1、0qFs# ?顾晔1 林雪春2 林峰2( 1. 2v, 8 2 g330029 2. / 3“, 8 g518055)K1 以环氧树脂为基体,配以固化剂a促进剂a混合填料, 研制了一种应用于电子元件贴装a液晶屏生产的150 e 固化单组分环氧胶b环氧树脂为Shell- 828, Shell- 1001和F- 51 3种环氧树脂的混合物100份,以594# 为固化剂( 12份) , 593# ( 3份)和TEA( 2份)为固化促进剂, 固化条件: 70 e 30 min+ 150 e 30 min,贮存期大于7个月b1oM 环氧树脂 单组分胶粘剂 促进剂 力学性能ms | T Q433. 4+
2、39 DS M A cI| 1001- 5922( 2003) 06- 0007- 03l : 2003- 04- 10Te:$ o, 1978 M 3, V 3b1 - T4y zTa P za 8l, T4 7?b W50 M 7 S, “0_la Z_?Z 2 th,T40 s j,7? b “ - T4 ?1 pt_:Fsa% aiza apZL 1b ?0 T4X0qa“ aA a; 3 2 , O p 9, -Es bS “ a ?0 T4 7? 3 6bS= 7?0 T4Z , X |MZ 7, 8 , “ - T4 G gbYV a%4 ,Shell- 828aF- 51aSh
3、ell- 10013 ,594#T%4, Y?593#T4,! BT4,i %s ? ),TV T4 ?r0qA V L 1 pb2 Ls2.1 1 L N , Shell- 828, T ,: 0. 52;Shell- 1001, T ,: 0. 51; F- 51, ZK ,: 0. 51;594#%4, 2(B-=JY) - 1, 3, 6,2- g0, Z K ;Y?( TEA) , AR, g k4;593#%4( RCH 2CH ( OH) CH2NH R1NH2 ) ,);2-Y- 4-J,:( EM I- 24) , AR,? k4K ;A , L i1bNDJ- 8STN,
4、Z N K ;XL- 100A k, k;DSC- 60 U N, SH IM ADZUb2.2 T4 | , ( ,F a %4aA , =n s ,b2.3 T4%Hq|T42Q70 e/%30 min,/%,4%VT4 HW% HWb%sY:110 ea130 ea150 e , HW lE( 1 g)b2.4 T4 ? %g M k j ,ZEnGB/ T 7124 ) 1986;180b 6 PET , j , k ?#ZEnGB/ T 2790 )1995b#7# T 2003,24(6) 3 T) 3.1 Z L%4594# B , :OCH2 CH2 OCH2 CH2 OB O
5、 CH2 CH2NCH3CH3 B . %4b %4M1, a a?lamala*a a za% ? , H KT 9 ,FsT48“%41 pbB594#%4% 0q/ ,K 0 5Wb7 OB %4 4594#8“ 3 AT 10bs aR4, P594#8“r%1 p 51 b4 3 Zb1 594#T%4; 2594#T%4, EMI - 244; 3 594#%4aTEAa593#4,sY Y5!z #A b 3 Z L1,150 e/ HW% HWbT V1 UbTab1. Effect of different curing agent oncuringof epoxy resi
6、nV1 %4F 8“%VY固化剂体系 添加量* /质量份 凝胶时间/ min 胶层固化时间/ min594# 9 57 176594# + EM I- 24 9+ 0. 5 72 195594# + T EA+ 593# 9+ 3+ 2 19 30* 100质量份树脂中的加入量,固化温度为150 ebLTV ,B594#%4M1,EM I- 24T4%48“ % HW, O L4 i ?Db48“EM I- 24c , ? %HW, i 9v bF4TEA593#%48“, 8“ % HW ( A ,%VT A Z2, ? /%1 pbDSCT4%V s,sY4B594#8“F4%8“%VbD
7、SC m /:Fig.1 DSC curves ofepoxy resin adhesivem1 T4DSCmm, aL594# 8“%Qb wLb b S191. 07 e ,b KvC212. 67 e ;7bL, TEA593#F PQ Sb 159. 03 e ,1B594#%8“ 32. 03 ebb Kv9M197. 65 eb % L4%CBbV TEA593#594#%QT Ab3.2 T4% ?#%Hq HW% HW NT4B/% 1Sb k 1a32%8“%/ % f b% -,70 e530 min%,E T4% HyQV 7 11 , kTnV2bTab. 2 Effe
8、ctof curingtemperatureoncuringofepoxy resinV2 %T4%Y固化温度/ e凝胶时间/ min 固化时间/ min594# 594# +TEA, 593# 594# 594# +T EA, 593#110 未凝胶 44 未固化 83130 未凝胶 25 未固化 33150 57 19 176 30Y 594#8“170 e/ ?30 min =%,7/E y %b L9?C,S =,F4594#8“110 e130 e H HW %, 150 e/ % HW ,7F 4594#8“110 150 e =, HW% HW Ah t b150 e H,T4
9、?30 min =%b#8#0qFs# ? ZHANJIE 2003, 24( 6) H28“T4 ? 1 bTnV3bTab.3 Mechanical property oftwo adhesivesV3 28“T4 ?固化温度/ e剪切强度/ MPa 180b剥离强度/ N#cm- 1594# 594# +T EA, 593# 594# 594# +TEA, 593#110 ) 2. 4 ) 12. 9130 ) 3. 2 ) 10. 1150 2. 5 2. 8 18. 4 22. 1170 2. 6 2. 4 21. 0 19. 4注:表中数据的破坏类型均为材料破坏bM%/, 28“T
10、 (v bF4%8“110150 eS =,%g M 9 ,i150 e HrKvb T ?9 AB594#8“T ?bT4%: 70 e 30 m in+150 e 30 minb3.3 T4i ?- 15 ea i7T4*ag M b kTnV4bTab.4 Storageproperty of adhesiveV4T4i ?贮存时间/月 外观黏度/Pa#s剪切强度/ MPa180b剥离强度/ N#cm- 10 未凝胶,无沉淀 75. 8 2. 8 22. 17 未凝胶,无沉淀 294. 5 2. 6 21. 1注:表中数据的破坏类型均为材料破坏bV4 V, 7T4 z ?, Og M M
11、 A,* 9F,C a4M, z T ?b4 ( 1) 594# .%48“F TEAa593#%4T%4, ? v8“%, T4/pa150 e/% P1 p, O zi ?T b( 2)T4 TeL,%: 70 e 30 min+ 150 e 30 minb ID1 A B.0 F T4# .T,2002, 23( 4) : 31 342 . T4.T, 2000, 21( 6) : 25 273 JP2001 2339384 JP2000 3196205 Daoqiang LU, C. P. Wong. Development of high perfor-mance surface m
12、ount condutive adhesives. 2000 ElectronicComponents and Technology Conference, 892 8986 Chris Perabo.; q T41o1 p.W / , 2002, 10: 48 517 l. CLD- 20#.ST4, 1999, 8( 2) : 39 418 .% T4. +, 2002, 21( 2) : 104 1069 . 3.:,2001. 290 29110 , I. / 8“%Q.W: v, 1997, 2( 2) : 121 12311 k, ,f,. 8%.j / , 2001( 3) :
13、10 12Development and study on epoxy adhesive for electric productsGU Ye1 LIN Xuechun2 LIN Feng 2( 1. College of environment and chem istry engineering, Nanchang University, Nanchang 330029;2. Department of Applied Biology, College of Shenzhen Ploytechnic, Shenzhen 518055)Abstract An one- component m
14、iddle temperature curable epoxy adhesive for using in SM T and LCD w asprepared, in which epoxy resin as basic m aterial was compouded w ith a curing agent, some curing accelerants( such as 593# and T EA) and a m ixed filler. T he composition of the adhesive w as as follows: 100 parts of a mix-ture
15、of Shell- 828, Shell- 1001 and F- 51, 12 parts of curing agent ( 594# ) , 3 parts of 593# and 2 parts ofT EA. T he curing condition was 70 e 30 min+ 150 e 30 min. Its storage life w as over 7 months.Keywords Epoxy resin One- com ponent adhesive Accelerant Mechanical property(编辑 李健民)#9# T 2003,24(6)
