1、Advanced Circuit Materials Division100 S. Roosevelt Avenue, Chandler, AZ 85226Tel: 480-961-1382 Fax: 480-961-4533 Data SheetRO4400Series Prepreg Data Sheet RO4450Band RO4450FPrepregRO4000dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a perfo
2、rmance upgrade of standard FR-4 multi-layer designs. RO4003C, RO4350B, and RO4000 LoProglass reinforced hydrocarbon/ceramic laminates have been used in layers where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. FR-4 cores
3、 and prepreg are still commonly used to inexpensively form less critical signal layers.The RO4400prepreg family is comprised of four grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with either RO4003C, RO4350B or RO4000 LoPro laminates. A high post-c
4、ure Tg (280C / 536F ) makes RO4400 series prepreg an excellent choice for multi-layers requiring sequential laminations as fully cured RO4400 prepregs are capable of handling multiple lamination cycles. In addition, FR-4 compatible bond requirements (177C/350F) permit RO4400 prepreg and low flow FR-
5、4 prepreg to be combined into non-homogenous multi-layer constructions using a single bond cycle.RO4450Fprepreg has demonstrated improvement in lateral flow capability, and is becoming the first choice for new designs or as a replacement in designs that have difficult fill requirements. Each of the
6、RO4450B and RO4450F prepregs are recognized by Underwriter Laboratories with the UL-94 flame rating, and are compatible with lead-free processes. Data SheetThe information contained in this data sheet and processing guide is intended to assist you in designing with Rogers circuit materials and prepr
7、eg. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown on this data sheet and processing guide will be achieved by a user for a particular purpose. The user is responsib
8、le for determining the suitability of Rogers circuit materials and prepreg for each application. Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent o
9、n the circuit design. Although Rogers high frequency materials have been used successfully in innumerable applications and reports of oxidation resulting in performance problems are extremely rare, Rogers recommends that the customer evaluate each material and design combination to determine fitness
10、 for use over the entire life of the end product. These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.The world runs better with Rogers. and the Rogers logo are licensed tra
11、demarks of Rogers Corporation.RO4000, RO4400, RO4003C, RO4350B, RO4450B, RO4450F and LoPro are licensed trademarks of Rogers Corporation. 1999, 2003, 2004, 2005, 2006, 2007, 2008, 2009, 2010, 2011, 2012 Rogers Corporation, Printed in U.S.A, All rights reserved.Revised 01/30/2012 -0112-CC Publication
12、 #92-150Rogers UL file number is E102763B.Typical Values RO4450B, RO4450F, PrepregPROPERTYTYPICAL VALUESDIRECTION UNITS CONDITION TEST METHODRO4450B RO4450FThickness 3.6 (0.91) 4 (0.101) 4 (0.101) Z mils (mm) - -Dielectric Constant , er3.30 0.05 3.54 0.05 3.52 0.05 Z - 10GHz - 23CIPC-TM-650 2.5.5.5D
13、issipation Factor, tan d0.004 0.004 0.004 Z - 10GHz-23CIPC-TM-650 2.5.5.5Dielectric Strength 1000 1000 1000 Z V/mil 23C/50% RHIPC-TM-650 2.5.6Volume Resistivity9.26 X 1079.26 X 1078.93 X 108- Mcm 23C/50% RHIPC-TM-650 2.5.17.1Surface Resistivity3.82 X 1073.82 X 1071.03 X 107X,Y M 23C/50% RHIPC-TM-650
14、 2.5.17.1Thermal Conductivity0.60 0.60 0.65 Z W/m/K 80C ASTM C518Moisture Absorption0.010 0.05 0.09 - %48 hrs immersion 0.060” sample temperature 50CASTM D570Tg 280 280 280 - C TMA-60C - 300C 10C/minIPC-TM-650 2.4.24Td 390 390 390 - C TGA ASTM D3850Density 1.80 1.86 1.83 - gm/cm323C ASTM D792Copper
15、Adhesion4.0 (0.70) 4.9 (0.86) 4.0 (0.70) Zpli (N/mm) oz. EDCAfter Solder FloatIPC-TM-650 2.4.8Coefficient of Thermal Expansion191760191750191750XYZppm/C -55 to 280CIPC-TM-650 2.4.41Color White White White - - - -Flammability V-0 V-0 V-0 UL94Lead-Free Process CompatibleYes Yes YesTypical values are a
16、 representation of an average value for the population of the property. For specification values contact Rogers Corporation.STANDARD THICKNESS: STANDARD SIZE:RO4450B, 0.0036 (0.091mm), 0.004, (0.101mm) RO4450F 0.0040” (0.101mm)24X18” Sheets (610mm X 457mm) Contact Customer Service for other available sizes.
