1、TLE202x, TLE202xA, TLE202xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20021POST OFFICE BOX 655303 DALLAS, TEXAS 75265C0068 Supply Current . . . 300 A MaxC0068 High Unity-Gain Bandwidth .2 MHz TypC0068 High Slew Rate . . . 0.45 V/s M
2、inC0068 Supply-Current Change Over Military TempRange .10 A Typ at VCC = 15 VC0068 Specified for Both 5-V Single-Supply and15-V OperationC0068 Phase-Reversal ProtectionC0068 High Open-Loop Gain . . . 6.5 V/V(136 dB) TypC0068 Low Offset Voltage . . . 100 V MaxC0068 Offset Voltage Drift With Time0.005
3、 V/mo TypC0068 Low Input Bias Current . . . 50 nA MaxC0068 Low Noise Voltage . . . 19 nV/Hz TypdescriptionThe TLE202x, TLE202xA, and TLE202xB devices are precision, high-speed, low-power operational amplifiersusing a new Texas Instruments Excalibur process. These devices combine the best features of
4、 the OP21 withhighly improved slew rate and unity-gain bandwidth.The complementary bipolar Excalibur process utilizes isolated vertical pnp transistors that yield dramaticimprovement in unity-gain bandwidth and slew rate over similar devices.The addition of a bias circuit in conjunction with this pr
5、ocess results in extremely stable parameters with bothtime and temperature. This means that a precision device remains a precision device even with changes intemperature and over years of use.This combination of excellent dc performance with a common-mode input voltage range that includes thenegativ
6、e rail makes these devices the ideal choice for low-level signal conditioning applications in eithersingle-supply or split-supply configurations. In addition, these devices offer phase-reversal protection circuitrythat eliminates an unexpected change in output states when one of the inputs goes belo
7、w the negative supplyrail.A variety of available options includes small-outline and chip-carrier versions for high-density systemsapplications.The C-suffix devices are characterized for operation from 0C to 70C. The I-suffix devices are characterizedfor operation from 40C to 85C. The M-suffix device
8、s are characterized for operation over the full militarytemperature range of 55C to 125C.Copyright 2002, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production proc
9、essing does not necessarily includetesting of all parameters.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.TLE202x, TLE202x
10、A, TLE202xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20022 POST OFFICE BOX 655303 DALLAS, TEXAS 75265TLE2021 AVAILABLE OPTIONSPACKAGED DEVICESCHIPTAVIOmaxAT 25CSMALLOUTLINE(D)SSOP(DB)CHIPCARRIER(FK)CERAMIC DIP(JG)PLASTIC DIP(P)TSSO
11、P(PW)FORM(Y)0C to 200 V TLE2021ACDTLE2021CDBLETLE2021ACP 70C 500 V TLE2021CD TLE2021CPTLE2021CPWLE TLE2021Y40Cto200 V TLE2021AIDTLE2021AIPto85C500 V TLE2021ID TLE2021IP 55C 100 V TLE2021BMFK TLE2021BMJG to 200 V TLE2021AMD TLE2021AMFK TLE2021AMJG TLE2021AMP 125C 500 V TLE2021MD TLE2021MFK TLE2021MJG
12、 TLE2021MPThe D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).The DB and PW packages are only available left-end taped and reeled.Chip forms are tested at 25C only.TLE2022 AVAILABLE OPTIONSPACKAGED DEVICESCHIPTAVIOmaxAT 25CSMALLOUTLINE
13、(D)SSOP(DB)CHIPCARRIER(FK)CERAMICDIP(JG)PLASTICDIP(P)TSSOP(PW)FORM(Y)0Cto150 V300 VTLE2022BCDTLE2022ACDTLE2022ACPto70C500 V TLE2022CDTLE2022CDBLE TLE2022CPTLE2022CPWLE TLE2022Y40Cto150 V300 VTLE2022BIDTLE2022AIDTLE2022AIPto85C500 V TLE2022ID TLE2022IP 55C 150 V TLE2022BMJG to150 300 V TLE2022AMD TLE
14、2022AMFK TLE2022AMJG TLE2022AMP 125C 500 V TLE2022MD TLE2022MFK TLE2022MJG TLE2022MPThe D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR).The DB and PW packages are only available left-end taped and reeled.Chip forms are tested at 25C on
15、ly.TLE2024 AVAILABLE OPTIONSPACKAGED DEVICESCHIPTAVIOmaxAT 25CSMALLOUTLINE(DW)CHIPCARRIER(FK)CERAMICDIP(J)PLASTICDIP(N)FORM(Y)500 V TLE2024BCDW TLE2024BCN 0C to 70C500 750 V TLE2024ACDW TLE2024ACN 1000 V TLE2024CDW TLE2024CN TLE2024Y500 V TLE2024BIDW TLE2024BIN40C to 85C500 750 V TLE2024AIDW TLE2024
16、AIN 1000 V TLE2024IDW TLE2024IN500 V TLE2024BMDW TLE2024BMFK TLE2024BMJ TLE2024BMN55C to 125C 750 V TLE2024AMDW TLE2024AMFK TLE2024AMJ TLE2024AMN 1000 V TLE2024MDW TLE2024MFK TLE2024MJ TLE2024MNChip forms are tested at 25C only.TLE202x, TLE202xA, TLE202xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PREC
17、ISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20023POST OFFICE BOX 655303 DALLAS, TEXAS 7526512348765OFFSET N1ININ+VCC /GNDNCVCC+OUTOFFSET N2NC No internal connection3212019910111213456781817161514NCVCC+NCOUTNCNCINNCIN+NCTLE2021FK PACKAGE(TOP VIEW)NC OFFSETN1NCNCNCNCGNDNCOFFSETN2
18、NCCCV/TLE2021D, DB, JG, P, OR PW PACKAGE(TOP VIEW)123487651OUT1IN1IN+VCC /GNDVCC+2OUT2IN2IN+D, DB, JG, P, OR PW PACKAGE(TOP VIEW)NC No internal connection3212019910111213456781817161514NC2OUTNC2IN NCNC1IN NC1IN +NCFK PACKAGE(TOP VIEW)NC 1OUT NCNCNCNCGNDNC2IN +CCV/CC+VTLE202x, TLE202xA, TLE202xB, TLE
19、202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20024 POST OFFICE BOX 655303 DALLAS, TEXAS 752651234 56781615141312111091OUT1IN1IN+VCC+2IN+2IN2OUTNC4OUT4IN4IN+VCC /GND3IN+3IN3OUTNCDW PACKAGE(TOP VIEW)3 2 1 20 199101112134567818171615144IN+NCV
20、CC/GNDNC3IN+1IN+NCVCC+NC2IN+1IN 1OUT NC3OUT3IN 4OUT 4IN 2IN 2OUTNCNC No internal connection1234 5671413121110981OUT1IN1IN+VCC+2IN+2IN2OUT4OUT4IN4IN+VCC/GND3IN+3IN3OUTFK PACKAGE(TOP VIEW)J OR N PACKAGE(TOP VIEW)TLE2021Y chip informationThis chip, when properly assembled, display characteristics simil
21、ar to the TLE2021. Thermal compression orultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted withconductive epoxy or a gold-silicon preform.BONDING PAD ASSIGNMENTSCHIP THICKNESS: 15 MILS TYPICALBONDING PADS: 4 4 MILS MINIMUMTJmax= 150CTOLERANCES ARE 10%.ALL DI
22、MENSIONS ARE IN MILS.PIN (4) IS INTERNALLY CONNECTEDTO BACKSIDE OF CHIP.+OUTIN+INVCC+(7)(3)(2)(6)(4)VCC/GND(1)(5)OFFSET N1OFFSET N27854(1)(2) (3)(4)(5)(6)(7)TLE202x, TLE202xA, TLE202xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20025
23、POST OFFICE BOX 655303 DALLAS, TEXAS 75265TLE2022Y chip informationThis chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression orultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted withconductive epoxy or a gold-silicon
24、 preform.BONDING PAD ASSIGNMENTSCHIP THICKNESS: 15 MILS TYPICALBONDING PADS: 4 4 MILS MINIMUMTJmax = 150CTOLERANCES ARE 10%.ALL DIMENSIONS ARE IN MILS.PIN (4) IS INTERNALLY CONNECTEDTOBACKSIDEOFCHIP.+OUTIN+INVCC+(8)(6)(3)(2)(5)(1)+(7)IN+INOUT(4)VCC8086(1)(2)(3)(4)(5)(6)(7)(8)TLE202x, TLE202xA, TLE20
25、2xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20026 POST OFFICE BOX 655303 DALLAS, TEXAS 75265TLE2024Y chip informationThis chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression orultras
26、onic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted withconductive epoxy or a gold-silicon preform.BONDING PAD ASSIGNMENTSCHIP THICKNESS: 15 MILS TYPICALBONDING PADS: 4 4 MILS MINIMUMTJmax = 150CTOLERANCES ARE 10%.ALL DIMENSIONS ARE IN MILS.PIN (11) IS INTERNALLY CO
27、NNECTEDTOBACKSIDEOFCHIP.+1OUT1IN+1INVCC+(4)(6)(3)(2)(5)(1)+(7)2IN+2IN2OUT(11)VCC/GND+3OUT2IN+3IN(13)(10)(9)(12)(8)+(14)4OUT4IN+4IN100140TLE202x, TLE202xA, TLE202xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20027POST OFFICE BOX 65530
28、3 DALLAS, TEXAS 75265equivalent schematic (each amplifier)IN Q23 Q25Q1Q2Q3Q4Q5Q6Q7Q8Q9Q10Q11Q12Q13Q14Q15Q16Q17Q18Q19Q20Q21Q22Q24Q26Q27Q28Q29Q30Q31Q32Q33Q34Q35Q36Q37Q38Q39Q40D1 D2D3D4IN +OUTOFFSET N1(see Note A)VCC+VCC/GNDC1R1R2R3R4R5C2R6R7C4C3OFFSET N2(see Note A)ACTUAL DEVICE COMPONENT COUNTCOMPONE
29、NT TLE2021 TLE2022 TLE2024Transistors 40 80 160Resistors 7 14 28Diodes 4 8 16Capacitors 4 8 16TLE202x, TLE202xA, TLE202xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONAL AMPLIFIERSSLOS191B FEBRUARY 1997 REVISED JANUARY 20028 POST OFFICE BOX 655303 DALLAS, TEXAS 75265absolute maximum rat
30、ings over operating free-air temperature range (unless otherwise noted)Supply voltage, VCC+(see Note 1) 20 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supply voltage, VCC(see Note 1) 20 V. . . . . . . . . . . . . . . . . . .
31、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage, VID(see Note 2) 0.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage range, VI(any input, see Note 1) VCC. . . . . . . . . . . .
32、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input current, II(each input) 1 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO(each output): TLE2021 20 mA. . . . . . . . . . .
33、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TLE2022 30 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TLE2024 40 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
34、otal current into VCC+80 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Total current out of VCC80 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35、. . . . . . . . . . Duration of short-circuit current at (or below) 25C (see Note 3) unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating
36、 free-air temperature range, TA: C suffix 0C to 70C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I suffix 40C to 85C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M suffix 55C to 125C. . . . . . . . . . . . . . . . . . . . . . . . . . . .
37、. . . . . . . . Storage temperature range, Tstg65C to 150C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Case temperature for 60 seconds, TC: FK package 260C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead
38、 temperature 1,6 mm (1/16 inch) from case for 10 seconds: D, DP, P, or PW package 260C. . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package 300C. . . . . . . . . . . . . . . . . . . . Stresses beyond those listed under “absolute maximum ratings” may cause permanent
39、 damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
40、.NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+, and VCC.2. Differential voltages are at IN+ with respect to IN. Excessive current flows if a differential input voltage in excess of approximately600 mV is applied between the inputs unless so
41、me limiting resistance is used.3. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximumdissipation rating is not exceeded.DISSIPATION RATING TABLEPACKAGETA 25CPOWER RATINGDERATING FACTORABOVE TA= 25CTA= 70CPOWER RATINGTA= 85CPOWER R
42、ATINGTA= 125CPOWER RATINGD8 725 mW 5.8 mW/C 464 mW 377 mW 145 mWDB8 525 mW 4.2 mW/C 336 mW DW16 1025 mW 8.2 mW/C 656 mW 533 mW 205 mWFK 1375 mW 11.0 mW/C 880 mW 715 mW 275 mWJ14 1375 mW 11.0 mW/C 880 mW 715 mW 275 mWJG8 1050 mW 8.4 mW/C 672 mW 546 mW 210 mWN14 1150 mW 9.2 mW/C 736 mW 598 mW 230 mWP8
43、 1000 mW 8.0 mW/C 640 mW 520 mW 200 mWPW8 525 mW 4.2 mW/C 336 mW recommended operating conditionsC SUFFIX I SUFFIX M SUFFIXUNITMIN MAX MIN MAX MIN MAXSupply voltage, VCC2 20 2 20 2 20 VCommon mode input voltage VICVCC= 5 V 0 3.5 0 3.2 0 3.2V- input , VCC= 15 V 15 13.5 15 13.2 15 13.2Operating free-a
44、ir temperature, TA0 70 40 85 55 125 CTLE202x, TLE202xA, TLE202xB, TLE202xYEXCALIBUR HIGH-SPEED LOW-POWER PRECISIONOPERATIONALAMPLIFIERSSLOS191B FEBRUARY1997 REVISED JANUARY2002POSTOFFICE BOX 655303 DALLAS, TEXAS 752659TLE2021 electrical characteristics at specified free-air temperature, VCC= 5 V (un
45、less otherwise noted)PARAMETER TEST CONDITIONS TTLE2021C TLE2021AC TLE2021BCUNIT AMIN TYP MAX MIN TYP MAX MIN TYP MAXVIOInput offset voltage25C 120 600 100 300 80 200VInput Full range 850 600 300VIOTemperature coefficient of input offset voltageFull range 2 2 2 V/CInput offset voltage long-term drif
46、t(see Note 4)VIC= 0, RS= 50 25C 0.005 0.005 0.005 V/moIIOInput offset current,25C 0.2 6 0.2 6 0.2 6nAInput Full range 10 10 10IIBInput bias current25C 25 70 25 70 25 70nAInput Full range 90 90 90VICRCommon mode input voltage range RS=5025C0to3.5 0.3to40to3.5 0.3to40to3.5 0.3to4V- input = 50 Full ran
47、ge0to3.50to3.50to3.5VOHHigh level output voltage25C 4 4.3 4 4.3 4 4.3V- output RL=10kFull range 3.9 3.9 3.9VOLLow level output voltage= 10 k25C 0.7 0.8 0.7 0.8 0.7 0.8V- output Full range 0.85 0.85 0.85AVDLarge-signal differential VO= 1.4 V to 4 V,25C 0.3 1.5 0.3 1.5 0.3 1.5V/Vggvoltage amplificatio
48、n RL= 10 kFull range 0.3 0.3 0.3CMRR Common mode rejection ratioVIC= VICRmin,25C 85 110 85 110 85 110dB- ,RS= 50 Full range 80 80 80kSVRSupply-voltage rejection ratioVCC=5Vto30V25C 105 120 105 120 105 120dBygj(VCC/VIO)= 5 V to 30 VFull range 100 100 100ICCSupply current25C 200 300 200 300 200 300ASupply VO= 2 5 V No loadFull range 300 300 300ICCSupply-current change over operating temperature range. , Full range 5 5 5 AFull range is 0C to 70C.NOTE 4: Typical values are based on the input offset voltage shift observed thro
