1、IPC-MC-790Guidelines for MultichipModule TechnologyUtilizationASSOCIATIONCONNECTINGELECTRONICSINDUSTRIES2215SandersRoad,Northbrook,IL600626135Tel.847.509.9700Fax847.509.9798www.ipc.orgIPC-MC-790July 1992 A standard developed by IPC Provided by IHS Markit Licensee=/,User=,Not for Resale,No reproducti
2、on or networking permitted without license from IHS Markit-,-,-The Principles ofStandardizationIn May 1995 the IPCs Technical Activities Executive Committee adopted Principles ofStandardization as a guiding principle of IPCs standardization efforts.Standards Should:Show relationship to Design for Ma
3、nufacturability(DFM)and Design for the Environment(DFE)Minimize time to market Contain simple(simplied)language Just include spec information Focus on end product performance Include a feedback system on use andproblems for future improvementStandards Should Not:Inhibit innovation Increase time-to-m
4、arket Keep people out Increase cycle time Tell you how to make something Contain anything that cannotbe defended with dataNotice IPC Standards and Publications are designed to serve the public interest through eliminatingmisunderstandings between manufacturers and purchasers,facilitating interchange
5、ability andimprovement of products,and assisting the purchaser in selecting and obtaining with minimumdelay the proper product for his particular need.Existence of such Standards and Publicationsshall not in any respect preclude any member or nonmember of IPC from manufacturing or sell-ing products
6、not conforming to such Standards and Publication,nor shall the existence of suchStandards and Publications preclude their voluntary use by those other than IPC members,whether the standard is to be used either domestically or internationally.Recommended Standards and Publications are adopted by IPC
7、without regard to whether theiradoption may involve patents on articles,materials,or processes.By such action,IPC doesnot assume any liability to any patent owner,nor do they assume any obligation whatever toparties adopting the Recommended Standard or Publication.Users are also wholly responsiblefo
8、r protecting themselves against all claims of liabilities for patent infringement.IPC PositionStatement onSpecificationRevision ChangeIt is the position of IPCs Technical Activities Executive Committee(TAEC)that the use andimplementation of IPC publications is voluntary and is part of a relationship
9、 entered into bycustomer and supplier.When an IPC standard/guideline is updated and a new revision is pub-lished,it is the opinion of the TAEC that the use of the new revision as part of an existingrelationship is not automatic unless required by the contract.The TAEC recommends the useof the lastes
10、t revision.Adopted October 6.1998Why is therea charge forthis standard?Your purchase of this document contributes to the ongoing development of new and updatedindustry standards.Standards allow manufacturers,customers,and suppliers to understand oneanother better.Standards allow manufacturers greate
11、r efficiencies when they can set up theirprocesses to meet industry standards,allowing them to offer their customers lower costs.IPC spends hundreds of thousands of dollars annually to support IPCs volunteers in thestandards development process.There are many rounds of drafts sent out for review and
12、the committees spend hundreds of hours in review and development.IPCs staff attends andparticipates in committee activities,typesets and circulates document drafts,and follows allnecessary procedures to qualify for ANSI approval.IPCs membership dues have been kept low in order to allow as many compa
13、nies as possibleto participate.Therefore,the standards revenue is necessary to complement dues revenue.Theprice schedule offers a 50%discount to IPC members.If your company buys IPC standards,why not take advantage of this and the many other benets of IPC membership as well?Formore information on me
14、mbership in IPC,please visit www.ipc.org or call 847/790-5372.Thank you for your continued support.Copyright 1992.IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Anycopying,scanning or other reproduction of these materials without the prior
15、 written consent of the copyright holder is strictly prohibited andconstitutes infringement under the Copyright Law of the United States.Provided by IHS Markit Licensee=/,User=,Not for Resale,No reproduction or networking permitted without license from IHS Markit-,-,-IPC-MC-790Guidelines for Multich
16、ipModule TechnologyUtilizationDeveloped by the IPC Multichip Module Subcommittee of the Hybrid andRelated Technologies Committee of IPCAbout this documentThis document published by IPC is for informational purposes and can serveas a baseline for selecting an appropriate MCM technology.It is not inte
17、ndedto be a standard and in fact,this document is expected to evole with signicanttechnological developments.This document reports on work which has been done by a variety of individualsand organizations concerned with increasing system performance and reliabilitythrough multichip module technology.
18、You,as the reader,are invited to reviewthe content of this document and communicate your comments and ideas foradditional details that may serve the industry to the appropriate trade associ-ations or technical societies.In this way,the infrastructure necessary toimplement this new philosophy for pac
19、kaging will make its way forward.Thanks to Chairman Phil Marcoux,ISHM and IPC are in the process of adetailed update program.It is expected that the result of this effort will culminatein a hardbound version that will provide an excellent reference tool.IPC will alsoconsider future review of the MC-
20、790 as more information becomes available.You are invited to participate in any of the revision or update processes.Users of this standard are encouraged to participate in thedevelopment of future revisions.Contact:IPC2215 Sanders RoadNorthbrook,Illinois60062-6135Tel 847 509.9700Fax 847 509.9798ASSO
21、CIATIONCONNECTINGELECTRONICSINDUSTRIES Provided by IHS Markit Licensee=/,User=,Not for Resale,No reproduction or networking permitted without license from IHS Markit-,-,-AcknowledgmentAny Standard involving a complex technology draws material from a vast number of sources.While the principal members
22、of the IPC Multichip Module Subcommittee of the Hybrid and Related Technologies Committee are shown below,it is notpossible to include all of those who assisted in the evolution of this standard.To each of them,the members of the IPCextend their gratitude.Hybrid and RelatedTechnologies CommitteeMult
23、ichip ModuleSubcommitteeTechnical Liaison of theIPC Board of DirectorsChairmanRobert LomersonGeneral DynamicsChairmanPhil MarcouxPPM AssociatesWilliam MillerWm.Miller&Assoc.Multichip Module SubcommitteeP.J.Amick,Mc Donnell DouglasElec.Sys Co.R.Anderson,NCR Corp.E.M.Aoki,Hewlett PackardLaboratoriesA.
24、K.Arora,University of MarylandJ.Bakszt,Ericsson TelecomS.Banks,Sanwa Electric Corp.P.Barela,Jet Propulsion LabM.G.Bevan,Johns HopkinsUniversityP.Boudreau,Hughes Aircraft Co.C.Bradshaw,Memorex Telex Corp.B.J.BremmerC.P.Brooks,AMP Inc.M.P.Burdzy,Loctite Corp.J.S.Burg,3M Co.J.Burgess,Amoco Chemical Co.
25、E.S.Cain,TribotechD.Caissie,Teradyne ConnectionsSystemsT.Canning,Rockwell InternationalA.Cash,Northrop Corp.E.CassinelliD.D.Chang,AT&T Bell LaboratoriesM.Clawson,Jet Propulsion LabC.Cleveland,Boeing Aerospace&ElectronicsC.A.Connett,3M Co.Z.F.Crawley,Rhone Poulenc Inc.L.A.CrouchD.Currie,Teledyne Syst
26、ems Co.D.Currier,Ambitech Inc.F.J.Dance,Burndy CorporationM.J.Di Franza,Mitre Corp.D.DinellaR.R.Douglas,Douglas&Assoc.F.Durso,Mac Dermid&Assoc.R.E.Egloff,Acheson Colloids Co.R.Eldridge,AmphenolJ.A.EmersonG.P.Evans,Indium Corp.of AmericaJ.W.Evans,NASA HQM.S.Fan,Paramax Systems Corp.P.Farris,Motorola
27、Inc.Dr.R.J.Fedor,Gould Inc.G.M.Ferrari,Tech Circuits Inc.J.Fjelstad,Elf TechnologiesD.H.Frailey,Metcal Inc.D.Fritz,Mac Dermid Inc.V.Gandhi,Teradyne ConnectionsSystemsL.E.Gates,Hughes Aircraft Co.M.Gibbel,Jet Propulsion LabG.Ginsberg,Component DataAssociatesP.Goldman,Kalmus&AssociatesInc.C.Gonzalez,S
28、CI Manufacturing Inc.B.W.Gray,Bull HN InformationSystemsF.Gray,Texas Instruments Inc.W.J.Green,Methode Electronics Inc.M.I.Gurian,Advanced Systems Inc.B.Hamilton,Flex Products Inc.F.Harwath,Molex Inc.K.S.Hill,Hughes Aircraft Co.P.E.Hinton,Hinton PWBEngineeringS.Ho,Western Digital Corp.J.T.Hoback,Amo
29、co ChemicalCompanyD.L.Holland,Lockheed Sanders Inc.S.T.Holzinger,Rogers Corp.M.Hook,U.S.NavyA.S.Hoover,Alpha Metals Inc.S.R.HudsonL.Hymes,Plexus Corp.E.Ichkhan,Hughes Aircraft Co.W.I.Jacobi,William Jacobi&Assoc.D.Jacobus,Control Data Corp.M.Jagernauth,Northern TelecomM.W.Jawitz,Litton Guidance&Contr
30、ol SystemsC.F.Johnson,Hercules Inc.J.R.Jones,Pacic Missile Test CenterR.A.Jones,IBM Corp.J.A.Kelly,Motorola Inc.G.W.Kenealey,Control Data Corp.P.J.Kenney,Acheson Colloids Co.W.G.Kenyon,E I DuPont DeNemours&Co.D.H.Knapke,U.S.Air ForceG.Kotecki,Northrop Corp.J.J.Kozuch,4DI Inc.J.J.Kreuzpaintner,Martin
31、-MariettaCorp.F.Kuwako,Taiwan Copper Foil CoLtd.IPC-MC-790 July 1992ii Provided by IHS Markit Licensee=/,User=,Not for Resale,No reproduction or networking permitted without license from IHS Markit-,-,-P.Lall,University of MarylandJ.F.Legein,Raytheon Co.J.D.Leibowitz,Shireline CompositesInc.T.Li,Mar
32、tin-Marietta Corp.R.B.Lomerson,General DynamicsB.Mahler,Ohmega Technologies Inc.P.Marcoux,PPM AssociatesS.R.Martell,Sonoscan Inc.J.C.Mather,Rockwell InternationalJ.M.Mc Creary,IBM Corp.G.T.Mc Kenna,SymbolTechnologies Inc.S.Meeks Jr.,Lexmark International/IBM Corp.G.Messner,AMP-AKZO Corp.G.Monzani,Ci
33、sel SpaJ.J.Moran,Vitro Corp.J.H.Morton,IBM Corp.G.C.Munie,AT&T Bell LaboratoriesR.Nataraj,Pycon Inc.F.G.Neatrour,E-Systems Inc.T.D.Newton,Norplex/OakL.J.Nielsen,Raytheon Co.C.K.Noddings,Microelectronics&ComputerS.M.NolanT.E.Noll,Teradyne ConnectionsSystemsW.Olssen,Lockheed EngineeringW.A.Ortloff,Hug
34、hes Aircraft Co.K.Osaka,Shin-Kobe ElectricMachineryDr.A.G.Osborne,Alliant TechSystems Inc.C.Pagel,U.S.NavyR.E.Park Jr.,Raytheon Co.S.T.Partel Jr.,Motorola Inc.C.Payne,Intergraph Corp.S.Pirayesh,Compeq InternationalCorp.D.Pommer,I-PakR.Prasad,Intel Corp.V.L.QuattriniJ.T.Rates,Chip Supply Inc.C.T.RayR
35、.S.Reylek,3M Co.B.C.Rietdorf,Magnavox ElectronicSystems Co.P.B.Rose,Martin-MariettaElectronicsR.Savage,NASA/Goddard SpaceFlight Cntr.M.A.Savrin,Kulicke&SoffaIndustries Inc.D.Scaff,Jet Propulsion LabR.A.Schenkel,Landis&GyrD.P.Schnorr,General Electric Co.Dr.L.Schoenberg,AT&T BellLaboratoriesL.Scholten
36、,Optrotech Inc.M.L.Seltzer,Delco SystemsOperationsL.E.Smith,AT&T Bell LaboratoriesG.A.Smith,Trace LaboratoriesEastV.Solberg,SCI Systems Inc.P.S.Speicher,U.S.Air ForceT.K.Stewart,Speedy CircuitsJ.Svensson,Ericsson TelecomE.M.Sworzyn,Teledyne Systems Co.G.Theroux,Honeywell Inc.R.T.Thompson,Loctite Cor
37、p.H.Thrasher,Shipley Co.Inc.R.T.Traskos,Rogers Corp.D.Trobough,Tektronix Inc.D.B.Tuckerman,Chip Inc.J.L.Vargo,Allen-Bradley Co.F.W.Verdi,AT&T Bell LaboratoriesN.Virmani,Paramax SystemsD.L.Wasler,Jet Propulsion LabT.M.White,Boeing Aerospace&ElectronicsDr.A.Wilson,Texas InstrumentsS.Witzman,Northern T
38、elecom Ltd.A.D.Wolfrum,Shipley Co.Inc.J.Wynschenk,Enthone-Omi Inc.July 1992 IPC-MC-790iii Provided by IHS Markit Licensee=/,User=,Not for Resale,No reproduction or networking permitted without license from IHS Markit-,-,-Table of ContentsSection 1 Technology Overview1.0 INTRODUCTION.11.1 Multichip M
39、odule Classication.31.2 Materials Data.61.3 Advantages and Disadvantages ofMultichip Modules.61.4 Design Cycle.61.5 Assembly Options.101.6 Substrate(Interconnect Carrier).111.7 Thermal Issue.11Section 2 Multichip Module General DesignConsiderations2.0 INTRODUCTION.132.1 Materials.132.2 Components.19
40、2.3 Multichip Module Design Layout.222.4 Packaging and Higher-Level Assembly.262.5 Electrical Design Guidelines.29Section 3 MCM-C Design Considerations(Ceramic/Glass Based Materials)3.0 INTRODUCTION.323.1 Layout.323.2 Conductor Pattern.323.3 Conductor Routing.323.4 Land Patterns.353.5 Wire Bonds.353
41、.6 Vias.363.7 Resistors.363.8 Substrate Requirements.40Section 4 MCM-L Design Considerations(Organic Based Materials)4.0 INTRODUCTION.444.1 Design Layout.444.2 Conductor Pattern.454.3 Land Pattern.494.4 Holes.544.5 Resistors.564.6 Substrate Materials.57Section 5 MCM-D Design Considerations(Deposited
42、Dielectric Films on Various Base Materials)5.0 INTRODUCTION.615.1 Layout.615.2 Conductor Pattern.625.3 Conductor Routing.625.4 Land Patterns.635.5 Vias.635.6 Resistors.635.7 Integrated Circuit Die(Chips).685.8 Dielectrics.685.9 Substrates.68Section 6 Wire Bond Technology6.0 INTRODUCTION.736.1 Design
43、 for Wire Bonding.736.2 Components.746.3 Wire Bonding.75Section 7 Tape Automated Bonding(TAB)Technology7.0 INTRODUCTION.807.1 Inner Lead Bonding(ILB).807.2 Outer Lead Bonding(OLB).81Section 8 Flip Chip Bonding Attachment Techniques8.0 INTRODUCTION.878.1 Design for Flip Chip.878.2 Thermal Considerati
44、ons.888.3 Interconnection.898.4 Alternative to Flip-Chips.89Section 9 Design for Test,Modication,and Repair9.0 INTRODUCTION.919.1 Design for Test.919.2 Design for Modication and Repair.929.3 Minimizing Rework/Repair.93Section 10 Environmental Protection10.0 INTRODUCTION.9410.1 Conformal Coating.9410
45、.2 Encapsulation.9610.3 Plastic Packaging.9710.4 Laminated Modules(Smart Cards).9810.5 Metal Enclosures.98Section 11 Reliability Engineering Guidelines11.0 INTRODUCTION.10411.1 Reliability Data.10411.2 Reliability Denitions.10411.3 Constant Failure Rate.10511.4 Failure Rate of Multiple-ElementSystem
46、s.10611.5 Accelerated Life Testing.106IPC-MC-790 July 1992iv Provided by IHS Markit Licensee=/,User=,Not for Resale,No reproduction or networking permitted without license from IHS Markit-,-,-11.6 Failure Mechanisms in MCMs.10711.7 Construction Analysis.10811.8 Other Reliability Tests.108Section 12
47、Applications12.0 INTRODUCTION.10912.1 Current Applications.109Section 13 Reference Documents13.0 REFERENCE DOCUMENTS.12013.1 Institute for Interconnecting andPackaging Electronic Circuits(IPC).12013.2 Electronic Industries Association(EIA).12013.3 Department of Defense(DoD).12113.4 American National
48、 Standards Institute(ANSI).12113.5 American Society for Testing Materials(ASTM).121Section 14 Terms and Denitions14.0 Terms and Denitions.122FiguresFigure 11 Typical pin count per integrated circuit.2Figure 12 Forecast system clock speed increase198792.3Figure 13 Price/density relationships.4Figure
49、14 Interconnection density vs.line technology.5Figure 15 Expansion of Packaging Materials.8Figure 16 Conductivity of Packaging Materials.8Figure 17 Methods of 3D die integration.10Figure 18 Eight-Layer MCM-L.12Figure 21 Resistor paste stability.23Figure 22 Inductance/wire length relationships.23Figu
50、re 23 Example of total thermal resistancecalculation.31Figure 24 Thermal resistance during heat spreading.31Figure 31 Sequence of events for MCM layout.32Figure 32 Final conguration of MCM-C using wirebonding.33Figure 33 Orientation for conductor-resistor patterns.34Figure 34 Land and conductor geom
