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类型SOD SOT SOP系列封装尺寸.pdf

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    SOD SOT SOP系列封装尺寸.pdf
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    1、 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust

    2、pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 3

    3、9 1 of 13 Suggested Pad Layout Diodes IncorporatedSUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC ZXCGYDimensions DFN1006-2 / DFN1006H4-2 MiniMELF MELF SOD123 SOD323 SOD523 SMA SMB SMC Z 1.1 4.7 6.3 4.9 3.75 2.3 6.5 6.8

    4、9.4 G 0.3 2.1 3.3 2.5 1.05 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.7 0.65 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.2 1.35 0.6 2.5 2.5 2.5 C 0.7 3.5 4.8 3.7 2.40 1.7 4.0 4.3 6.8 DFN0603H3-2 DFN1006-3 / DFN1006H4-3 ZY (2x)X (2x)CDimensions Value (in mm)C 0.355 X 0.230 Y 0.300 Z 0.610 YCG1G2XX1ZDimensions Value (in mm)

    5、Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7 DFN1411-3 CYX1ZG1XX2G2Dimensions Value (in mm) Z 1.38 G1 0.15 G2 0.15 X 0.95 X1 0.75 X2 0.40 Y 0.75 C 0.76 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual

    6、 pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document

    7、IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 2 of 13 Suggested Pad Layout Diodes IncorporatedDFN1612-6 / DFN1310H4-6 bG3aG2 X2Y2Y1G1X1Dimensions DFN1612-6 DFN1310H4-6 G1 0.15 0.16 G2 0.175 0

    8、.17 G3 0.15 0.15 X1 0.60 0.52 X2 0.25 0.20 Y1 0.65 0.52 Y2 0.45 0.375 a 0.10 0.09 b 0.15 0.06 DFN1616-6 DFN1616-8 X1GX2ZCYDimensions Value (in mm)Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50 G1Y2Y1CX1X2G2aDimensions Value (in mm)G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10 DFN2018-6

    9、 YXCX1GY1Dimensions Value (in mm) C 0.50 G 0.20 X 0.25 X1 1.60 Y 0.35 Y1 1.20 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modifi

    10、ed based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for Intern

    11、ational grid details, please see document IEC, Publication 97. AP02001 Rev. 39 3 of 13 Suggested Pad Layout Diodes IncorporatedDFN2020-3 X1CX3XY4Y1X2YY2Y3R3R2R1GX4Y5DimensionsValue (in mm)Dimensions Value (in mm) C 1.00 Y1 0.60 G 0.15 Y2 0.45 X 1.40 Y3 0.45 X1 0.35 Y4 0.698 X2 0.45 Y5 0.313 X3 0.32

    12、2 R1 0.225 X4 0.60 R2 0.05 Y 1.10 R3 0.20 DFN2020B-3 DFN2020-6 XY1YY2X1CGDimensions Value (in mm) C 1.30 G 0.24 X 0.35 X1 1.52 Y 1.09 Y1 0.47 Y2 0.50 GGYCZYX2X1DimensionsValue (in mm) Z 1.67 G 0.15 X1 0.90 X2 0.45 Y 0.37 C 0.65 DFN2020B-6 DFN2510 GGY CZY1X2X1G1Dimensions Value (in mm) Z 1.67 G 0.20

    13、G1 0.40 X1 1.0 X2 0.45 Y 0.37 Y1 0.70 C 0.65 Y1X1cXGc1YDimensionsValue (in mm) c 0.5 c1 1.0 G 0.2 X 0.2 X1 0.4 Y 0.6 Y1 1.4 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary dependi

    14、ng on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention

    15、for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 4 of 13 Suggested Pad Layout Diodes IncorporatedDFN3020B-8 CX1G1XY1YY2GDimensions Value (in mm) C 0.650 G 0.285 G1 0.090 X 0.400 X1 1.120 Y 0.730 Y1 0.500 Y2 0.365 DFN3030-4

    16、DFN3030-8 YX (4x)CY3 (2x)Y2Y1G1G3G4RG7 G8X3G5X1X2G2G6Dimensions Value (in mm) C 1.300 G1 0.100 G2 0.150 G3 0.830 G4 0.115 G5 0.135 G6 0.170 G7 0.500 G8 0.500 R 0.150 X 0.500 X1 1.375 X2 1.225 X3 1.175 Y 1.980 Y1 1.015 Y2 0.715 Y3 0.650 ZGX1X2YCDimensions Value (in mm)Z 2.59 G 0.11 X1 2.49 X2 0.65 Y

    17、0.39 C 0.65 DFN3030E-8 Y(x8)X (x8) CC1Y1 Y2Dimensions Value (in mm) C 0.65 C1 2.35 X 0.30 Y 0.65 Y1 1.60 Y2 2.75 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on appli

    18、cation. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standar

    19、d SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 5 of 13 Suggested Pad Layout Diodes IncorporatedDFN3030-10 DFN3030-12 CYZXX1GGDimensions Value (in mm)Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50 CYZXX1GGDimensions Value (in mm)Z 2.60 G

    20、 0.15 X 1.80 X1 0.60 Y 0.28 C 0.45 DFN5020-6 DFN5060-4 Y3X2X1 Y2XCYGDimensions Value (in mm)C 0.50 G 0.35 X 0.35 X1 0.90 X2 1.80 Y 0.70 Y2 1.60 Y3 3.20 Y1Y (4x)X (4x)CZDimensions Value (in mm)C 4.00 X 0.75 Y 0.95 Y1 6.20 Z 4.75 DF-S / MiniDIP MSOP-8 XCYZDimensions DF-S MiniDIPZ 10.26 6.91 X 1.2 0.60

    21、 Y 1.52 0.76 C 5.2 2.67 XYC1C2Dimensions Value (in mm)X 0.45 Y 1.4 C1 4.4 C2 0.65 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be mo

    22、dified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for In

    23、ternational grid details, please see document IEC, Publication 97. AP02001 Rev. 39 6 of 13 Suggested Pad Layout Diodes IncorporatedMSOP-8L-EP MSOP-10 X1Y1XYC1C2Dimensions Value (in mm)C1 4.2 C2 0.65 X 0.32 X1 1.95 Y 0.8 Y1 1.65 XYC1C2Dimensions Value (in mm) X 0.30 Y 1.4 C1 4.4 C2 0.50 POWERDI5 POW

    24、ERDI123 / POWERDI323 GXCY1(2x)YX1(2x)X1 GX2Y2Y1Dimensions Value (in mm) C 1.840 G 0.852 X 3.360 X1 1.390 Y 4.860 Y1 1.400 DimensionsPOWERDI123 POWERDI323G 1.0 0.5 X1 2.2 2.0 X2 0.9 0.8 Y1 1.4 0.8 Y2 1.4 1.1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimen

    25、sions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimensio

    26、n. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 7 of 13 Suggested Pad Layout Diodes IncorporatedPOWERDI3333-8 POWERDI5060-8 XYY1Y3Y2X2C1485

    27、GG1XX1YY1Y2G1Y3 (4x)X2 (8x) GCDimensions Value (in mm) C 0.650 G 0.230 G1 0.420 Y 3.700 Y1 2.250 Y2 1.850 Y3 0.700 X 2.370 X2 0.420 Dimensions Value (in mm) C 1.270 G 0.660 G1 0.820 X 4.420 X1 4.100 X2 0.610 Y 6.610 Y1 3.810 Y2 1.020 Y3 1.270 SM-8 SO-8Y1Y (8x)X (8x) CC1Dimensions Value (in mm)C 1.52

    28、 C1 4.6 X 0.95 Y 2.80 Y1 6.80 XC1C2YDimensions Value (in mm)X 0.60 Y 1.55 C1 5.4 C2 1.27 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers ma

    29、y be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and

    30、 for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 8 of 13 Suggested Pad Layout Diodes IncorporatedSOD323F X1Y (2x)X (2x)Dimensions Value (in mm) X 0.710 X1 2.700 Y 0.403 SOP-14 XC1C2YDimensions Value (in mm)X 0.60 Y 1.50 C1 5.4 C2 1.27 SOP-16 XC1C2YDimensions

    31、 Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capabil

    32、ity or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see d

    33、ocument IEC, Publication 97. AP02001 Rev. 39 9 of 13 Suggested Pad Layout Diodes IncorporatedSOT143 SOT223 X1 X2GZYCXX2X2C1C2X1Y2Y1Dimensions Value (in mm) Z 2.70 G 1.30 X 2.50 X1 1.0 X2 0.60 Y 0.70 C 2.0 Dimensions Value (in mm)X1 3.3 X2 1.2 Y1 1.6 Y2 1.6 C1 6.4 C2 2.3 SOT523 / SOT323 / SOT23 / SC

    34、59 X EYCZDimensions SOT523 SOT323 SOT23 SC59 Z 1.8 2.8 2.9 3.4 X 0.4 0.7 0.8 0.8 Y 0.51 0.9 0.9 1.0 C 1.3 1.9 2.0 2.4 E 0.7 1.0 1.35 1.35 SOT23F CY1Y (3x)X (3x)Dimensions Value (in mm) C 0.95 X 0.60 Y 0.80 Y1 1.80 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land patter

    35、n dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z d

    36、imension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 10 of 13 Suggested Pad Layout Diodes IncorporatedSC74R / SOT26 / SOT363 / SOT563 SOT

    37、25 / SOT353 / SOT553 XZYC1C2C2GXZYC1C2C2GDimensions SC74R / SOT26 SOT363 SOT563 Z 3.20 2.5 2.2 G 1.60 1.3 1.2 X 0.55 0.42 0.375 Y 0.80 0.6 0.5 C1 2.40 1.9 1.7 C2 0.95 0.65 0.5 Dimensions SOT25 SOT353 SOT553 Z 3.20 2.5 2.2 G 1.60 1.3 1.2 X 0.55 0.42 0.375 Y 0.80 0.6 0.5 C1 2.40 1.9 1.7 C2 0.95 0.65 0

    38、.5 SOT666 X(6x)Y (6x)CGDimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50 SOT953 Y1Y (5X)CCX (5X)Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as ac

    39、tual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference docum

    40、ent IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 11 of 13 Suggested Pad Layout Diodes IncorporatedSOT963 Y1Y (6X)CCX (6X)Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100 SOT89-3 SOT

    41、89-5 Y1X1Y2YCX (3x)Y3Y4X2 (2x)Dimensions Value (in mm)X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500 Y1X3X1Y3Y2X2CY4Dimensions Value (in mm)X1 1.7 X2 0.55 X3 0.4 Y1 4.6 Y2 1.2 Y3 0.5 Y4 1.1 C 3.0 TO252 (DPAK) / TO263 (D2PAK) X2CZX1Y1E1Y2Dimensions TO252 / DPAK TO263 /

    42、D2PAK Z 11.6 16.9 X1 1.5 1.1 X2 7.0 10.8 Y1 2.5 3.5 Y2 7.0 11.4 C 6.9 9.5 E1 2.3 2.5 TO252-4 X1Y1Y2Y3YX (4x) cc1Dimensions Value (in mm) c 1.27 c1 2.54 X 1.00 X1 5.73 Y 2.00 Y1 6.17 Y2 1.64 Y3 2.66 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions hav

    43、e been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For fu

    44、rther information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 12 of 13 Suggested Pad Layout Diodes IncorporatedTO252-5 TO263-5 Y2YY1XC2C1X1Y2YY1XCX1Dimensions Val

    45、ue (in mm) X 5.6 X1 0.6 Y 11.0 Y1 5.6 Y2 2.0 C1 7.2 C2 1.27 Dimensions Value (in mm)X 10.9 X1 1.05 Y 15.7 Y1 9.1 Y2 2.5 C 1.7 TSOT25 Y1C CX (5x)Y (5x)Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 TSOT26 Y1C CX (6x)Y (6x)Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 ALL DIMENS

    46、IONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may

    47、 be desired for wave soldering and is calculated by adding 0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 39 13 of 13 Suggested Pad Layout Diodes IncorporatedTSSOP-14 XC1C2YDimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65 WL-CSD1010H6-4 CCDDimensions Value (in mm) C 0.50 D 0.25

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