1、 SMTA China South 华南高科技会议 Technical Conference 1 26thAugust 2008 (Tuesday) / 2008 8 月 26 日 (星期二 ) (CS08-TC1) Technology Conference / 高科技研讨会 Conference Chairman/会议主席 : Michael Y.F Wong 王 玉辉 Vice President (Technology) of SMTA Hong Kong Chapter / SMTA 香港分会副会长 (技术 ) Director-Manufacturing Engineering o
2、f Embedded Computing and Power of Emerson Network Power 艾默生网络能源嵌入式运算及电源总监 -制造经理 Venue/地点 Room No.312, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 312 会议室 Time/时间 Topic/议题 Speaker/主讲人 Session 1 10:00 10:30 Future Lead-Free Solder Alloys and Fluxes Meeting Challenges of M
3、iniaturization 未来的无铅合和助焊剂-满足小型化的挑战 (CS08-TC1.1) Dr. Ningcheng Lee 宁成博士 Indium Corporation of American 美国铟泰公司 10:30 11:00 Discussion on Ball Placement Technology Applied in SMT IndustrySMT 植球工艺探讨 (CS08-TC1.2) May Yan 颜梅 Flextronics Electronics Technology (Suzhou) Co.,Ltd. 伟创电子 (苏州) 有限公司 11:00 11:15 C
4、offee Break / 歇 Session 2 11:15 11:45 Effective Parts Library Management System Across Multiple Machine Vendor Platforms 有效地管多家设备厂商的电子元器件库 (CS08-TC1.3) Allen Tseng 曾元宏 Valor Computerized Systems (Shenzhen) Co., Ltd. 华尔莱科技 (深圳) 有限公司 11:45 12:15 Conduction Soldering: Facts, Fiction and Best Practices
5、关于热传导焊接的事实 、 误区与最佳应用技术 (CS08-TC1.4) Paul Wood OK International OK 国际集团 12:15 13:45 Lunch Break / 午餐 Session 3 13:45 14:15 Cleanliness Requirements Prior to Conformal Coating 涂敷工艺之前的清洁要求 (CS08-TC1.5) Tony Ge 葛挺峰 ZESTRON Asia Pacific ZESTRON 亚太区代表处 14:15 14:45 Non-Destructive Techniques for Identifyin
6、g Crack Defect in BGA Joints: TDR, 2DX, and Cross-section/SEM Comparison 无破坏性技术鉴别 BGA 缺陷 :TDR,2DX,与 SEM 的比较 (CS08-TC1.6) Sea Tang 唐振权 Flextronics International 美国伟创国际公司 SMTA China South 华南高科技会议 Technical Conference 2 26thAugust 2008 (Tuesday) / 2008 8 月 26 日 (星期二 ) continued 续(CS08-TC1) Technology C
7、onference / 高科技研讨会 continued 续Venue/地点 Room No.312, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 312 会议室 Time/时间 Topic/议题 Speaker/主讲人 14:45 15:00 Coffee Break / 歇 Session 4 15:00 15:30 Qualification of A Lead-Free Card Assembly & Test Process for A Server Complexity PCBA
8、 复杂的无铅服务器印制线板的组装与测试工艺认证 (CS08-TC1.7) PK Pu 蒲柯 IBM CPC 国际商用机器中国采购 (深圳) 有限公司 15:30 16:00 Defect Structure and Failure Mechanism of PTH Electrodeposits PTH 孔铜镀层结晶缺陷及失效机研究 (CS08-TC1.8) Danny Tu 涂运骅 Huawei Technologies Ltd 华为技术有限公司 16:00 16:30 Advanced Coatings For Electronics Applications Corrosion Resi
9、stant Coatings for Circuit Boards 电子应用先进表面处工艺-印刷电板用抗腐蚀电镀技术 (CS08-TC1.9) Sunny Mu 穆菊 Marco Mui 梅志宏 Cookson Electronics-Enthone 确信电子-乐思化学 All papers will be presented in Chinese 所有演讲者都将使用中文 SMTA China South 华南高科技会议 Technical Conference 3 26thAugust 2008 (Tuesday) / 2008 8 月 26 日 (星期二 ) (CS08-TC2) Tech
10、nology Conference / 高科技研讨会 Conference Chairman/会议主席 : Xin Zhou 周欣 Vice President (Technology) of SMTA China / SMTA 中国 副会长 (技术 ) Expert of Electronics Manufacture & Assembly of Huawei Technologies Co., Ltd. 华为技术有限公司电子组装制造技术专家 Venue/地点 Room No.314, 3/F., Shenzhen Convention & Exhibition Center, Shenzh
11、en, China 中国深圳会展中心三楼 314 会议室 Time/时间 Topic/议题 Speaker/主讲人 Session 1 10:00 10:30 Halogen-Free Debate on Solder Paste: IPC Classification and Application 锡膏的无卤素探讨关于 IPC 的定义及应用 (CS08-TC2.1) Christine Poon 潘丽萍 Kester Solder 凯斯特配件公司 10:30 11:00 Is it Really Impossible? Combining Superior Anti-Oxidation a
12、nd Superior Print 真的可能吗？出色的抗氧化和印刷性 (CS08-TC2.2) Dr. Ningcheng Lee 宁成博士 Indium Corporation of American 美国铟泰公司 11:00 11:15 Coffee Break / 歇 Session 2 11:15 11:45 Managing Electronics Manufacturing Business in China 国外中小型电子制造业到中国的创业和经营 (CS08-TC2.3) Dr. Koh PacRim Technologies Inc. 环太科技有限公司 11:45 12:15
13、Process Development and Reliability Evaluation for Inline Package on Package (POP) Assembly 在线叠装片组装的工艺发展及可靠性评估 (CS08-TC2.4) Jenson Lee Flextronics International 美国伟创国际公司 12:15 13:45 Lunch Break / 午餐 Session 3 13:45 14:15 Process and Reliability Study of Lead-Free Wave Soldering for Large Thick Board
14、s 厚大印刷电板无铅波峰焊的工艺及可靠性研究 (CS08-TC2.5) Jenson Lee Flextronics International 美国伟创国际公司 14:15 14:45 Materials and Process Optimization for High Reliability Lead-Free Soldering 高可靠性无铅焊接材和工艺优化 (CS08-TC2.6) Andy Yuen 阮金全 Cookson Electronics-ALPHA 确信电子-爱法 SMTA China South 华南高科技会议 Technical Conference 4 26thAu
15、gust 2008 (Tuesday) / 2008 8 月 26 日 (星期二 ) continued 续(CS08-TC2) Technology Conference / 高科技研讨会 continued 续Venue/地点 Room No.314, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 314 会议室 Time/时间 Topic/议题 Speaker/主讲人 14:45 15:00 Coffee Break / 歇 Session 4 15:00 15:30 EPD Displ
16、ay Manufacturing-A Sleek & Effective Solution 电泳平板显示屏制造有效的低成本解决方案 (CS08-TC2.7) Tonny Tong 童锦屏 Flextronics Zhuhai Campus 伟创珠海工业园 15:30 16:00 The Art of Repeating Profiling in Reflow Soldering Process 回焊接监控中的重复测温 (Profiling)工作 (CS08-TC2.8) K.S Seet 薛竞成 KIC Inc. KIC 公司 All papers will be presented in C
17、hinese 所有演讲者都将使用中文 SMTA China South 华南高科技会议 Technical Conference 5 27thAugust 2008 (Wednesday) / 2008 8 月 27 日 (星期 三 ) (CS08-TC3) Technology Conference / 高科技研讨会 Conference Chairman/会议主席 : Michael Y.F Wong 王 玉辉 Vice President (Technology) of SMTA Hong Kong Chapter / SMTA 香港分会副会长 (技术 ) Director-Manufa
18、cturing Engineering of Embedded Computing and Power of Emerson Network Power 艾默生网络能源嵌入式运算及电源总监 -制造经理 Venue/地点 Room No.312, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 312 会议室 Time/时间 Topic/议题 Speaker/主讲人 Session 1 10:00 10:30 A Compliant and Creep Resistant SAC-AI (Ni)
19、Alloy 一个顺从的抗蠕变的 SAC-AI (Ni) 合 (CS08-TC3.1) Dr. Ningcheng Lee 宁成博士 Indium Corporation of American 美国铟泰公司 10:30 11:00 Building A Global Technologically Efficient Supply Chain 建一套全球科技性的有效供应链 (CS08-TC3.2) LH Chew 周良芳 IBM Corporation 国际商业机器股份有限公司 11:00 11:15 Coffee Break / 歇 Session 2 11:15 11:45 Stackin
20、g Technique of Fully Wafer Level Process without Thru-Silicon VIA-Commercial Applications 纯芯片级别的三维层叠封装技术工艺 无须穿透硅经 (CS08-TC3.3) Dr. Christian M. VAL 3D PLUS 11:45 12:15 Solder Micro-Bumping for 3D SiP and FlipChip 适用于三维系统封装和倒装工艺的回微凸点制作工艺 (CS08-TC3.4) Dr. Li Gong 龚里博士 SUSS Mircro Tec (Shanghai) Inc. 苏
21、斯贸易 (上海 ) 有限公司 12:15 13:45 Lunch Break / 午餐 Session 3 13:45 14:15 Mixed Assembly Technology-Challenges & Solutions 混合 合金 组装技术-挑战和解决方案 (CS08-TC3.5) Jojo Vigo Flextronics Zhuhai Campus 伟创珠海工业园 14:15 14:45 How to bring X-ray Microfocus Computed Tomography (CT) from Lab to the Production Floor? 如何将微焦点断层
22、扫描 (CT)检测技术从实验室扩展到生产线 (CS08-TC3.6) Friedhelm Maur YXLON Feinfocus, Shanghai 依科视国际有限公司 SMTA China South 华南高科技会议 Technical Conference 6 27thAugust 2008 (Wednesday) / 2008 8 月 27 日 (星期 三 ) continued 续(CS08-TC3) Technology Conference / 高科技研讨会 continued 续Venue/地点 Room No.312, 3/F., Shenzhen Convention &
23、Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 312 会议室 Time/时间 Topic/议题 Speaker/主讲人 14:45 15:00 Coffee Break / 歇 Session 4 15:00 15:30 A Study of 0201s and Tombstoning in Lead-Free Systems 无铅系统中 0201 元件和碑的研究 (CS08-TC3.7) Jackson Chan 陈嘉贤 Cookson Electronics-ALPHA 确信电子-爱法 15:30 16:00 The Path of Takin
24、g High Reliability Products to Lead-Free 引领高可靠性产品通往无铅之 (CS08-TC3.8) Xiaodong Jiang 姜晓东 Alcatel Shanghai Bell Co Ltd. 上海贝尔阿尔卡特股份有限公司 All papers will be presented in Chinese 所有演讲者都将使用中文 SMTA China South 华南高科技会议 Technical Conference 7 Certified SMT Engineer Course and Examination in Shenzhen 24-26 Augu
25、st 2008 (CS08-TT1) Certified SMT Engineer Course SMT 工程师认证课程 24thAugust 2008 (Sunday) / 2008 8 月 24 日 (星期 日 ) Venue/地点 Room No.315, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 315 会议室 Time/时间 Topic/议题 Instructor /讲师 09:00 17:00 Certified SMT Engineer Course (Theory) SMT
26、 工程师认证课程(论课) David Hu 胡狄 Indium Corporation 铟泰科技 Michael Wong 王玉辉 Emerson Network Power/艾默生网络能源 25thAugust 2008 (Monday) / 2008 8 月 25 日 (星期 一 ) Venue/地点 Room No.315, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 315 会议室 Time/时间 Topic/议题 Instructor 讲师 09:00 17:00 Certifie
27、d SMT Engineer Course (Theory & Examination)SMT 工程师认证课程(论课及考试) David Hu 胡狄 Indium Corporation 铟泰科技 Michael Wong 王玉辉 Emerson Network Power/艾默生网络能源 Hong Kong Chapter Organized by: Supported by: In conjunction with SMTA China South 华南高科技会议 Technical Conference 8 (CS08-TT1) Certified SMT Engineer Course
28、 SMT 工程师认证课程 .continued 续26thAugust 2008 (Tuesday) / 2008 8 月 26 日 (星期 二 ) .continued 续Venue/地点 Room No.315, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心三楼 315 会议室 Time/时间 Topic/议题 Instructor /讲师 09:00 17:00 Certified SMT Engineer Course (Examination) SMT 工程师认证课程 (考试 ) Dav
29、id Hu 胡狄 Indium Corporation 铟泰科技 Michael Wong 王玉辉 Emerson Network Power/艾默生网络能源 All courses will be presented in Chinese (Cantonese) 全部课程都将使用中文 (广东话) 讲解 SMTA China South 华南高科技会议 Technical Conference 9 27thAugust 2008 (Wednesday) / 2008 8 月 27 日 (星期 三 ) (CS08-AR) SMTA Hong Kong Chapter Annual Recepti
30、on / SMTA 香港分会周年酒会 Venue/地点 Sweet Osmanthus Hall, 6/F., Shenzhen Convention & Exhibition Center, Shenzhen, China 中国深圳会展中心 六 楼 桂花厅 Time/时间 Event 活动 17:00 19:00 SMTA Hong Kong Chapter Annual Reception SMTA 香港分会周 酒 会 SMTA China South 华南高科技会议 Technical Conference 10 (CS08-GT) Golf Tournament 2008 高尔夫球比赛
31、 2008 30thAugust 2008 (Saturday) / 2008 8 月 30 日 (星期 ) Venue/地点 Yin Li Foreign Investors Golf Club (Oingxi, Dongguan, China) 东莞市清溪镇银外商高尔夫球俱乐部 Time/时间 Schedule/程 07:00 Coach Transportation Pickup at Huanggang 大巴在皇岗接送 08:00 Arrive at the Golf Course and Registration 到达高尔夫俱乐部并登记 08:30 Tee-off Ceremony and Shotgun Start 开球典礼及比赛开始 13:30 Finishes 18 holes 完成 18 个球 14:15 Late Lunch and Awards Presentation 晚午餐和颁奖典礼 15:30 Return Coach Transportation to Huanggang 大巴回程至皇岗 16:30 Arrive at Huanggang and Dismiss 到达皇岗并解散 Hong Kong ChapterGolf Tournament 2008
