1、GPP Process Introduction (Pt & SIPOS) GPP制程简介,Std GPP Process Flow,Wafer Clean,Boron Diffusion,Grid Etching,PR Strip,SIPOS & MTO,2nd Photo,PG Burn off,Glass Firing,LTO,3rd Photo,PG Coating,RCA Clean,PR Strip,Contact Etch,Non SIPOS,Phos. Pre-Dep,HF Soak,Sand Blasting,Pt Diffusion,Sand Blasting,1st Ph
2、oto,Wafer Clean (晶片清洗),N,Phos. Pre-Deposition ( 磷預沉積 ),N,晶片,N+,磷,Sand Blasting (吹砂),N,晶片,N+,磷,在此面吹砂,Boron Diffusion (硼擴散 ),N,晶片,N+,P+,磷,硼,Sand Blasting (吹砂),N,晶片,N+,P+,磷,硼,单面吹砂,Pt Diffusion (铂擴),N,晶片,N+,P+,磷,硼,Pt,铂,Sand Blasting (吹砂),N,晶片,N+,P+,磷,硼,雙面吹砂,1st Photo (一次黃光双面光刻),晶片,N,N+,P+,光阻,光阻,开槽去,背面标记
3、线,SB-402,BG-403/S,Grid Pre-Etching (溝槽标记预蝕刻),晶片,N,N+,P+,光阻,Pr-Coating (背面涂胶),晶片,N,N+,P+,光阻,补光阻保护,Grid Etching (溝槽蝕刻),晶片,N,N+,P+,光阻,PR Strip (光阻去除),N,N+,P+,RCA Clean (RCA 清洗),晶片,N,N+,P+,SIPOS & MTO (SIPOS沉積),晶片,N,N+,P+,SIPOS,SIPOS,2nd Photo (2次黃光),N,N+,P+,SIPOS,SIPOS,PG,BG-401A(高光强型),或 BG-401A,BG-403
4、,或 BG-401A,BG-401A(高光强型),或 BG-401A,BG-403,BG-401A(高光强型),或 BG-401A,PG Development (PG显影),N,N+,P+,SIPOS,SIPOS,PG,Glass Firing (玻璃燒結),N,N+,P+,SIPOS,SIPOS,Glass,LTO (低溫氧化層沉積),N,N+,P+,SIPOS,SIPOS,Glass,SiO2,3rd Photo (三次黃光),N,N+,P+,SIPOS,SIPOS,Glass,SiO2,PR,BG-403,或 BG-401A,BG-401A(高光强型),Contact Etch (接觸
5、面蝕刻),N,N+,P+,SIPOS,Glass,SiO2,PR,PR Strip (光阻去除),N,N+,P+,SIPOS,Glass,SiO2,1st Ni Plating (一次鍍鎳),N,N+,P+,SIPOS,Glass,SiO2,Ni,Ni Sintering (鎳燒結),N,N+,P+,SIPOS,Glass,SiO2,Ni,2nd Ni Plating (二次鍍鎳),N,N+,P+,SIPOS,Glass,SiO2,Ni,Gold Plating (鍍金),N,N+,P+,SIPOS,Glass,SiO2,Ni,Au,GPP Chip (GPP晶粒),Glass,LTO,P+,N+,N,SIPOS,Ni/ Au,
