1、38 Printed Circuit Information The Research of Cause about Voids in Subsurface of FR-4 CCL Chen Xiaodong Li Weigang Lin Yijing Abstract The article introduces the disserve of subsurface imperfections voids of the FR-4 CCL, sums up the main reason of producing subsurface imperfections voids of the FR
2、-4 CCL through the systemic analysis and experi- ment validation, and brings forward some amend measure. Key words FR-4 CCL; suburface; voids; vacuum degree Copper Foil & Laminate39 Printed Circuit Information Summarization & Comment Copper Foil & Laminate Summarization & Comment 40 Printed Circuit Information Copper Foil & Laminate 41 Printed Circuit Information Summarization & Comment PCI m m PCI Copper Foil & Laminate
