1、This document and information herein is the property of USI and all unauthorized use and reproduction is prohibited.Copyright by Universal Scientific Industrial Co., Ltd.機密等級: 機密Confidential Level: Confidential USI Controlled DocumentDocument Title(文件名稱) :X-Ray fluorescence test specification(X 射線螢光
2、光譜儀(XRF)檢驗規範)Document Number(文件編號): AT-0801-M427Revision(文件版本): A6Revise Date: 6/26/2009Prepared by(撰寫者): Edwin Huang 黃基泉Create by which Unit(制定單位 ) : CQM/GRM/GDAG-0801-M006-F2 Rev.:A1This document and information herein is the property of USI and all unauthorized use and reproduction is prohibited.
3、Copyright by Universal Scientific Industrial Co., Ltd.Amendment RecordsItem: Date: Revision: Page: Change Description: Changed by:1 03/31/2005 A2 6,7 1.Delete the Cr from the item of XRF test.2.Add remark.Eric Chang2 04/10/2006 A3 7 1.Add remark 3 Eric Chang3 04/10/2006 A3 6 包裝材料的測試值修改為: 鉛+汞+ 鎘+铬需小於
4、 100ppm,其中需鎘小於 5ppmEric Chang4 05/05/2006 A1 All Coding change from TT-0801-Q095 to TT-0801-M401Eric Chang5 05/05/2006 A1 6,7 1. 修改附件一 XRF 測試零件及產品類別之有害物質限值表規格之 Pb, Cr, Hg: 700ppm，增加 Cd:60ppm 之管制2. 刪除 Remark 對 Cr 暫不設定管制上限之規定Eric Chang607/05/2006 A1 All1. Document coding change from TT-0801-M401-A1 to
5、 AT-0801-M427-A1.2. Add the purpose and scope.Ken Ke柯炤榕7 11/30/2006 A2 2,4,111. Omit that this program is practicable in Taiwan and China sites.2. Modify Method 3: test point of PCB.3. Remove Package item on attachment 1: the Cd must under 5 ppm.Edwin Huang8 04/29/2008 A3 10,12 1. Add halogen free a
6、nd Spot test items.2. Delete Br controlling item. Edwin Huang9 08/20/2008 A4 1,10,12141. Add attention items for the tool management process of mechanical preparation.2. Add the flow chart and form for the management process to attachment.Edwin Huang10 09/04/2008 A5 1012Updated Attachment 1: EHS thr
7、eshold value of component type for XRF test Edwin Huang11 06/26/2009 A61011121. Add test method if customer request2. Delete” IQC wont control the threshold value of Cl3. Add “If the material composed of metal, glass and ceramic. The component wont be carried out halogen freeEdwin HuangThis document
8、 and information herein is the property of USI and all unauthorized use and reproduction is prohibited.Copyright by Universal Scientific Industrial Co., Ltd.144. Updated AT-0801-M427-F1 to A2 version.AG-0801-M006-F3 Rev.:A111Source Organization：USI / Taiwan DOC NO.: AT-0801-M427-A6Original Effective
9、 Date：03/31/2005X-Ray fluorescence test specificationX 射線螢光光譜儀(XRF) 檢驗規範 PAGE 1 of 14This document and information herein is the property of USI and all unauthorized use and reproduction is prohibited.Copyright by Universal Scientific Industrial Co., Ltd.目 錄Content一、 目的Purpose二、 適用範圍Scope三、 樣品檢測條件及方
10、法Test condition 裸導線; CABLE. cover of cable; nude of cable; cable700 60 700 700 630 630 1050Bonding wire, CONNECTOR, SOCKET, SWITCH, PIN HEADER, RELAY, SHORT PLUG, WIRE (SILVER), COPPER WIRE, FUSE, FACK, BATTERY.700 60 700 700 630 630 1050水晶振盪子、振盪器Crystal, Oscillator 700 60 700 700 630 630 1050陶磁基片類(
11、Ceramic) 700 60 700 700 630 630 1050電機材料類ElectricalMIRROR 類Method5700 60 700 700 630 630 1050化學材料類 ChemicalEPOXY RESIN,COATING POSDER,RTV,SOLVENT 等。 ICP, IC 測試 Test by ICP/IC 限值參閱綠色環保產品規格(AT-0801-R300) Threshold value refer to AT-0801-R300五金材料類 Metallic五金類材料，包括所有沖壓、壓鑄及其電鍍、皮膜、表面塗裝及組立等之五金件。All of the
12、incoming metal part, include all stamping, die-casting and electroplate, wiper and assembly etc.Method 5 700 60 700 700 630 630 1050塑膠材料類Plastic所有一般進料之塑膠類材料，包括所有塑膠、橡膠及其組合件等。All of the incoming plastic part, include plastic, rubber and others assembly parts.Method 5 700 60 700 700 630 630 1050包裝材料類 P
13、ackage包裝類材料，包括所有彩盒、紙箱、棧板、保麗龍、EPE、塑膠袋、文件手冊及各種防靜電材料等。All of the incoming packaging includes color box, carton, pallet, EPS foam, EPE form, plastic bag, document manual and ESD material.Method 6鉛+汞+鎘+鉻之總量小於100ppm Pb+Hg+Cd+Cr 100ppmCd 5ppm630 630 1050印刷電路板類 PCB單面板、雙面板及多層板印刷電路板。Single sided、double sided
14、and multilayer boardMethod 3 700 60 700 700 630 630 1050週邊材料類Periphery各種電源供應器、記憶體模組、輸出入設備、各式介面卡、PC卡等。 Power supply、memory module、in-out put instrument、interface cards、PC cards etc.Method 7 700 60 700 700 630 630 10501212Source Organization：USI / Taiwan DOC NO.: AT-0801-M427-A6Original Effective Date
15、：03/31/2005X-Ray fluorescence test specificationX 射線螢光光譜儀(XRF) 檢驗規範 PAGE 12 of 14This document and information herein is the property of USI and all unauthorized use and reproduction is prohibited.Copyright by Universal Scientific Industrial Co., Ltd.產品類-PCBA Product type-PCBA Method 8 700 60 700 70
16、0 630 630 1050Remark: (*)無鹵材料，於進料驗收報告單上會加註”HF”標示，以通知 IQC 執行 XRF 無鹵素檢驗。For Halogen Free components, There is a wording “HF” in incoming inspection sheet. IQC should to carry out halogen free inspection for the component.1.上述零件及產品類別如測試方法不適用時,請採行 method 9。If the above-mentioned test method cannot be us
17、ed on the materials and products, please follow method 9.2.上表中之晶片電阻本體含有玻璃纖維而含鉛量甚高，故此零件之鉛含量將暫不設定管制上限，但該材料仍須檢測。Due to lead in glass of Chip Resistor, lead (Pb) can be exempted from the requirement of above table, but the test results have to be kept.3.上表中之晶片電容及鐵蕊電感因本體含有陶瓷而含鉛量甚高，故此類零件之鉛含量,將暫不設定管制上限，但該材
18、料仍須檢測。Due to lead in electronic ceramic parts (e.g. Chip Capacitor & Ferrite bead), lead (Pb) can be exempted from the requirement of above table, but the test results have to be kept.4.上表中週邊材料若含有聚氯乙烯(PVC)電源線外被，其鉛含量不得大於 300ppm。If the above periphery type included the power cord made of PVC material.
19、 The threshold value of Lead substance is not over 300 ppm by XRF.5.上表中材料若為金屬、玻璃及陶瓷材質(如 USI 06 大類)，則不需實施無鹵素檢驗，但材質若為添加塑料、油墨等組成之複合材料，該材料仍需實施無鹵素檢驗。If the material compose of metal, glass and ceramic. The component wont be carried out halogen free inspection. Otherwise, Shall carry out halogen free insp
20、ection depend on “HF” indication.1313Source Organization：USI / Taiwan DOC NO.: AT-0801-M427-A6Original Effective Date：03/31/2005X-Ray fluorescence test specificationX 射線螢光光譜儀(XRF) 檢驗規範 PAGE 13 of 14This document and information herein is the property of USI and all unauthorized use and reproduction
21、is prohibited.Copyright by Universal Scientific Industrial Co., Ltd.附件二：拆解治工具管理流程Attachment 2: The management process for disassembly tools of the component.1414Source Organization：USI / Taiwan DOC NO.: AT-0801-M427-A6Original Effective Date：03/31/2005X-Ray fluorescence test specificationX 射線螢光光譜儀(X
22、RF) 檢驗規範 PAGE 14 of 14This document and information herein is the property of USI and all unauthorized use and reproduction is prohibited.Copyright by Universal Scientific Industrial Co., Ltd.附件三：XRF治工具季驗證紀錄表XRF治工具季驗證紀錄表 (AT-0801-M427-F1)，此表格僅供TW/SH/SZ sites 使用.Attachment 3: The record of disassembly tools in quarter inspection by XRF. (For TW/SH/SZ sites usage only)
