1、e2007 M 9 24 BT =1 = A dVia Filling l = | Electroless plating copper| 沉 K $5=氧= j S O= V Cu2+:B x j | j 4 LZ | 氧= $ V = S 沉 , | I x $; S jgCu2+2HCHO+4OH Cu+2HCOO+2H2O+H2 Z T l ) HWM PTH en“ Desmear K F PTH PTH Tn 0Kb K T1 a n i ; 1 T KT Es Ab “M M ”? p B O M s0R-O-R B by ? ? 3 _o B byN T G n4bi : nA
2、 _ )c ? 5 _o P Ms b n G d d = f V n f n ? KMnO4 V7 d byN -A “ ib 3MnO42-+4H+ = 2MnO4-+MnO2(s)+2H2O2MnO4-+5C2O42-+16H+ = 2Mn2+10CO2(g)+8H2O5C2O42-+MnO2+4H+ = Mn2+2CO2+2H2OE j8l Pj K YF4 ?“ # 2 zrTY;rT A Q7 P b4 T ds0 dCV P dCV A “?dCV b dCV K ? :F“ V G4YV b K - K ?0 L 7 “ z B # ? / :V Av ds0T“ dC ,F
3、K P Pd dCbPd2+2Sn 2+ (PdSn2)6+(PdSn2)6+ Pd+Sn4+Sn2+ Pd+nSn2+3nCl-Pd(SnCl3)nn- dCV dCV F ? : Pd Sn4+ T , Pd , b“ Lv 0 3 0b :vT0 , ! , T/ ,Pd Sn(OH)4 T .YV HBF4F 4 P SnCl2aSn(OH)4aSn(OH)Cl2“bSnCl2+2HBF4Sn(BF4)2+2HClSn(OH)4+4HBF4Sn(BF4)4+4H2OSn(OH)Cl+2HBF4Sn(BF4)2+HCl+H2OF 4 dCV ? :bT/$J 7 . :CuSO4+2HCHO+4NaOHCu+NaSO4+2HCOONa+2H2O+H21.0 : HCHO+OH-H3COO-H3COO-+OH-HCOO-+H2O+H-H-H0+e-( PdT/ )2.V SQ :Pd+2e-+Cu2+Pd-CuPd-Cu+2e-+Cu2+Pd-Cu+Cu3.1bQ :Cu0+2e-+Cu2+Cu0+Cu0
