1、123 4562.9mm x 1.6mm TSOT-23 (DDC)(TOPVIEW)R2VOUTVOUTR1/C1ON/OFFVINTPS27081ADDCVIN VOUTR1/C1ON/OFFQ1Q2R1C1ESD ESDESDESDR2CL(2, 3)R2(1)(5)(6)(4)GPIO/LogicUp to8VSupply LOADTPS27081A ZHCSA94D APRIL 2012REVISED APRIL 2013具具有有电电平平位位移移 VGSQ1=-1.2V Figure 11. Vdrop vs IL; VGSQ1=-1.8VFigure 12. Vdrop vs IL
2、; VGSQ1=-2.5V Figure 13. Vdrop vs IL; VGSQ1=-3.3VFigure 14. Vdrop vs IL; VGSQ1=-4.5V Figure 15. Vdrop vs IL; VGSQ1=-5.5V12 Copyright 20122013, Texas Instruments Incorporated00.030.060.090.120.150 0.5 1 1.5 2 2.5 3Vdrop(V)ILoad (A)25 degC85 degCC003TPS27081A ZHCSA94D APRIL 2012REVISED APRIL 2013TYPIC
3、AL CHARACTERISTICS (continued)Figure 16. Vdrop vs IL; VGSQ1=-7VCopyright 20122013, Texas Instruments Incorporated 130.000.100.200.300.400.500.600 20 40 60 80 100 120LoadCurrent (A)Ambient Temp c83CLoad Current (A)C0080.000.501.001.502.002.503.000 20 40 60 80 100 120LoadCurrent (A)Ambient Temp (C)Loa
4、d Current (A)C0010.000.501.001.502.002.500 20 40 60 80 100 120LoadCurrent (A)Ambient Temp (C)Load Current (A)C0010.000.501.001.502.002.503.003.500 20 40 60 80 100 120LoadCurrent (A)Ambient Temp c83CLoad Current (A)C0080.000.501.001.502.002.503.000 20 40 60 80 100 120LoadCurrent (A)Ambient Temp (C)Lo
5、ad Current (A)C001TPS27081AZHCSA94D APRIL 2012REVISED APRIL 2013 PFET Q1 Minimum Safe Operating Area (SOA)Figure 17. Q1 SOA VGS_Q1 = -4.5V Figure 18. Q1 SOA VGS_Q1 = -3.0VFigure 19. Q1 SOA VGS_Q1 = -2.5V Figure 20. Q1 SOA VGS_Q1 = -1.8VFigure 21. Q1 SOA VGS_Q1 = -1.2V14 Copyright 20122013, Texas Ins
6、truments IncorporatedTPS27081A ZHCSA94D APRIL 2012REVISED APRIL 2013REVISION HISTORYChanges from Revision B (September 2012) to Revision C Page从数据表中删除了DRV封装预览。 1Changes from Revision C (January 2013) to Revision D Page更新了文档中的措词。 1Copyright 20122013, Texas Instruments Incorporated 15PACKAGE OPTION AD
7、DENDUM 28-Feb-2017Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp (C) Device Marking(4/5)SamplesTPS27081ADDCR ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS& no Sb/Br)CU SN Level-1-260C-UNLIM -40
8、 to 85 AUA(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existin
9、g customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), P
10、b-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http:/ for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TIs terms “Lead-Free“ or “Pb-Free“ mean semiconductor products that are com
11、patible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):
12、 This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines
13、 “Green“ to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak s
14、older temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a “ will appear on
15、a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball
16、Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TIs knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third
17、 parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destruct
18、ive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TIs liability arising out of such information exceed the tota
19、l purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM 28-Feb-2017Addendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominalDevice PackageTypePackageDrawingPins SPQ ReelDiameter(mm)ReelWidthW1 (mm)A0(mm)B0(mm)K0(mm)P1(m
20、m)W(mm)Pin1QuadrantTPS27081ADDCR SOT-23-THINDDC 6 3000 180.0 9.5 3.17 3.1 1.1 4.0 8.0 Q3PACKAGE MATERIALS INFORMATION 3-Mar-2017Pack Materials-Page 1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)TPS27081ADDCR SOT-23-THIN DDC 6 3000 184.0 18
21、4.0 19.0PACKAGE MATERIALS INFORMATION 3-Mar-2017Pack Materials-Page 2IMPORTANT NOTICE重重要要声声明明德州仪器(TI)公司有权按照最新发布的JESD46对其半导体产品和服务进行纠正、增强、改进和其他修改，并不再按最新发布的JESD48提供任何产品和服务。买方在下订单前应获取最新的相关信息，并验证这些信息是否完整且是最新的。TI公布的半导体产品销售条款(http:/ 16949和ISO 26262）的要求外，TI不对未达到任何该等行业标准要求而承担任何责任。如果TI明确宣称产品有助于功能安全或符合行业功能安全标准
22、，则该等产品旨在帮助客户设计和创作自己的符合相关功能安全标准和要求的应用。在应用内使用产品的行为本身不会配有任何安全特性。设计人员必须确保遵守适用于其应用的相关安全要求和标准。设计人员不可将任何TI产品用于关乎性命的医疗设备，除非已由各方获得授权的管理人员签署专门的合同对此类应用专门作出规定。关乎性命的医疗设备是指出现故障会导致严重身体伤害或死亡的医疗设备（例如生命保障设备、心脏起搏器、心脏除颤器、人工心脏泵、神经刺激器以及植入设备）。此类设备包括但不限于，美国食品药品监督管理局认定为III类设备的设备，以及在美国以外的其他国家或地区认定为同等类别设备的所有医疗设备。TI可能明确指定某些产品具备某些特定资格（例如Q100、军用级或增强型产品）。设计人员同意，其具备一切必要专业知识，可以为自己的应用选择适合的产品，并且正确选择产品的风险由设计人员承担。设计人员单方面负责遵守与该等选择有关的所有法律或监管要求。设计人员同意向TI及其代表全额赔偿因其不遵守本通知条款和条件而引起的任何损害、费用、损失和/或责任。邮寄地址：上海市浦东新区世纪大道1568号中建大厦32楼，邮政编码：200122Copyright 2017德州仪器半导体技术（上海）有限公司
