1、金相样品制备与组织显示中术语的对应翻译-基于BUEHLER SUM-MET - The Science Behind Materials Preparation一书上传试验序号1.2. Polishing 抛光3. Mechanical Polishing4. disturbed metal 干扰金属5. pitting 坑洞6. dragging out of inclusions, “comet tailing”夹杂脱出，彗星拖尾7. staining 着色8. or relief (heightdifferences between different constituents, or
2、betweenholes and constituents或浮雕(不同相的高度不同或孔和组织高度不同，9. Edge Retention10.Sampling . 7Goals of Specimen Preparation 9Method Development . 9Sectioning . 10Abrasive Wheel Cutting . 10Precision Saws . 12Mounting of Specimens . 14Clamp Mounting 14Compression Mounting . 14Castable Resins for Mounting . 15Ed
3、ge Preservation 17Grinding 20Grinding Media 20Grinding Equipment . 22Polishing . 23Mechanical Polishing . 24Electrolytic Polishing . 24Manual “Hand” Polishing . 24Automatic Polishing . 25Polishing Clothes . 25Polishing Abrasives . 27Examples of Preparation Procedure 29The Traditional Method 29Contem
4、porary Methods . 29Procedures for Specific Materials 32Periodic Table of Elements 33Light Metals: Al, Mg and Be . 34Aluminum . 34Magnesium 36Beryllium 37Low Melting Point Metals:Sb, Bi, Cd, Pb, Sn and Zn 38Refractory Metals: Ti, Zr, Hf, Cr, Mo,Nb, Re, Ta, V and W . 40Titanium . 40Zirconium and Hafni
5、um 41Other Refractory Metals: Cr, Mo, Nb,Re, Ta, V and W . 43Ferrous Metals 45Copper, Nickel & Cobalt 48Copper . 45Nickel . 49Cobalt 50Precious Metals 51Thermally-Spray Coated Specimens 53Sintered Carbides . 55Ceramics. 57Composites . 59Printed Circuit Boards . 61Eletronic Materials . 62Polymers . 6
6、5Etching 67Etching Procedures 67Selective Etching 68Electrolytic Etching and Anodizing 71Heat Tinting . 71Interference Layer Method 72Commonly Used Etchants forMetals and Alloys 73Light Optical Microscopy 78The Light Microscope 79Microscope Components 79Resolution . 82Depth of Field 83Imaging Modes
7、83Microindentation Hardness Testing 87The Vickers Test . 87The Knoop Test . 88Factors Affecting Accuracy, Precisionand Bias 89Automation 91Image Capture & Analysis . 93Acquisition . 93Clarification . 96Operator Interactive Measurements . 96Automated Measurements 96Thresholding . 96Binary Operations . 98Common Applications . 99Laboratory Safety . 101
