1、1 Mentor Graphics U2U user conference CFD Accuracy Enhancement of Electronic System CAE/CFD Analysis Dev. Dept. Structure & Thermal Design Center Wistron Corporation 1CTA00 Iring Chiou Date : 2014-11-032 Product Line Notebook Electronic System (3C) Tablet Phone DT/AIO High Performance Thin & Light S
2、kin Component Thin & Light Communication Middle size Component High Performance Mobile Hand-Held PC3 Skin Temperature Accuracy Improvement Skin Temperature Accuracy Radiation Library System Impedance Mesh Quality NB/DT/AIO/Tablet. - Parts parameters (W, K) Database Collection NB/DT/AIO/Table - Colle
3、ct Study & collection Setting for boundary layer. Optimum between Accuracy & Solving time. Flow resistance study. - P-Q calibration. - Add extra flow resistance. Opening calibration. Q conduction = kA(T/x) Q convention = hA(T s -T ) Q radiation = A(T s 4 -T 4 ) Heat transfer Air Gap Air Gap Bottom c
4、ase Panel MB CPU Thermal module 往系統外熱傳 往系統內熱傳 往系統外熱傳 往系統內熱傳 -W , K - Impedance - Emissivity Improvement check (Introduction on last page) Study & SOP Calibration & fine-tune4 Library Collection(I)5 Library Collection(II) PCB Thermal Module Heat-Pipe Fan PQ 1. The temperature distribution of MB will
5、impact distribution of skin temperature. 2. Estimated Kz from Theory & Experiment(Follow ASTM 5470 測試規範) 1. Modified PQ Curve in free air condition. (Refer Intels document) 2. Calibrated conductivity of heat pipe a. The error come form soldering &different structure(Powder/composite/groove) Error ra
6、te decrease from 16.7% to 4.9% Error rate decrease from 26.7% to 4.2%6 Library Collection(III) Panel VRM Memory HDD 1. Decompose a. confirm Z-stacking of different vendor b. backlight power & LCD power 2. Calibrate conductivity of LCM Error rate decrease from 42.9% to 20% (Still on-going) 1. Confirm
7、 Input power a. different vendor & capacity b. different stacking type c. UMA/DIS d. different scenario Error rate decrease from 30.0% to 10.8% (Still on-going) 1. Confirm Input power a. different vendor & capacity b. different scenario c. UMA/DIS Error rate decrease from 25.0% to 5.9% 1. Decompose a. Calibrated conductivity of chock/mos b. Analyzed by “Taguchi-method” Error rate decrease from 13.8% to 6.9%
