1、CMOS工艺器件结构,CMOS工艺中常用的元器件,MOSFET (hv or lv ) PMOS NMOS NMOS_dnw NMOS_native RESISTOR CAPACITANCE DIODE BIPOLAR INDUCTOR,一、MOSFET,Nmos 版图,Nmos 剖面图,NMOSFET 版图和结构,一、MOSFET,Nmos _na版图,Nmos_na 剖面图,NMOS_NA 版图和结构,一、MOSFET,Nmos_dnw 版图,Nmos_dnw 剖面图,NMOS_dnw 版图和结构,一、MOSFET,Pmos 版图,Pmos 剖面图,PMOSFET 版图和结构,二、RESI
2、STOR,Poly resistor 版图,Poly resistor 剖面图,Poly resistor 版图和结构,二、RESISTOR,nwell resistor 版图,nwell resistor 剖面图,nwell resistor 版图和结构,二、RESISTOR,普通poly resistor 版图,扩散电阻版图,Others resistor版图和结构,三、CAPACITANCE,MIM cap 版图,MIM版图和结构,三、CAPACITANCE,MOM cap 版图,MOM版图和结构,三、CAPACITANCE,VAR cap 版图,VARACTOR版图和结构,VAR cap 剖面图,三、CAPACITANCE,MOS管做电容示意图,MOS CAP版图和结构,四、DIODE,DIODE 版图,PSD/NWELL版图和结构,DIODE 剖面图,四、DIODE,DIODE 版图,PSD/NWELL版图和结构,DIODE 剖面图,五、BIPOLAR（BJT）,横向BJT（pnp）版图和结构,DIODE 版图及对应剖面图,六、INDUCTOR,INDUCTOR版图和结构,INDUCTOR版图,目前基本能用到的都是metal做的inductor，务必选用PDK中cell，切勿修改。,谢谢！,
