1、Distributor Training29-30 Mar 2007, ShanghaiPrimePACKThe New High Power IGBT ModulesPage 229-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. What is PrimePACK?Existing High Power ModulesIHM 1700V1600V1200VIHV 3.3kV6.5kVNEW!PrimePACK 1700V1200VHigh Power ModulesPage 329-Mar-07 Copyr
2、ight Infineon Technologies 2006. All rights reserved. PrimePACKTM2PrimePACKTM 3Modular Design of Package Footprint PrimePACKTM2 (89 x 172mm): up to 900A As soft as E3- IGBT4 - Low Power Chip (T4) Faster than T3; same softness as T3- Increased junction temperature Tvjop=150C / Tvjmax=175C 10S Short C
3、ircuit Robustness at 150C PrimePACK use P4 (IP4) and E4 (IE4)IGBT4 for PrimePACKPage 1129-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. EmCon4 4thGeneration of EmCon Diode (Freewheeling) Two versions of EmCon4 optimized for different application requirements- EmCon4 High Power Im
4、proved Softness- EmCon4 Low- & Medium Power Improved Softness- Increased junction temperature Tvjop=150C / Tvjmax=175C PrimePACK use EmCon4 High Power (IP4) and EmCon4 Medium Power (IE4)EmCon4 for PrimePACKPage 1229-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. IGBT4 & EmCon4 vs.
5、 IGBT3 & EmConFAST1200A800V1176V300V1200AIGBT4 (P4)IGBT3 (E3)EmCon4EmConFASTI=1/10 InomTj=TvjmaxIGBT Turn-offDiode Turn-offPage 1329-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. What else Reliability!PrimePACK use: Improved Bonding Technology plus IGBT4 (Tvjop = 150C) Same Power
6、 Cycling (PC) Capability Tjmax = 150C Nearly Doubled PC Capability Tjmax = 125C Rugged Al2O3 Substrate plus Cu Baseplate Improved Thermal Cycling (TC) CapabilityPage 1429-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. IC A1200VHalf Bridge1700VHalf Bridge400 FF450R17IE4450 FF450R12
7、IE4600 FF600R12IE4 FF650R17IE4900 FF900R12IE4 FF1000R17IE41400 FF1400R12IP4Footprint:PrimePACK 2: 172x89PrimePACK 3: 250x89Ilf lf17I17I17Ii t:iiProduct Range of PrimePACKPage 1529-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. AC TerminalApplication of PrimePACKLaminated DC Bus-ba
8、rDriver BoardExample 2:Parallel OperationExample 1:System ArrangementPage 1629-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. Application of PrimePACKEvaluation BoardEiceDRIVER2ED300C17-S/STAdaptor Board for PrimePACK2ED300C17-S/ST + Adaptor BoardPage 1729-Mar-07 Copyright Infineo
9、n Technologies 2006. All rights reserved. Application of PrimePACKModSTACK with PrimePACKPage 1829-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. Summary Available for 1200V & 1700V Half-bridge with Modular Design Low Stray Inductance (vs. IHM 140x130: -60%) Low Thermal Resistance
10、 RthCH (vs. to IHM 140x130: -30%) Low Weight (vs. IHMA: -45%) Increased Mechanical Robustness High Creepage (33mm) & Clearance Distance (19mm) Using IGBT4 & EmCon4 with Improved Softness Operating Temperature Tvjop = 150C Improved Reliabilities (PC & TC) Slim Module Design Ease Module Paralleling Application Support with Driver Solution Target Applications: High-power Drives & UPS, Electric VehiclesPage 1929-Mar-07 Copyright Infineon Technologies 2006. All rights reserved. Thank you for your attention!Any Questions?End of Presentation
