1、CCM产品工艺知识培训,制作:陈建文日期:2011.8.20,2,产品的应用产品的类型产品的构造产品的制作工艺问与答附录:专业名词介绍,3,Part I 产品的应用,4,Part I 产品的应用,拆解,拆解,手机摄像模组,5,Part II 产品的类型, 软板定焦模式(FF)1. B-To-B 2.Gold Finger,6,Part II 产品的类型, 软板变焦模式1.手动变焦(MF)2.自动变焦(AF),7,Part II 产品的类型, 插槽模式(Socket),8,Part II 产品的类型, 像素分类CIF (352*288) 10万像素 (0.1M)VGA (640*480) 30万
2、像素 (0.3M)SXGA (1280*1024) 130万像素 (1.3M)UXGA (1600*1200) 200万像素 (2.0M),9,Part III 产品的构造, CSP (Chip Scale Package),10,Part III 产品的构造, COB (Chip On Board),11,Part III 产品的构造,镜头(Lens),镜座(Holder),芯片(Chip),电路板(PCB),连接器(Con.),12,Part III 产品的构造,FPC,13,Part IV 产品的制作工艺, 材料1. 晶圆(Wafer)主要是由硅和锗组成,是摄像头模组的核心部分,称之为影
3、像传感器。,14,Part IV 产品的制作工艺,2. 线路板Printed Circuit Board印刷电路板,是电子元器件的支撑体,是电子元器件电气连接的提供者,简称PCB.,15,Part IV 产品的制作工艺,3. 镜座(Holder),16,Part IV 产品的制作工艺,4. 镜头(Lens),17,Part IV 产品的制作工艺,5. 软板(FPC)Flexible Circuit Board软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性绝佳的可挠性印刷电路。,18,Part IV 产品的制作工艺, 工艺流程,Wafer清洗,Plasma清洗,固晶,固晶烘烤,
4、邦线,金线检查,DAM邦定,DAM烘烤,二流体清洗,CCD检查,Glass贴附,CCD检查,固化,半成品测试,19,dispense,CMOS Chip,dispense,IR Glass,dispense,+,+,+,+,Lens Barrel,20,Part IV 产品的制作工艺,Die Bonding:使芯片与PCB粘合。 注意点：1.芯片方向2.胶量3.顶针和吸嘴印4.芯片角度5.芯片位置6.芯片倾斜,21,Part IV 产品的制作工艺,Wire Bonding: 通过金线焊接 使芯片与PCB线路导通。 注意点：1.接线是否正确2. 线弧3.金球大小4.金球厚度5.金线拉力6.金球推
5、力,22,Solder Paste,Screen Print,Passive Placement,For Die Attach,Passive,Solder Paste,Passive,Substrate,23,Die Attach,Wire Bonding,Wet Clean,Chip,Sensor Area,Au Wire,Chip,Sensor Area,Au Wire,24,IR Glass Mount,IR Glass SAW,Wafer Ring,IR Glass,IR Glass,25,Glue Dispense,IR Glass Attach,Holder,Holder,Glu
6、e,Glue,IR cut Glass,IR Glass,CA800-IR,CA800-IR,26,Glue Dispense,Holder Attach,Glue,Glue,Barrel Insert,Barrel,Holder,CA800-HA,CA800-HA,CA-800-BI,27,Singlation,cut,cut,28,Focus adjust,Barrel,Barrel Fixation,Motor,Lighting（Percolation Method),chart,Achromatic Lens,ND4（Adjustment of Light Quantity）,Lase
7、r,29,Part V 问与答,Q & A,30,Part VI 专业名词介绍,31,END Thanks !,32,Bonding Process,33,pad,lead,Free air ball is captured in the chamfer,34,pad,lead,Free air ball is captured in the chamfer,SEARCH HEIGHT,35,pad,lead,Free air ball is captured in the chamfer,SEARCH SPEED1,SEARCH TOL 1,36,Free air ball is captu
8、red in the chamfer,pad,lead,SEARCH SPEED1,SEARCH TOL 1,37,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,38,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,39,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,40,Fo
9、rmation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,41,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,IMPACT FORCE,42,Formation of a first bond Contact,pad,lead,heat,PRESSURE,Ultra Sonic Vibration,43,Formation of a first bond Base,pad,lead,Ultra Sonic Vibration,heat,PRESSURE,4
10、4,Capillary rises to loop height position,pad,lead,45,Capillary rises to loop height position,pad,lead,46,Capillary rises to loop height position,pad,lead,47,Capillary rises to loop height position,pad,lead,48,Capillary rises to loop height position,pad,lead,49,Capillary rises to loop height positio
11、n,pad,lead,RH,50,Formation of a loop,pad,lead,RD (Reverse Distance),51,Formation of a loop,pad,lead,52,pad,lead,53,pad,lead,Calculated Wire Length,WIRE CLAMP CLOSE,54,pad,lead,Calculated Wire Length,55,pad,lead,SEARCH DELAY,56,pad,lead,TRAJECTORY,57,pad,lead,TRAJECTORY,58,pad,lead,TRAJECTORY,59,pad,
12、lead,TRAJECTORY,60,pad,lead,TRAJECTORY,61,pad,lead,TRAJECTORY,62,pad,lead,TRAJECTORY,63,pad,lead,TRAJECTORY,64,pad,lead,TRAJECTORY,65,pad,lead,TRAJECTORY,66,pad,lead,2nd Search Height,Search Speed 2,Search Tol 2,67,pad,lead,Search Speed 2,Search Tol 2,68,pad,lead,Search Speed 2,Search Tol 2,69,Forma
13、tion of a second bond,pad,lead,heat,70,Formation of a second bond Contact,pad,lead,heat,heat,71,pad,lead,heat,heat,Formation of a second bond Base,72,pad,lead,73,pad,lead,74,pad,lead,75,pad,lead,Tail length,76,pad,lead,77,pad,lead,78,pad,lead,Disconnection of the tail,79,pad,lead,Disconnection of the tail,80,pad,lead,Formation of a new free air ball,
