1、IPC-HDBK-4691 2015 English 电子装配操作中的粘合手册Handbook on AdhesiveBonding in ElectronicAssembly OperationsIPC-MI-660 English 印制板材料进货检验指南Guidelines for Incominginspection of Printedboard MaterialsIPC-OI-645 1993 English 目视光学检验辅助设备标准Standard for VisualOptical Inspection AidsIPC-PE-740A A English 印制板制造和组装的故障排
2、除Troubleshooting for PrintedBoard Manufacture andAssemblyIPC-QE-605A A English 印制板质量评价 PCB Quality EvaluationHandbookIPC-S-816 1993 English表面安装技术过程导则及检验表SMT Process Guideline andChecklistIPC-SM-780 1998 English 外部贴装的元件封装和互连重点Component Packaging andInterconnecting withEmphasis on SuerfaceMountingIPC-
3、SM-782A A English 元件封装制作标准Surface Mount Design andLand Pattern StandardPlease refer as followinformation data.IPC-SM-784 1990 English 板上芯片技术实施指南Guidelines for Chip-on-Board TechnologyImplementationIPC-SM-785 1992English中文表面安装焊接件加速可靠性试验导则Guidelines for AcceleratedReliability Testing ofSurface Mount s
4、olderAttachmentsIPC-SM-817A AEnglish中文表面贴装用绝缘粘合剂通用规范 GeneralRequirementsforDielectricSurfaceMountAdhesivesIPC-SM-840E EEnglish中文永久性阻焊剂和挠性覆盖材料的鉴定和性能规范Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover IPC-SPVC-WP-0062003 English 轮转法测试和分析无铅合金锡、银Round Robin Testing andAnalysis Lead-Freee Alloys因其它等原因，不能全部发布。此为样本文件，如需更多交流：2657467977 微信：STD7879www.file123.top
