1、CCL Technical Dept., Electronic Materials Div.Nan Ya Plastics CorporationTAIWAN,Nan Ya MultilayerPCB Laminates,Environmental Protection,Signal Speed&Integrity,Reliability,Smaller Form Factor,PCB TechTrends,Build up/HDI,Phosphorous Free,Impedance Control,Narrower LineSpacing,Flexible,Embedded Passive
2、s,High Layer Count,Low Dk/Low Loss,Hi Tg,Insulation,Low CTE,Halogen Free,Low Water Absorption,CAF-Resistant,產品開發與應用,Lead Free Compatible,NP-200 (BT Grade), NP-180F (Hi Tg & Low CTE), NP-175(F) NP-155(F), NP-170, NP-150, NP-140M(Low Tg/Hi Td), Anti-CAF Materials, High CTI FR4, NPG NPGN-150NPG-170NPGN
3、-170, NPX-200 (For Substrates), Bendable CCL, Laser Prepreg, RCC,2 mil & 3 mil Cores,Ultra thin glass yarn1037,Embedded Capacitance,NPLDII & Low Dk glass,南亞產品列表,TG,Tg by DSC Suitable for Lead Free Optional for Lead Free NPG(Halogen Free),NPG-200,NPG-170,NP-LDII,NP-175/FNP-170,NP-155/FNP-150,FR-4 D/S
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6、O,印刷電路板(PCB) 應用,NP-180,RCCLaser P.P,移动电话HDI产品,CEM-1CEM-3,电源供应器，监视器，电视游戏,NP-140MNP-140,個人電腦, 筆記本電腦,個人電腦外設,FR-4,個人電腦, 筆記本電腦 ,個人電腦外設,NP-155(F)NP-150,個人電腦,笔记本电脑 PCMCIA卡,NPGNNPG,個人電腦& 筆記本電腦磁盤驅動器,NPG-180,BGA, CSP, 網絡服務器,NP-200,BGA, CSP,BGA, CSP,NPG-200,NP-LD,基站,NP-175(F)NP-170,通信服務器,BGA, CSP, 汽車網絡服務器,“無鉛”
7、對元件組裝影響,無鉛組裝之焊錫材料熔點更高回流焊過程有更高的溫度曲線,Soak time,Ramp,-,up rate,Lead free reflow (SnAgCu),Tin/Lead(63/37) reflow,迴流焊溫度曲線比較,T:30-44,T:20-30Peak Temp,Time above liquidus(TAL),50,0,100,150,200,250,Melting point,LF Melting point,高耐熱性(Br-樹脂)覆銅板產品系列,NP-150,NP-200,NP-180,TG(),NP-140,200,180,175,150,140,BT Lami
8、nate,FR-5 Grade,Medium Tg FR-4,FR-4,NP-180(F),NP-175 NP-175F,NP-155 NP-155F,NP-140 Modify(New),High Thermal Stability Material,NP-170,High Tg FR-4,FR-4, NP-155F,NP-175F 特性比對,IPC 規范 vs Nan Ya 材料,Rigid construction: 4 ply 7628NPG: “G” for Green (HF) Materials,南亚各系列无卤材料特性比較,HATS冷热冲击测试结果,Test Condition:-40-145 /1000 cyclesSample:12-layer test vehicle,热膨胀特性,线路板加工之影响,印刷线路板加工条件之建议,NPG&NPGN-150鑽孔比對測試,钻头磨耗比较,Unit: lb/in,无卤材料内层黑棕化接着强度比较,無鹵材性能比較表-CCL,無鹵材性能比較表-PCB,南亞無鹵材市場應用狀況,謝謝指教,http:/.tw,
