong label or upside down label 貼反 82.mixed parts 機種混裝 83. poor solder mask 綠漆不良 84. oxidize 零件氧化 85.stand off height 浮高 86. IC reverse IC 反向 87.supervisor 課長 88. Forman 組長 89. WI=work instruction 作業指導 90. B.P.V:非擦除狀態 91. Internal notification:內部聯絡單92. QP :Qua

10、lity policy 品質政策 93.QT: Quality target 品質目標 94. Trend:推移圖 95.Pareto:柏拉圖 96. UCL: Upper control limit 管制上限 97.LCL:Lower control limit 管制下限 98. CL: Center line 中心線 99.R.T.Y: Rolled throughout yield 直通率100. PPM: Parts per million 不良率 101.DPU: Defects per unit 單位不良率102.Resistor: 電阻 103.Capacitor:電容 104.

11、 Resistor array : 排阻 105. Capacitor array: 排容 106. DIODE: 二極管 107.SOT: 三極管 108. Crystal:震盪器 109. Fuse:保險絲 110.Bead: 電感 111.Connector:聯結器112.ADM: Administration Department 行政單位 113. CE: Component Engineering 零件工程 114. CSD :Customer Service Department 客戶服務部 115. ID: Industrial Design 工業設計 116.IE: Indu

12、strial Engineering 工業工程 117. IR: Industrial Relationship 工業關係118. ME: Mechanical Engineering 機構工程 119. MIS :Management Information System 資訊部 120. MM: Material Management 資材 121. PCC: Project Coordination/Control 專案協調控制 122. PD: Production Department 生產部 123. PE: Product Engineering 產品工程 124. PM: Pr

13、oduct Manager 產品經理 125. PMC: Production Material Control 生產物料管理 126. PSC: Project Support 輔助存儲器 161.Silicon chip:硅片162Diskette drive:軟驅 163.Display screen/Monitor:顯示器 164.Foreground:前面 165.Montherboard:母板 166.Mermory board:內存板 167.Slot:插槽168.Bus:Data-bus/address-bus/Control bus:總線/數據總線/地址總線/控制總線169.

14、Plotter:繪圖 170.MPC:Multimedia personal computer 多媒體171.Oscillator:振盪器 172.Automatic teller terminal:自動終端( 出納)機173.Joystick port:控制端口 174.VGA: Video Graphics Array 顯示卡175.Resolution:分辨率 176.Register:寄存器 177.ISA: Industry Standard Architecture:工業標準結構 178.EISA:Extended Industry Architecture 179.Adapter

15、: 适配器 180.Peripheral:外部設備 181.Faxmodem:調制解調器 181.NIC:Network interface card 網絡接口卡182.SCSI:Small computer system interface 183.VESA:Video Electronic Standards Association184.SIMM:Single in-line memory module 單排座存儲器模塊( 內存條) 185.Casing:外箱 186.Aluminum:鋁質 187.Ceramic: 陶瓷的 188.Platter:圓盤片 189.Actuator:調節

16、器 190.Spindle:軸心 191.Actuation arm: 存取臂 192.Default code: 缺省代碼 193.Auxiliary port:輔助端口194. Carriage return : 回車 195.Linefeed:換行 196.ASCII:American Standard Code for Information Interchange197.Video analog: 視頻模擬 198.TTL:Transistor- Transistor logic 晶體管-晶體管邏輯電路 199.Three-prong plug:三芯電插頭 200.Female co

17、nnector:連接插座201.Floppy disk:軟盤 202.Output level:輸出電平 203.Vertical/Horizontal synchronization:場/行同步 204.H(Horizontal)-Phase:行相位205.Compatible:兼容機 206.Hardware Expansion Card: 硬件擴充卡207.Buffer:緩沖 208.CRM:Customer relationship Management 客戶關係管理209.WIP: Work in process 半成品 210.Waiver:特別採用211.CXO 系列CEO: C

18、hief Executive Office 首 COO :Chief Operating OfficeCFO: Chief Finance Officer CBO: Chief Business OfficerCTO: Chief Technology Officer CIO: Chief Information OfficerCGO: Chief Government Officer 212.NASDAQ: 納斯達克證券市場 NASDAQ Automated Quotation system 213.VC:Venture Capital 風險投資214.PDA:Personal Date A

19、ssistant 個人數字助理 PLA: Personal Information Assistant 個人信息助理215.PPAP:Advanced Product Quality Planning and Control Plan 生產性零組件核准程序216.FMEA:Protentical Failure Mode and Effects Analysis 失效模式與效應分析217.MSA: Measurement Systems Analysis 量測系統分析218.QAS:Quality System Assessment 品質系統評鑑219.Cusum: 累計總合圖 220.Ove

20、rall Equipment Effectiveness 設備移動率221.Benchmarking:競爭標竿 Analysis of motion/Ergonomics 動作分析/人體工程學222.Roka Yoke 防錯法 MCR: machine capability ratio 機器利用率 223.Mistake Proofing 防呆法 Taguchi methods 田口式方法224,Vertical integration 垂直整合 Surveillance 定期追蹤審查225.EMS: Electronics Manufacturing Supply-chain226.Caus

21、e&Effects charts 特性要因圖227.Scattle: 散佈圖 Fool-Proof System 防呆系統 228.VE:Value Engineering 價值工程 QFP:Quality Function Development 品質機能展開229.Arrow Chart 箭頭圖法 Affiliate Chart 親和圖法230.PDPC:Process Decision Program Chart System Chart 系統圖法231.Relation Chart 關邊圖法 Matrix Chart 矩陣圖法232.Matrix Data Analysis 矩陣數據分

22、析法234.Brain-storm 腦風暴法 JIT: Just In Time:及時性生產模擬235.Deming Prize: 戴明獎 Prototype 技術試作236 BPM:Business Process Management .業務流程管理 MBO:目標管理 237. MBP:方針管理 FTA:故障樹分析 QSCV: 服務品質238.IPPB:Information 情況 Planning 策劃 Programming 規劃 Budget 預算239.EQ:Emotion Quotient:情商 IQ: Intelligence Quotient:智商240.Implied Ne

23、eds:隱含要求 Specified Requirement:規定要求241.Probation:觀察期 Incoming Product released for urgent production 緊急放行242.Advanced quality planning 先進的質量策劃 243. AOQ: Average Outgoing Quality 平均檢出質量 AOQL: Average Outgoing Quality Limit 平均檢出質量界限244.Approved Supplier List 經核准認可的供應商名單245.Attribute date 特征 Benchmarki

24、ng 基準點 Calibration 校準246.Capable process 工序能力 Capability Index 工序能力指數 Capability ratio 工序能力率247.CHANGE CYCLE TIME 修改的時間周期 Continuous improvement 持續改進248. Control plans 控制策劃 Cost of quality 質量成本249. Cycle time reduction 減少周期時間250. Design of experiments 實驗設計 Deviation / Substitution 偏差 / 置換251. ESD: E

25、lectrostatic discharge 靜電釋放252. EH&S: Environmental, Health, and Safely 環境,健康.安全253. ESS: Environmental Stress Screening 環境應力篩選254. FMEA: Failure Mode Effect Analysis 失誤模式效應分析255. First Article approval 產品的首次論證 First pass yield 一次性通過的成品率256. First sample inspection 第一次樣品檢驗257. FMECA: Failure mode ef

26、fect and critically analysis 失誤模式,效應及後果分析 258. Gauge control 測量儀器控制 GR&R: Gauge repeatability and reproducibility 測量儀器重復性和再現性259. HALT: Highly Accelerated Life Test 高加速壽命試驗 HAST: Highly Accelerated Stress Test 高加速應力試驗260. IN-CONTROL PROCESS 受控制工序261. INDUSTRIAL AVERAGE 工業平均數262. JIT (just in time) m

27、anufacturing (即時)制程263. Key characteristic 關健特征 Key component 關健構件264. Life Testing 壽命試驗 Lot traceability 批量可追溯性265. Material review board 原材料審查部門 MCR: machine capability ratio 機械能力率266. NONCONFORMANCE 不符合267. OUT-OF-CONTROL PROCESS 失控工序268. Pilot Application 試產(試用)269. PPM: Parts per million 百万分之一2

28、70. Preventive vs detection 預防與探測 Preventive maintenance 預防維護271. Process capability index 工序能力指數272. Process control 工序控制 Process improvement 工序改進 Process simplification 過程簡化273. Quality Clinic Process Chart (QCPC) 質量診斷過程圖274. Quality information system 質量資料體系275. Quality manual 質量手冊 Quality plan 質

29、量計劃 Quality planning 質量策劃276. Quality policy 質量方針 Quality system 質量體系277. Reliability 可靠性 RUN Chart 趨勢表 Skill Matrix 技能表278. Statistical quality control (SQC) 統計質量控制279. Teamwork 團隊工作280. Total quality management 全面質量管理281. Variable data 變量數據 Variation 影響變量282. Value Analysis 價值分析 Visual Factory 形象化

30、工厂283. Survey Instructions 調查指引284. Profile 概況285. Improvement Plan 改進計劃 286. Evaluation 評估 Implementation 實施 Compliance 符合287. Supplier Audit Report 供方審核報告288. Site Audit 現場審核289. Typical agenda 典型的議事日程290. Internal and external failure costs 內部和外部的失誤成本291. Failure rate percentage 失誤百分率292. Product

31、ivity (output / input) 生產率(產出/投入)293. Customer complaints 客戶投訴 Customer satisfaction indices 客戶滿意度指數294. Root cause analysis of failures 失誤根原分析295. SFCS:Shop floor control system296. Nominal:名目的297. Enumeration:列舉298. Screening stage:篩選階段299. Screening materials:屏蔽材料300. Nonparametric comparative ex

32、perimental:非參數實驗301. Pitfall:缺陷302. Fractional factorial experiments:部份隨機實驗303. Management by communication:溝通管理技術304. Management by objective:目標管理技術305. Management by result:績效管理技術306. Human relationship skill:人際技術307. Conceptial skill:理念性技術308. Safety stock:安全庫存309. lead time:訂購前置時間310. EOQ: Econo

33、mic order Quantity 經濟訂購量311. Run at rate:節拍生產312. Early production containment : 早期生產管制程序313. Accreditation Body:認可機構314. Active part 在用零件315. Aftermarket part 售后零件316. Analysis of Motion/Ergonomics:運動/人機工程學分析317. Finite Element analysis:有限元分析318. Geometric Dimensioning & Tolerancing:幾何尺寸與公差319. Mat

34、ch check 匹配檢查320. Last off part comparison:末件比較321. Simulation Techniques:倣真技術322. Solid Modeling:實體造型323. Layout Inspection:全尺寸檢驗324. Service Parts:維修零件325. Remote location:外部場所326. Overall Equipment effectiveness:設備總效率327. PPAP: production part approval process 生產件批准程序328. Bulk material:散裝材料329. P

35、erishable Tools:易損工裝330. Growth Projections:企業營運成長企劃331. Projected Sales figures:行銷企劃藍圖332. Human resource development:人力資源開發333. Feasibility Reviews:可行性審查334. Pre-launch:量產前335. Unscheduled machine downtime:非計劃排定的停機時間336. Excessive cycle time:作業周期時間過多337. Non value-added use of floor space:工廠內的無附加價

36、值事項338. New Target values to Optimized customer process:將顧客作業程序管理到最好的新目標值339. Misshipments:耽誤出貨340. Incomplete orders:交貨不足341. Inventory turns over time:存貨周轉時間342. Stock rotation :存貨周轉343. Inventory levels:最低庫存量344. Order-drive:訂單導向345. Interim action:臨時措施346. Permanent action:永久措施347. Integrators:組合體