1、WORK INSTRUCTION作 业 指 导 书DOC. No. / 文件编号:FIPEI-KCR-053REV./ 版本号:01PRODUCT/ 产品:KyoceraTITLE / 标题: Lead Free BGA_Reballing_Process_无铅 BGA 植球工艺流程PAGE/页数 1 of 11REVISION HISTORY / 版本记录REVISION版本CHANGE DESCRIPTION 修改内容ISSUER发布者RELEASE DATE发行日期01 First Issue Robert xiaAPPROVALDEPARTMENT NAME TITLE部门 名字 职位
2、AME Tonny Tong Senior EngineerPE Adam Wang Sr. EngineerMBU ZhongChun Mi SupervisorQA Jack ouyang EngineerREMARK备注Release one hard copy to MBU /送到一份到 MBUDMP-001-F2 . 01WORK INSTRUCTION作 业 指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reb
3、alling_Process无铅 BGA 植球工艺流程PAGE/页数:2 Of 121. Purpose/目的：This procdure provides instruction for lead free BGA reballing process该程序为无铅 BGA 植球工艺提供指导.2. Scope/范围：Applied to Flextronics Industry适用于伟创力实业.3. Equipment list/设备列表：3.1 Solder ball filling fixture .植球夹具3.2 Weller WSD81 ESD Lead free soldering I
4、ron/ Weller WSD81 防静电无铅烙铁3.3 Iron type:(FLX-400454-00)/烙铁嘴型号: (FLX-400454-00)3.4 Mini Ultrasonic cleaning machine (Type: CT-400A)/微型超声波清洗机(型号: CT-400A)3.5 BGA cleaning and Desoldering fixture(MSM6100)/BGA 清洗和脱锡夹具3.6 Microscope/显微镜3.7 JEDEC Matrix Tarys/ JEDEC 的阵列托盘3.8 SUN EAST TRF-200A Re-flow oven/
5、 SUN EAST TRF-200A 回流炉3.9 baking oven/烘烤炉3.10 HAKO 493 ESD SAFE SMOKE ABSORBER / HAKO 493 防备静电吸烟器.3.11 SRT 1800 4. Consumables list/耗材列表4.1 Cleaning solvent : IPA(FLX-1001100-00)/清洗液:工业酒精(FLX-1001100-00)4.2 No cleaning solder wick:(FLX-400412-00)/免洗吸锡线: (FLX-400412-00)4.3 ESD dustless cloth /无尘布4.4
6、Indium 58LS solder paste (96.5:3:05)/ Indium 58LS 锡膏(96.5:3:05)4.5 small shovel/ /印锡刮刀4.6 ESD tweezer/防静电镊子.4.7 Reflow oven carrier (stainless steel )/不锈钢过炉托盘WORK INSTRUCTION作 业 指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Pr
7、ocess无铅 BGA 植球工艺流程PAGE/页数:3 Of 124.8 TELECORE PLUS SAC305 Solder wire/ TELECORE PLUS SAC305 锡线4.9 Respirator/口罩4.10 Desiccant/干燥剂4.11 ACCURUS SCIENTIFIC solder ball (96.5:3.0:0.5)/ ACCURUS SCIENTIFIC 锡球(96.5:3.0:0.5)4.12 humidity indicator/湿度指示卡5. Procedure/ 步骤 Remind: 1) Make sure all the materials
8、 and tool are lead free complianly before reballing 2) only one kind of materials can be put on the production lick at same time ./植球前确认所有物料和工具适用无铅，2）同一时间只能有一种物料生产。5.1 process flow/ InspectionInspection b)lifted pads; c)missing pads; d)bunt package; e)chipped out BGA package/ a)pad 破损;pad 发黒; b)pad
9、翻翘; c)pad 掉;d)BGA 封装上有黑斑; e)BGA 封装破损5.2.5.4 If the BGA pads have the problems mentioned above, it should be scraped./ 如果BGA pad 有上述现象, 则必须报废5.2.5.5 After inspection put the BGA on the carrier for BGA baking/ 检查后将 BGA 放置在用来焗炉的托盘中WORK INSTRUCTION作 业 指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVI
10、SION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:5 Of 125.3 Appendix B:Cleaning package using A Ultrasonic cleaner/附录 B:使用超声波清洗 BGA 5.3.1 We will use 2/3 Cleaning solvent at Ultrasonic cleaner containing ,20 to 30 components at a time cleaning./ 超声波清洗机内
11、放入 2/3 的清洗液,每次清洗 2030PCS.5.3.2 Load the desolderinged BGA to the pot of ultrasonic cleaner./ 将脱锡好的 BGA 放入超声槽内.5.3.3 Turn on the ultrasonic to clean the BGA for 5 minutes at 25degree Celsius , then turn off it after 5 minutes./ 打开超声波清洗 BGA，时间 5 分钟，温度度, 然后停止清洗.5.3.4 After cleaning ,load the BGA to the
12、 tray.Pick up the BGA using ESD tweezer from tank./ 清洗完后将 BGA 取出,放入周转盘内.从槽里取出 BGA 应该使用防静电镊子.5.3.5 Check if there is no solder paste residue on the BGA surface,otherwise ,it shall becleaned again./ 检查 BGA 锡膏残留物是否清洗干净,否则再清洗一次.5.3.6hange the solvent once every 700 PCS BGA / 清洗液每 700PCS BGA 换一次。5.3.7Use
13、d Mini Ultrasonic cleaning machine (Type: CT-400A) power is 35w ./使用微型超声波清洗机( 型号: CT-400A) 功率是 35W.5.3.8 every time cleaning data note atFAPEI-026-F1.01 and every time change IPA note at FAPEI-031-F1.01./ 每次清洗数量记录在 FAPEI-026-F1.01 .并每次更换 IPA 记录在FAPEI-031-F1.01。5.4 Appendix C:Pre Baking Before Reball
14、ing Baking 4 hours at 125 degree Celsius before solder ball attach.Flow procedure IPC(Handling and storage of moisture sensitive components)in baking and storage of cleaned as reballing packages./ 干包装的程序按照 IPC的要求执行5.5 Appendix D: Solder paste print and solder ball attach /附录 D: 锡膏印刷和植球Setp1 solder p
15、aste print. /步聚 1 印锡膏WORK INSTRUCTION作 业 指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:6 Of 125.5.1.1 Load the BGA to the fixture. /将 BGA 放入 BGA 夹具上. 5.5.1.2 Printing the solder paste(Indium 5.8LS S
16、AC305) to the BGA surface by small Squeegee.Make sure the solder paste is uniform coved the pad./利用印锡膏夾具手动操作将锡锡膏(Indium 5.8LS SAC305)充钢网孔 ,确保锡膏漏印均匀 .5.5.2.3 Remove the printing stencil up,check if the solder solder are lied on all of BGA pad by microscope./ 移除印膏钢网,在显微镜下确认锡膏印在 BGA 焊盘上.Setp 2 Solder b
17、all attach/步聚 2 植球5.5.2.1Load BGA into fixture of solder ball filling . /将 BGA 平放在 BGA 技撑夹具中5.5.2.2Shake the fixture lightly to fill solder balls into stencil aperture ./ 利用植球夾具手动操作将锡球填充钢网孔.5.5.2.3 Remove the reballing stencil up,check if the solder balls are lied on all of BGA pad by microscope./ 移
18、除植球钢网,在显微镜下确认锡球放在所用的 BGA 焊盘上.5.5.3.BGA Reballing inspection/BGA 植球检查5.5.3.1. Get one BGA from carrier./ 从托盘上取一个 BGA.5.5.3.2 Using low power microscope, check BGA reballing have no drop green oil and so on./ 用显微镜检查 BGA 锡球植球不良情况.5.5.3.3 Check if BGA reballing have some following problems/检查 BGA 植球是否含有
19、以下几种情况a)misalignment; b)missing ball; c)Excess ball/ a)偏位; b)少球; c)多球;5.5.3. 4.If the BGA solder have the problems mentioned above, it should be rework/ 如果 BGA 焊点有上述现象, 则必须返工。5.5.3. 5.After inspection put the BGA on the carrier ./ 检查后将 BGA 放置在托盘中5.6 Appendix E: Reflow /附录 E: 回流WORK INSTRUCTION作 业 指
20、导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:7 Of 12.5.6.1. Operator verify the machine parameters at the beginning of everyday after changing model course of production./ 操作员在每天生产之前和每次操作模式改变之后要效验回流炉
21、的参数.5.6.2.Send BGA to the reflow machine as shown in the board loading direction diagram. /送板到回流炉的方向如图所示.5.6.3 Attached here is the recommended profile for the reflow.下图是推荐的温度曲线Speed adjuster/ 速度调节器heat on-off / 发热开关Temperature adjuster/ 温度调节器start on-off / 开始开关stop on-off / 停止开关WORK INSTRUCTION作 业
22、指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:8 Of 125.6.4 Refellow BGA inpection /炉后 BAG 检查5.6.5 Get one (1) BGA on the carrier/在运送盘中拿取一颗 BGA.5.6.6 Using 30X power microscope, check solder ball ali
23、gnment./ 在 30 倍显微镜下检查焊球的排列.5.6.7 Ensure that there is no any defect such as missing, misalign and excess solder ball/确保焊球排列完整,无少球,多球,偏位等现象出现.5.7 Appendix F:Cleaning package using Ultrasonic cleaner/附录 B:使用超声波清洗 BGA 5.7.1 We will use 2/3 Cleaning solvent at Ultrasonic cleaner containing ,20 to 30 com
24、ponents at a time cleaning./ 超声波清洗机内放入 2/3 的清洗液,每次清洗 2030PCS.5.7.2 Load the reballed BGA to the pot of ultrasonic cleaner./ 将植好球的 BGA 放入超声槽内.5.7.3 Turn on the ultrasonic to clean the BGA for 5 minutes at 25degree Celsius , then turn off it after 5 minutes./ 打开超声波清洗 BGA，时间 5 分钟，温度度, 然后停止清洗.5.7.4 Afte
25、r cleaning ,load the BGA to the tray.Pick up the BGA using ESD tweezer from tank./ 清洗完后将 BGA 取出,放入周转盘内.从槽里取出 BGA 应该使用防静电镊子.5.7.5 Check if there is no flux residue on the BGA surface,otherwise ,it shall becleaned again./ 检查 BGA松香残留物是否清洗干净,否则再清洗一次.5.7.6 hange the solvent once every 700 PCS BGA / 清洗液每
26、700PCS BGA 换一次。5.7.7 Used Mini Ultrasonic cleaning machine (Type: CT-400A) power is 35w ./使用微型超声波清洗机(型号: CT-400A) 功率是 35W.WORK INSTRUCTION作 业 指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:9 Of 125.7
27、.8 every time cleaning data note atFAPEI-026-F1.01 and every time change IPA note at FAPEI-031-F1.01./ 每次清洗数量记录在 FAPEI-026-F1.01 .并每次更换 IPA 记录在FAPEI-031-F1.01。5.8 Appendix G:Pre Baking Before Dry Packing 5.8.1 Baking hours at 125 degree Celsius before dry packing./在 125 摄氏度下烘烤 8 小时能后包装.5.8.2 QA chec
28、k have not amisalignment、missing ball、Excess ball、copper exposed 、circuitry damaged after Baking/QA 在烘烤后检查没有偏位、少球、多球、露铜、线路损伤等现像。5.9 Appendix H： ry Packing5.9.1 Flow procedure IPC(Handling and storage of moisture sensitive components)in baking and storage of cleaned as reballing packages.干包装的程序按照 IPC
29、的要求执行6.9.2 After dry paking, put the laber with “Rework use only ” and “part number” on the MBB. 包装后，在防潮袋的表面贴上带有返工专用和零件编号的标签5.9.3 packing label /包装标签Remind:/注意:All the reballed BGA can only be used for rework./所有植球的 BGA 只能作返工用.All the BGA replacement will be conduct by SRT rework station,below is th
30、e recommended profile.所有的返工必须使用返工台，如下为推荐的温度曲线WORK INSTRUCTION作 业 指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:10 Of 12Enclosed table is showing which BGA use the lead free solders and which BGA use
31、 tin lead solder balls ,Pls follow it seriously during the reballing.this produre is just for lead free reballing process ,tin lead reballing process is not get qualified .在列表中，规定各种使用含铅还是无铅的锡球，在生产中请严格执行这程序只用于无铅植球工艺,有铅植球工艺还没有给资格.Model P/N Description Refer ID TypeFLASHKCR-271-75826-0002 IC,FLASH/PSRA
32、M,128M/64M,1.8V IO/CORE,BTM,SCSP-88U502 Tin-LeadCatalinaMSM KCR-CE90-K2240-03 IC,MOBILE STATION MODEM, MSM6500,PROD SAMPLE 3 U501 Tin-LeadFLASH KCR-271-75974-0000 IC,FLASH/SRAM,32/8MB,TOP BOOT, U16 Tin-LeadK7MSM KCR-CE90-G4108-03 IC,MOBILE STATION MODEM,MSM510 U15 Tin-LeadWORK INSTRUCTION作 业 指 导 书DM
33、P-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:11 Of 12FLASH KCR-271-83516-0000 IC,FLASH/PSRAM,64M/16M,70NS,SC U16 Tin-LeadL7LEMSM KCR-CE90-G4222-1 IC,MOBILE STATION MODEM,MSM 60 U15 Tin-LeadKCR-271-75664-0
34、001 IC,FLASH/SRAM,64M/16M,85/85NS, U16 Tin-LeadFLASHKCR-271-75978-0001IC,FLASH/PSRAM,64M/16M,70NS,Pb-FreeU16 Pb-FreeK7PPTMSM KCR-CE90-G4108-03 IC,MOBILE STATION MODEM,MSM510 U15 Tin-LeadFLASH KCR-271-75826-0000 IC,FLASH/PSRAM,128M/32M,3VI/O, U60 Tin-LeadKX1MSM KCR-CE90-G4222-1 IC,MOBILE STATION MODE
35、M,MSM 60 U14 Tin-LeadFLASH KCR-271-75826-0006 IC,LEAD FREE,FLASH/PSRAM,128M/ U16 Pb-FreeMSMKCR-CE90-G4222-03 IC,MOBILE STATION MODEM,MSM 60 U15 Pb-FreeKX13FLASH KCR-272-83513-0005IC,256M(32X8) NAND FLASH,128M(2MX16X4 BANKS) MOBILE SDRAM9.0NS,1.8V,PB-FREE,FBGA-107U13 Pb-FreeMSM KCR-CE90-G4286-1 IC,MO
36、BILE STATION MODEM, MSM61 U11 Tin-LeadKX16&KX160FLASH KCR-272-83513-0004IC,256M NAND(X8)/256M LPSDRAM(X16),1.8V,PB-FREE,FBGA107 U45Pb-FreeMSM KCR-CE90-G4286-1 IC,MOBILE STATION MODEM, MSM61 U32 Tin-LeadKX5FLASH KCR-272-75002-0002 IC,FLASH 32MB NON-RWW 3V 70NS TOP BOOT,DIE U6 Tin-LeadWORK INSTRUCTION
37、作 业 指 导 书DMP-001-F2 .01DOC. NO. / 文件编号:FIPEI-KCR-053REVISION / 版本号:01PRODUCT / 产品:KyoceraTITLE / 标题:Lead Free_BGA_Reballing_Process无铅 BGA 植球工艺流程PAGE/页数:12 Of 12MSM KCR-CE90-G4221-02 IC,MOBILE STATION MODEM,MSM600 U5 Pb-FreeKX17FLASH KCR-271-75826-0006 IC,LEAD FREE,FLASH/PSRAM,128M/ U60 Pb-FreeMSM KCR-CE90-G4222-03 IC,MOBILE STATION MODEM,MSM 60 U14 Pb-FreeKX9FLASH KCR-271-75974-0000 IC,FLASH/SRAM,32/8MB,TOP BOOT, U3 Tin-LeadMSM KCR-CE90-G4108-03 IC,MOBILE STATION MODEM,MSM510 U5 Tin-LeadM2
