1、硅基光波导：走向超大规模光电子集成龙运2014/5/29OUTLINE 一、背景 二、器件 三、集成 四、总结2014/5/29一、背景1961The First Planar Integrated Circuit 1971Intel 4004 Microprocessor 2001Intel Pentium (IV) MicroprocessorIC的启发Lorenzo Pavesi, Lecture: Introduction to silicon photonics, Silicon Photonics PhD course prepared within FP7-224312 ,Hel
2、ios project,2010 2014/5/29一、背景光通信发展的需求大势所趋2014年5月21日，中国光网络研讨会摩尔定律只适用于分组、交换矩阵、存储等电域技术，但不合适以手工为主的光通信技术。一个典型1000公里的长途系统中，光域成本占比将从45%提升到2015年的80%以上。一个典型80100G、长度1350公里波分系统，光域成本约占75%。而在光域成本中，光器件占比90%，相当于总占比约70%。一个100G核心路由器，光器件成本约占60%。硅光子技术将成为重要突破方向，通信是硅光子技术的早期应用领域，韦乐平说，正如历史上的晶体管、集成电路、激光器等一样，通信由于其高技术属性往往成
3、为新技术的早期应用领域。然后随着技术和工艺的成熟再扩展至大众消费领域，形成更大的规模，进一步降低成本，再促进其在通信领域的普及，形成技术的良性循环。中国电信总工程师韦乐平http:/ T. Reed et al., Lecture: Silicon Photonics Waveguides, Silicon Photonics PhD course prepared within FP7-224312 Helios project,2010 2014/5/29一、背景从塑料光纤到硅基光波导FiberIntegrated waveguide2014/5/29一、背景SOI、制备工艺显影SiO2S
4、iSiSiO2SiSiPhotoresist匀胶 曝光SiO2SiSiSiO2SiSi 刻蚀SiO2SiSiSiO2SiSi去胶2014/5/29二、器件从波导到器件Optical sourceRF Passive devicesModulator Receiver2014/5/29二、器件Devicespassive devicesFukuda et al., OE (2006)Coupler Multimode interference coupler Y-junctionW.Bogaerts et al. JSTQE, 2010L. Xiang et al., JSTQE2013.Arr
5、ay waveguide grating MicroringJ.Dong et al., PJ, 2013.T.Yang et al., Sci. Rep., 2014.Microdisk2014/5/29二、器件DeviceslaserRong, Haisheng, et al. “A continuous-wave Raman silicon laser.“ Nature 433.7027 (2005): 725-728.2014/5/29二、器件DeviceslaserTakahashi, Yasushi, et al. “A micrometre-scale Raman silicon
6、 laser with a microwatt threshold.“Nature 498.7455 (2013): 470-474.2014/5/29二、器件DeviceslaserGunther Roelkens , Lecture: Hybrid III- V/silicon light sources, Silicon Photonics PhD course prepared within FP7-224312 Helios project,2010 Tseng, Ricky, et al. “Laser Integration with CMOS Assembly Process
7、for Si Photonics.“ Optical Fiber Communication Conference. Optical Society of America, 2014.2014/5/29二、器件DevicesmodulatorXu Q, Schmidt B, Pradhan S, et al. Micrometre-scale silicon electro-optic modulator. Nature, 2005, 435(7040): 325-327. 2014/5/29二、器件DevicesmodulatorPantouvaki, Marianna, et al. “8
8、x14Gb/s Si Ring WDM Modulator Array with Integrated Tungsten Heaters and Ge Monitor Photodetectors.“ Optical Fiber Communication Conference. Optical Society of America, 2014.2014/5/29二、器件DevicesReceiverAssefa, Solomon, Fengnian Xia, and YuriiA. Vlasov. “Reinventing germanium avalanche photodetector
9、for nanophotonic on-chip optical interconnects.“Nature464.7285 (2010): 80-84.2014/5/29二、器件DevicesReceiverDe Heyn, Peter, et al. “Polarization-Insensitive 5x20Gb/s WDM Ge Receiver using Compact Si Ring Filters with Collective Thermal Tuning.“ Optical Fiber Communication Conference. Optical Society of
10、 America, 2014.2014/5/29三、集成Yurii Vlasov, Silicon photonics for next generation computing systems, IBM Research Report, 2008 2014/5/29三、集成Yurii Vlasov, Silicon photonics for next generation computing systems, IBM Research Report, 2010 2014/5/29三、集成Intel corporation, The 50 Gbps Si Photonics Link, 英特
11、尔讲义, 20102014/5/29三、集成Intel corporation, The 50 Gbps Si Photonics Link, 英特尔讲义, 20102014/5/29三、集成Shen, Po-Kuan, et al. “On-Chip Optical Interconnects Integrated with Laser and PhotodetectorUsing Three-Dimensional Silicon Waveguides.“ Optical Fiber Communication Conference. Optical Society of America, 2014.最新进展2014/5/29三、集成Doerr, Christopher R., et al. “Single-Chip Silicon Photonics 100-Gb/s Coherent Transceiver.“ Optical Fiber Communication Conference. Optical Society of America, 2014.最新进展：2014 OFCPDP，Acacia Communications 展示单片集成100G相干收发机模块2014/5/29三、集成令人兴奋的时代http:/ You!A view of sb.s back.
