1、Engineer 工程PE: Products Engineer; 生產工程 Process engineer 制程工程TE: Test Engineer 測試工程ME: Manufacturing Engineer; 製造工程; Mechanical Engineer 機械工程IE: Industrial Engineer 工業工程DCC: Document Control Center 文管中心BOM: Bill OF Material 材料清單ECN: Engineering Change Notice 工程變動公告TECN: Temporary Engineering Change N
2、otice 工程臨時變動公告ATY: Assembly Test Yield Total Yield 直通率TPM: Total Productivity Maintenance PM: Product Manager; Project ManagerECR: Engineering Change Request 工程變更申請ECO: Engineering Change Request 工程變更指令EN: Engineering Notice 工程通報WPS: Work Procedure Sheet 工作說明書ICT: In Circuit Test 電路測試P/R: pilot run;
3、 C/R control run T/R trial run 試做EVT: engineer Verification Test 工程驗証測試DVT: Design Verification Test 設計驗證測試MVT: Mass Verification Test 多項驗證測試ORT: On Going Reliability Test 出貨信賴性測試S/W:software 軟件H/W: hardware 硬件DCN: Design Change Notice 設計變更通知PVT: Production Verification Test 生產驗證測試MTF: Modulation Tr
4、ansfer Function 調整轉換功能CAT: Carriage Alignment Tool 載器調整具ID: Industrial Design 工業設計(外觀設計)PCBA: Printed Circuit Board Assembly 電路板組裝F/T: Function Test 功能測試CCD: Charge Coupled Device 掃描器之讀器ERS: External Reference Spec 外部規格PMP: Production Management Plan 工程管理計劃QA Quality Assurance 質量保證QRA :Quality Machi
5、ne; Material; Method 人,機,材,方法5M: Man; Machine; Material; Method; Mwasurment 人,機,材,方法,測量MTBF: Mean Time Between Failure 平均壽命TTL: TotalFIN Finance&Accounting 財務與賬目P&L: Profit & Lose PV : Performance Variance 現象差異3 Element of Cost = M,L,O M: Material 材料L: Labor 人力Overhead 管理費用Fix OH Fix Overhead 固定管理費用
6、Var OH Variable Overhead 不定管理費用COGS Cost Of Goods Sold 工廠製造成本AR: Account Receivable 應收AP: Account Payable 應支MIS Management Information System 資迅管理系統IS: Information System 資迅系統IT: Information Technology 系統技術MRP: Material Requisition Plan 材料需求計劃I2:Information Integration System 資迅整合系統SAP: System Appli
7、cation Programming 系統申請項目ERP: Enterprise Resource Programming 企業資源項目HR Human Resource 人力資源PR: Public relation 公共關係T/O: Turn Over Rate=Monthly T/O Total People*12GR: General Affair 總務Organization 組織HQ Head Quarter 總公司Chairmen 主席 Lite-On Group 光寶集團President總裁Executive Vice President 常務副總裁Vice Presiden
8、t 副總裁HR Human Resource 人力資源部FIN Finance 財務Sales 銷售R&D: Research & Developing 研發部QA: 質量保證 QA DQA CS MIS: Management Information System 資迅管理系統PUR 採購 PurchasingIMD: Image Management Division 影像管理事業部ITS: Information Technology System 電腦部QRA: Quality Reliability Assurance 品保部MFG: Manufacturing 製造部PMC: Pr
9、oduction & Material Control 生(產)物(料)管(理)Materials 材料PC: Production Control 生產控制MPS: Mass Production Schedule 量產計劃FGI: Finished goods Inventory 成品存貨UTS: Units To Stock 存貨單元WIP: Working In Process Inventory 在制品C/T: Cycle Time 循環時間,瓶頸WD: Working Days 工作天MTD: Month To Days 月初到今日(例如總表整理)YTD: Year To Days
10、年初到今日SO: Sales Order 銷售清單MO: Manufacture Order 製造清單BTO: Build To Order 訂單生產P/N: Part Number 料號MC: Material Control 材料控制MRP: Material Requisition Plan 材料需求計劃INV: Inventory 存貨清單Inv Turn Over Days=INVS/NSB X WD 庫存周轉天數PSI: Production Shipping Inventory 預備待出貨JIT: Just In Time 即時Safety Inventory 安全存量CKD:
11、Completed Kits Delivery 全件組裝出貨SKD: Semi Kits Delivery 半件(小件)組裝出貨W/H: Warehouse 倉庫Rec: Receiving Center 接收中心Raw MTL 原物料F/G: finish goods 成品Import/Export 進出口SI: Shipping Instruction 發貨指令PL: Packing List 包裝清單Inv: Shipping Invoice 出貨發票ETD: Estimate Arrive 預估離開時間BL: Bill of Landing 提貨單(海運)AWB: Air Way Bi
12、ll 提貨單(空運)MAWA: Master Air Way Bill 主提貨單HAWB: House Air Way Bill 副提貨單TEU: Twenty foot Equipment Unit(Contain) 二十英尺貨櫃FEU: Forty foot Equipment Unit(Contain) 四十英尺貨櫃CY: Container Yard 貨櫃場THC: Terminal Handing Charge 碼頭費ORC: Original Receiving Charge 碼頭費PUR: Purchasing 採購FOB: Free on Board 貨運至甲板(離岸價)CIF
13、: Cost Insurance Freight 成本+運費+保險OA: Open Account 開戶TT: Telegram Transfer 電匯COD: Cash On Delivery CRP: Cost Reduction Program 降低成本方案PR: Purchasing Requisition 採購申請PO: Purchasing Order 採購單MFG Manufacturing Production 製造生產DL: Director Labor 直接人工IDL: Indirect Labor 間接人工DLH: Direct Labor Hours 直接工時Produ
14、ctivity=UTS/DLH PPH: Pieces Per Hour 每小時件數Efficiency=Actual/Target(%)DT: Machine Down Time 停機時間AI: Auto Insertion 自動插入MI: Manual Insertion 人工插入SMD: Surface Mount Device 表面粘著零件SMT: Surface mount technology 表面粘著技術B/I: Burn In(for how many hours at how many degree) 燒機WI: Work Instruction 工作說明SOP: Standard Operation Procedure 作業指導書R/I: Run In 運轉機器ESD: Electrical Static Discharge 靜電釋放MP: Mass Production 量產
