1、PCB 疊層設計介紹AgendaBackground KnowledgeTransmission Line TheoryPCB Cross-section introductionPCB Material and Copper ThicknessPCB Layer Stack-up Design FlowDesign conditions and TargetMaterial / Copper selectionDefine other parametersImpedance calculationBackground Knowledge(1/3)Background Knowledge(2/
2、3)PCB Design and ProfitabilityFrom Lee Ritcheys “Right the First Time”(Vol.I)Background Knowledge(3/3)Why and How to define the trace width?Transmission Line TheoryTransmission LineA transmission line is composed of any two conductors that have lengthSignal Path and Return PathAny circuit length at
3、least 1/10th of the edge rate must be considered as a transmission lineTransmission LineElectromagnetic Properties Equivalent Circuit ModelCharacteristic ImpedancePropagation Equation (Time Delay)Transmission LineTransmission Line StructureMicrostrip（微帶線）Stripline （帶狀線）Transmission LineReflection an
4、d TransmissionReflection CoefficientTransmission CoefficientPCB Cross-section introductionPCB Material ThicknessCopper Clad Laminate(CCL)-COREThickness (mil): 3, 4, 5, 6, 8, 10, 12, 14, 15, 18, 20, 21, 24, 31, 32, 39, 44, 47, 59, 6231mil, without Cu;31mil, with Cu.PCB Material ThicknessCopperPCB Lay
5、er Stack-up Design FlowDesign Flow-Design conditions and Target -Design conditionsBoard sizeBoard layersTotal ThicknessDesign TargetEnough routing space and crosstalk marginMeet target impedance Meet PI requirementMeet DFM rulesMeet high speed signals IS requirementPrepreg / Core SelectionImpact tra
6、ce widthImpact impedanceTg requirementInsertion loss requirementPCB costCopper selectionPower integrityPCB costDefine the other parametersMeet DFM rulesSymmetric constructionTotal thicknessDesign Flow-Define other parameters -Impedance Calculation(Single)Design Flow-Impedance Calculation W1 ?milW2 = ? milH2 3H1 + T1Impedance Calculation(Differential)W1 ?milW2 = ? milH2 3H1 + T1Impedance Calculation(Other constructions)Design Flow-Impedance Calculation -Q&A
