1、SMT生产常 用英文,一、部门组织类 二、系统文件类 三、生产工站类 四、零件认识类 五、质量管理类 六、不良类型类,目 录,DC (Document Center) 资料中心 DCC (document control center) 文件管理中心 Design Center 设计中心 PCC (Product control center) 生产管制中心 PMC (Production & Material Control) 生产和物料控制 PPC (Production Plan Control) 生产计划控制,一、部门组织类,SCM (supply chain management)
2、供应链 MC Material Control 物料控制 QCC (Quality Control Circle) 品质圈 QIT (Quality Improvement Team) 质量改善小组 MFG (manufacturing) 制造单位 Manufacturing Dept = MD 制造部,PD (Product Department) 生产部 Logistical Dept 物流部 Purchasing Dept 采购部 Cost Management Dept 经 管 Material Control Dept 物 管 Personnel Dept 人事部 Engineeri
3、ng Standard Dept 工标部 Quality Assurance Dept 品保部 R&D (Research & Design) 设计开发部,Delivery Control Center 交 管 Planning Dept 企划部 Administration/General Affairs Dept 总务部 PM (project management) 专案管控 LAB (Laboratory) 实验室 QE (Quality Engineering) 质量工程(部) QA (Quality Assurance) 质量保证(处),QC (Quality Control) 质
4、量管理(课) IE (Industrial Engineering) 工业工程 ME (manufacture engineering) 制造工程 PE (PRODUCTS ENGINEERING) 产品工程 TE (TEST ENGINEERING) 测试工程 EE (ELECTRONICS ENGINEERING) 电子工程,ISO (International Standard Organization) 国际标准化组织 ES (Engineering Standard) 工程标准 IWS (International Workman Standard) 工艺标准 GS (General
5、 Specification) 一般规格 SIP (Standard Inspection Procedure) 标准检验规范 SOP (Standard Operation Procedure) 制造作业规范,二、系统文件类,IS (Inspection Specification) 成品检验规范 POP (packing operation procedure) 包装操作规范 BOM (Bill Of Material) 物料清单 PS (Package Specification) 包装规范 SPEC (Specification) 规格 DWG (Drawing) 图面 SWR (Sp
6、ecial Work Request) 特殊工作需求 APP (Approve) 核准,认可,承认 CHK (Check) 确认,ECO (Engineering Change Order) 工程改动要求 PCN (Process Change Notice) 工序改动通知 PMP (Product Management Plan) 生产管制计划 CAR (Correction Action Report) 改善报告 TPM (Total Production Maintenance) 全面生产保养 MRP (Material Requirement Planning) 物料需计划 OS (O
7、peration System) 操作系统 SSQA (standardized supplier quality audit) 合格供货商质量评估,AVL (acceptable vendor list) 允许的供货商清单 PDCS (process defect contact sheet) 制程异常联络单 E(D)CN (Engineering(Design) change notice) 工程(设计)变更通知 KPI (Key performance index) 主要绩效指标,Computer 计算机 Consumer Electronics 消费性电子产品 Communicatio
8、n 通讯类电子产品 OEM (Original Equipment Manufacture) 原设备制造 PC Personal Computer 个人计算机 5W1H (When, Where, Who, What, Why, How to),三、生产工站类,6M Man, Machine, Material, Method, Measurement, Message 4MTH (Man, Material, Money, Method, Time, How) 人力,物力,财务,技术,时间(资源) CP (capability index) 能力指数 CPK (capability proc
9、ess index) 制程能力参数 FMEA (failure model effectiveness analysis)失效模式分析,SMT (surface mount technology) 表面贴装技朮 PTH (Plate Through hole) 镀层穿孔(手插件) PCBA (Printing circuit board Assembly) 组装印刷电路板 PO (Purchasing Order) 采购订单 MO (Manufacture Order) 生产单,PC# (product code) 产品编码 MM# (material master number) 主件料号
10、AA# (altered assembly number) 成品料号 PBA# (printed board assembly number) 半成品料号 PPID (Product part Identification) 产品料号识别码 L/N (Lot Number) 批号 P/N (Part Number) 料号 N/A (Not Applicable) 不适用,S/N (serial number) 序列号 CHK (check) 检查 SEPC (specification) 规格 ID: (Identify) 鉴别号码 Barcode 条形码 barcode scanner 条形
11、码扫描仪 WDR (Weekly Delivery Requirement) 周出货要求 PPM (Percent Per Million) 百万分之一,PCs (Pieces) 个(根,块等) PRS (Pairs) 双(对等) CTN (Carton) 卡通箱 PAL (Pallet/skid) 栈板 D/C (Date Code) 生产日期码 ID/C (Identification Code) (供货商)识别码 QTY (Quantity) 数量 I/O (input/output) 输入/输出 Flux 助焊剂 Cleaning solvent 清洁剂 Cleaning paper
12、擦拭纸 Hand solder 烙 铁,Solder Paste 锡膏 Feeder 供料器 Stencil 钢网 Nozzle 吸嘴 PAD 焊垫 Squeegee 刮刀 Pinter Machine 锡膏印刷机器 Buffer Loader 收板机 Material 物料 Mounting Machine 贴片机器 REFLOW Machine 回流焊炉 Profile 回焊温度曲线图,AOI (automatic optical inspection) 自动光学检测 W/S (wave solder) 波峰焊 ICT (in circuit test) 线路测试 IFT (integra
13、te function test) 功能测试 FCT (Function check Test) 功能测试 SMD (Surface Mounting Device) 贴装设备 BGA Rework Station BGA维修站,MSD (moisture sensitive device) 湿度敏感组件 SMC (Surface Mount Component) 表面贴装组件 SMD (Surface Mount Device) 表面帖装元器件 Leads 组件脚 Terminations 端头脚件 Passive Component 无源器件 Active Component 有源器件,四
14、、零件认识类,BIOS: (Basic Input Output System) 基本输入输出系统 CMOS: (Complementary Metal-Oxide-Semiconductor Transistor) 互补型金属氧化物半导体 Core 铁芯 CPU: (Central Processing Unit) 中央处理器 DMA: (Direct Memory Access) 直接内存存取 IC: (Integrated Circuit) 集成电路,SPS (Switching power supply) 电源箱 AGP (Accelerated Graphic Port) 加速图形端
15、口 FDD (Floppy Disk Drive) 软式磁盘机 HDD (Hard Disk Drive) 硬盘驱动器 North Bridge 北桥 South Bridge 南桥,IDE: (Integrated Drive Electronics) 集成电路设备, 智能磁盘设备 LAN: (Local Area Network) 网络, 局域网, 本地网 MOSFET: (Metal-Oxide Semiconductor Field Effect Transistor) 金属氧化物半导体场效应晶体管 PCI: (Peripheral Component Extended Interfa
16、ce) 周边组件扩展接口 SCSI: (Small Computer System Interface) 小计算机系统的界面,USB: (Universal Serial Bus) 通用串行总线 SDRAM: (Synchronous Dynamic Random Access Memory) 同步动态随机存取存储器 KEYBOARD 键盘 CABLE LINE 排线 HEADER 头/排 针 JACK 插头 CABLE 电缆/排线 TUNER 调频器,Pin = I/O (Input / Output) 输入/输出,PCB Printed Circuit Board 印刷电路板,Networ
17、k resistor 排阻,Resistor 电阻,Capacitor 电容,Network capacitor 排容,TANTALUM CAPACITOR 钽质电容器,INDUCTOR 电感,Fuse 保险丝,Light-emitting diode 发光二极管,晶体管transistor,Crystal(石英晶体),Diode(二极管),Switch(开关),MELF(金属电极表面连接组件),Quad flat package QFP四方扁平封装,Small outline Package Sop 小轮廓封装,PLCC Plastic Leaded chip carrier 塑料芯片载体,
18、BGA Ball grid array 球形陈列封装,QC (quality control) 品质管理人员 FQC (final quality control) 终点质量管理人员 IPQC (in process quality control) 制程中的质量管理人员 OQC (output quality control) 最终出货质量管理人员 IQC (incoming quality control) 进料质量管理人员 TQC (total quality control) 全面质量管理 PQC (passage quality control) 段检人员,五、质量管理类,QA (q
19、uality assurance) 质量保证人员 OQA (output quality assurance) 出货质量保证人员 QE (quality engineering) 质量工程人员 QPA (Quality Process Audit) 制程品质稽核 OQM (output quality measure) 出货质量检验 SQA (Strategy Quality Assurance)策略质量保证,DQA (Design Quality Assurance) 设计质量保证 MQA (Manufacture Quality Assurance) 制造质量保证 SSQA (Sales
20、and service Quality Assurance) 销售及服务质量保证 SPC (Statistical Process Control) 统计制程管制 SQC (Statistical Quality Control) 统计质量管理 GRR (Gauge Reproductiveness & Repeatability) 量具之再制性及重测性判断量可靠与否,8S Classification 整理 (sorting, organization)-seiri Regulation 整顿 (arrangement, tidiness)-seiton Cleanliness 清扫 (sw
21、eeping, purity)-seiso Conservation 清洁 (cleaning, cleanliness)-seiktsu Culture 教养 (discipline)-shitsuke Save 节约 Safety 安全 Security 保密,PDCA (Plan Do Check Action) 计划 执行 检查 总结 FAI (first article inspection) 新品首件检查 FAA (first article assurance) 首件确认 AQL (Acceptable Quality Level) 允收质量水平 S/S (Sample size
22、) 抽样检验样本大小 FPIR (First Piece Inspection Report) 首件检查报告,ACC (Accept) 允收 REJ (Reject) 拒收 CR (Critical) 极严重的 MAJ (Major) 主要的 MIN (Minor) 轻微的 Q/R/S (Quality/Reliability/Service) 质量/可靠度/服务 ZD (Zero Defect) 零缺点 NG (Not Good) 不行,不合格,QI (Quality Improvement) 质量改善 QP (Quality Policy) 目标方针 TQM (Total Quality
23、Management) 全面质量管理 RMA (Return Material Audit) 退料认可 LRR (Lot Reject Rate) 批退率 NDF (no defect found) 误判,7QCTools (7 Quality Control Tools)品管七大手法 ESD (Electric Static Discharge) 静电释放 DPPM (Defective Percent Per Million) 每百万单位的产品不合格率,Misalignment 偏 位 Tombstone 墓 碑 Missing parts 缺 件 Insufficient solder 少 锡 Solder ball 锡 珠 Short bridge 短 路 Open 空 焊 Part damaged 零件破损 Cool solder 冷 焊 Wrong parts 错 件,六、不良类型类,偏位 misalignment,多锡 Excessive solder,少锡 insufficient solder,墓碑 Tombstone,翘脚 Lead raised,空焊假焊 Open,翻身反白 reverse,连锡 Short bridge,锡珠 Solder ball,破损Broken,
