1、IPC-9111 2019中文English印制电路板组装工艺的故障排除Troubleshooting for PrintedBoard Assembly ProcessesIPC-9121 2016中文English印制板制造工艺疑难解答TROUBLESHOOTINGFOR PBC FABRICATIONPROCESSESIPC-9151 D English 印制板制程能力、品质以及相应可靠性(PCQR2)基准测试标准和数据库Process Capability,Quality,and Relative Reliability(PCQR2)Benchmark TestStandard and
2、 DatabaseIPC-9191 1999 English 实施统计过程控制(SPC)的通用导则General Guidelines forImplementation of StatisticalProcess Control(SPC)IPC-9194 2004 English统计过程控制（SPC）在印制板装配制造指南中的应用Implementation of StatisticalProcess Control(SPC)Applied to Printed BoardAssembly ManufactureIPC-9199 2002 English统计过程控制（SPC）及质量评价全文档的
3、使用权Statistical Process Control(SPC)Quality RatingIPC-9201 1996 English 表面绝缘电阻手册 Surface InsulationResistance HandbookIPC-9202 2011 English评估电化学性能的材料和工艺特性/鉴定试验方案Material and ProcessCharacterization/Qualification Test Protocol forAssessing ElectrochemicalIPC-9203 2012 EnglishIPC-9202和IPC-B-52标准试验车用户指南
4、Users Guide to IPC-9202and the IPC-B-52 StandardTest VehicleIPC-9204 2017 English印刷电子的挠性和拉伸性测试指南Guideline on Flexibility andStretchability Testing forPrinted ElectronicsIPC-9241 2016 English 微切片制备指南Guidelines for MicrosectionPreparationIPC-9252B B中文English未组装印制板电气测试要求IPC-9252定义了适当的测试等级，协助选择测试分析仪、测试参
5、数、测试数据和夹IPC-9257 2021 English柔性印刷电子产品的电气试验要求Requirements for ElectricalTesting of Flexible PrintedElectronicsIPC-9261 A English为PCAs的DPMO过程和估计产量 In-Process DPMO andEstimated Yield for PCAsIPC-9262 2016 中文组装行业应用之AOI设备的特性描述与鉴定Specification forCharacterization andVerification of AssemblyLevel Automatic
6、 OpticalIPC-9301 2018 English微电子封装设计和可靠性的数值分析指南Numerical AnalysisGuidelines forMicroelectronics PackagingDesign and ReliabilityIPC-9501 1995 English为评价电子元件的印制线路板装配过程模拟PWB Assembly ProcessSimulation for Evaluation ofElectronic Components(Preconditioning IComponents)IP-9502 1999 English电子元件的印制线路板组装焊接工
7、艺指引PWB assembly solderingprocess guideline forelectronic componentsIPC-9504 1998 English 非IC元件评价用组合工艺模拟Assembly ProcessSimulation for Evaluation ofNon-IC ComponentsIPC-9505 2017 English评估部件和清洁材料兼容性的指南方法Guideline Methodology forAssessing Component andCleaning MaterialsCompatibilityIPC-9591 2006 Engli
8、sh空气动装置性能参数(如机械,电气,环境和质量/可靠性)Performance Parameters(Mechanical,Electrical,Environmental andQuality/Reliability)forIPC-9592 B English计算机和通信行业用电源转换设备的要求本文件为计算机和通信行业的电源转换设备(PCD)提供了标准化的要求。短语“电源转换设备”指交流-直流和直流IPC-9631 2010 EnglishIPC-TM-650方法2.6.27热应力对流回流焊组件模拟用户指南Users Guide for IPC-TM-650,Method 2.6.27,T
9、hermal Stress,Convection Reflow AssemblySimulationIPC-9641 2013 English 高温印刷电路板平整度指南High Temperature PrintedBoard Flatness GuidelineIPC-9691B B中文英文IPC-TM-650 测试方法2.6.25耐导电阳极丝(CAF)测试（电化学迁移测试）用户指南User Guide for the IPC-TM-650,Method 2.6.25,Conductive Anodic Filament(CAF)Resistance Test IPC-9701A AEngl
10、ish中文表面贴装焊接连接的性能测试方法及鉴定要求Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 因其它等原因，不能全部发布。此为样本文件，如需更多交流：2657467977 微信：STD7879www.file123.topIPC-9702 2004English中文板极互连的单向弯曲特性描述Monotonic Bend Characterization of Board-Level Interconnects IPC-9703 2009English中文
11、焊点可靠性机械冲击试验准则Mechanical Shock TestGuidelines for Solder JointReliabilityIPC-9704A AEnglish中文印制板应变测试指南Printed Circuit Assembly Strain Gage Test Guideline IPC-9706 2013 English用于FCBGA SMT元件焊接裂纹和焊盘凹坑_痕迹裂纹检测的机械冲击原位电学计量测试指南Mechanical Shock In-situElectrical Metrology TestGuidelines for FCBGA SMTComponent
12、 Solder CrackIPC-9707 2018 English球形弯曲试验方法的板级互连特性Spherical Bend Test Methodfor Characterization ofBoardLevel InterconnectsIPC-9708 2010中文English鉴定印制板组件焊盘坑裂的测试方法 TestMethodsforCharacterizationofPrintedBoardAssemblyPadIPC-9709 2013 ENGLISH机械测试期间声发量测量的规则指南Test Guidelines for AcousticEmission Measurementduring Mechanical TestingIPC-9797 2020中文English汽车和其他高可靠性应用的压接标准Press-Fit Standard forAutomotive Requirementsand Other High-ReliabilityApplications
