1、FPC 名词中英对照1. 目的通过对行业标准的 FPC 工程名词引用及我司标准的整合，旨在为我司 FPC 名词的中英用语实现使用上的统一化2. 适用范围规范 FPC 相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词3. 定义无类别一：FPC 不良项目名词工程类别 不良名称中文 英 文导线 Conductors开路 Open短路 Short缺口 Nicks针孔 Pinholes额外铜刺 Extraneous Copper Between Conductors毛刺 Spurs结瘤 Nodules蚀刻凹痕 Etched Concave导线分层 Conductor Del
2、amination裂纹 Cracks导线划痕 Scratches on Conductor凹坑 Dents导线Visual Inspection of Conductors变色 Discoloration凹坑 Dents基底薄膜Visual Inspection of Base Film 划痕 Scratches on Base Film凹坑 Dents on Coverlay and Covercoat划痕 Scratches on Coverlay and Covercoat空洞 Void偏位 Coverlay Misalign覆盖层和覆盖涂层Visual Inspection of Co
3、verlay and Covercoat 毛刺 Coverlay Burrs导电性异物 Conductive Foreign Matters非电性异物 Non-conductive Foreign Matters起泡和分层 Blistering and Delamination覆盖层粘结剂挤出 Squeeze-out of Adhesive of Coverlay覆盖涂层渗出 Ooze-out of Covercoat外来物Foreign Matters覆盖涂层跳漏 Skipping of Convercoat镀金 Gold Plating镀金层缺陷 Gold Plating Defects镀
4、锡 Tin Plating电镀金属或焊料的渗透 Penetration of Plated Metal or Solder变暗（变黑） Darkened Appearance (Blackening Discoloration)镀铜孔内镀层空洞 Plating Voids in Plated-though Hole镀金粗糙 Rough Gold镀金白雾 Gold Discoloration镀金变色 Gold Discoloration镀金层龟裂 Gold Crack镀金针孔 Gold Pinhole电镀露铜 Plated Expose Wetting剥离 Plated Peeled Off电镀
5、渗入 Plated Wicking漏镀 No Plating表面伤痕 Plating Scratch电镀粗糙 Rough Plated电镀金属或焊锡的表面条件Surface Condition of Plated Mental and Solder药水渗入 Wicking撕裂和缺口 Tears and Nicks毛刺 Burrs丝状毛刺 Thready Burrs弯曲、变形 Warpage微连筋不良 Poor Micro-joint外形偏移 Outline Misalign外形漏冲 No Outline外形和孔边缘Visual Inspection of Edges of Outline an
6、d Holes反折偏位 Bending Line MisalignFPC 与增强板之间的外来物Foreign Matter Between Flexible Printed Board and StiffenerFPC 与增强板之间的空洞Voids Between Flexible Printed Board and Stiffener裂纹 Cracks缺角 Chip-off划痕 Scratches增强板Visual Imperfections Related to Stiffener Bonding变形 Deformation增强板贴偏移 Stiffener Misalign表面附着物 热固
7、胶 Thermosetting Adhesive焊剂残渣 Flux Residues金属粉末残渣 Residue of Metal Powders粘结剂残渣 Residue of Adhesive突起 Protrusions凹坑 Dents弓曲 BowAffixed Substances on the Surface扭曲 Twist尺寸检验 Dimensional Inspections尺寸测量 Measurement of Dimensions外部尺寸 External Dimensions厚度 Thickness孔 Holes元件孔 Component Holes导通孔 Via Holes
8、导通孔偏移 Via Hole Misalign安装孔 Mounting Holes导线宽度 Conductor Widths导线之间的间距 Clearances Between Conductors孔中心间距 Distance Between Hole Centers板边和导线之间的最小距离Minimum Distance Between Board Edges and Conductors标记错误 Wrong Marking标记 Marking字符不清晰 Unclear Letter孔的定位精度 Positional Accuracy of Holes孔与焊盘的重合性 Registratio
9、n of Hole to Land定位精度Positional Accuracy 覆盖层与焊盘的重合性Registration of Coverlay (or Covercoat) to Land孔的重合性 Registration of Holes外形的重合性 Registration of Outlines冲外形与导线图形的重合性Registration of Punched Outline to Conductor Patterns压敏胶或热固胶与FPC 和增强板的重合性Registration of Pressure Sensitive or Heat Activated Adhesi
10、ves to FPC and Stiffener增强板与 FPC 的重合性Registration of Stiffener to FPC镀通孔的镀铜层厚度Plating Thickness of Copper Panted-through Holes短装 Shortage混装 Mixed Stowage/Packing离型纸脱落 Released Paper Peeled off其它 Other材料错误 Wrong Material类别二：PFC 工程用语工程类别 中 文 英 文单面板 Single Sided Flex Circuits单面双接触 Double Access or Back
11、-bared Flex Circuits双面板 Double Sided Flex Circuits板Board Type软硬结合板 Rigid-flex Circuits模具图纸 Die Drawing量产模具 Mass Production Die样品模具 Prototype Die钢模 Steel Die刀模 Die上模 Top Die下模 Bottom Die线切割 Wire Cut外形模具 Outline Cut保护膜模具 Coverlay Die胶纸模具 Pressure Sensitive Adhesive Die补强模具 Stiffener Die银浆模具 Silver Die
12、 导柱 Post冲头 Punch分割刀模 Cutting Steel Rule Die模具Die销钉 Pin贴合治具 Lamination Jig电测治具 Electrical Check Jig假贴治具 Tacking Jig曝光治具 Exposure Jig治具Jig( Fixture)丝印网框 Screen Printing Frame曝光定位孔 Guide Hole for Exposure模具定位孔 Guide Hole for Die假贴定位孔 Guide Hole for Tacking贴合定位孔 Guide Hole for Adhesive电测定位孔 Guide Hole f
13、or Electrical Test丝印定位孔 Guide Hole for Screen Printing孔环 Lifted Land渗锡孔 Stannize Hole孔Hole装配孔 Fitting Hole下料 Material Preparation钻孔 Drilling镀铜 Copper Plating化学铜 Ele Eletcroless Plating Copper贴干膜 Sensitive Dry Film 丝印阻焊油墨 Liquid Photosensitive Soldermask曝光 Exposure显影 Developing制程Manufacture Procedure
14、蚀刻 Etching脱膜 Stripping贴保护膜 Tacking Coverlay粗化 Abrade层压 Lamination固化(烘烤） Curing黑孔 Black Hole表面处理 Surface Treatment循环水洗 Cascade Rinse微蚀 Micro-etch酸洗 Acid Cleaning水洗 Water Cleaning防锈处理 Anti-corrosion Treatment前处理 Pre-treatment刷板 Brushing干燥 Dry up电镀（金、锡、镍） (Gold、Solder、Nickel) Plating闪镀 (Gold ) Flash Pl
15、ating/Strike Plating局部电镀 Pattern Plate化学镍金 Immersion Gold有机保焊膜 Organic Solderability Preservatives (OSP)丝印字符 Printing of Legend贴补强板 Back Board Lamination电性能测试 Electrical Inspection贴胶纸 Double Faced Adhesive Tape打孔 Punching雷射切割 Laser Cut自动光学检验 Automatic Optical Inspection （AOI）表面贴装 Surface Mounting Te
16、chnology （SMT）外形冲切 Punching冲孔 Punching外观检查 Final Inspection目视检查 Visual Inspection（Final Inspection)线路显微镜检验（镜检） Conductor Microscope Inspection性能测试 Reliability Test包装 Packing铜箔 Copper Foil (CU)电解铜 Electro-deposited Copper Foil (ED)压延铜 Rolled Annealed Copper Foil (RA)保护膜 Coverlay (CVL)基材 Base Material
17、挠性覆铜板 Flexible Copper Clad Laminate (FCCL)无胶基材 Adhesiveless FCCL原材料 Material粘接剂（胶） Adhesives (Ad)压克力 Acrylic顶层补强 Top Stiffener底层补强 Bottom Stiffener顶层银浆膜 Top Silver Paste底层银浆膜 Bottom Silver Paste银浆油墨 Sliver Ink顶层线路 Top Circuits/Conductors底层线路 Bottom Circuits/Conductors半固化片 Bonding Film (BOD)聚酰亚胺 Poly
18、imide(PI)聚酯 Polyester Film (PET) 钢片 Sheet Steel玻璃纤维布 Woven Glass ClothFR4 补强板 Fiberboard 液态感光油墨 Liquid Photoimageable Resist Ink 压敏胶 Pressure Sensitive Adhesive（PSA）离型膜 Release Paper导电胶 Conducting Resin导电布 Electric Fabric泡棉 Foam导向导电胶 Anisotropic Conductive Film （ACF）导电泡棉 Conductive/Electric Foam屏蔽膜
19、Shield Film (金属)薄膜开关 Metal Dome （DOME）连接器 Connector电容 Capacitance ( C )电阻 Resistance ( R )集成电路 Integrated Circuit （IC）二极管 Diode (D)静电 Electro-Static Discharge（ESD）机械方向 Machine Direction （MD）垂直方向 Transverse Direction （TD）进刀 Feed进刀量 Chip Load转速 Speed焊接 Soldering手工焊接 Hand Soldering波焊 Wave Soldering品质允收
20、标准 Acceptable Quality Level（ AQL）菲林 Film字符 Legend烘箱 Oven温度 Temperature其 它Others湿度 Humidity类 别 三 ： FPC 可 靠 性 测 试 项 目中 文 英 文电气性能 Testing of Electrical Performance导线电阻 Conductor Resistance表面层绝缘电阻 Surface Insulation Resistance (SIR)表面介质层耐电压强度 Dielectric Withstanding Voltage of Surface Layers机械性能测试 Testi
21、ng of Mechanical Property剥离强度 Peel Strength孔和焊垫的拉脱强度 Pull-out Strength for Plain Holes and Footprints镀层附着力 Plating Adhesion可焊性 Solderability耐挠曲性 Flexural Endurance耐弯折性 Bending Resistance环境性能 Environmental Performance温度循环 Temperature Cycling湿度测试 Humidity Test冷热冲击 Thermal Shock 镀铜通孔的耐热冲击性 Thermal Shoc
22、k Resistance of Copper Plated -through Holes迁移性 Migration耐化学性 Chemical Resistance清洁度 Cleanliness阻燃性 Flame Resistance推力测试 Shear Test 手机翻盖测试 Handset Renovate Test窗口弯折测试 Window Bend Test手机滑盖测试 Sliding Test 焊点拉伸强度测试 Solder Point Pull Strength Test盐雾测试 Salt Fog Test蚀刻因子 Etching Factor 切片检测 Cross Section 镀层厚度 Plating Thickness恒温恒湿 Constant Temperature and Humidity 翻折疲劳测试 Fold Fatigue Test安定性 Dimensional Stability速度 Speed压力 Pressure喷淋压力 Spouting Pressure浓度 Concentration原理图纸 Schematic Diagram线宽 Line Space线距 Line Width线路间距 Pitch平展性 Ductility引用标准： IPC/JPCA-6202 单、双面绕性印制板的性能手册
